Experimental investigation on CFRP milling by low power Q-switched Yb:YAG laser source

Author(s):  
S. Genna ◽  
F. Tagliaferri ◽  
I. Papa ◽  
C. Leone ◽  
B. Palumbo
1987 ◽  
Vol 40 (2) ◽  
pp. 157 ◽  
Author(s):  
IR Jones ◽  
MDE Turley ◽  
JE Wedding ◽  
G Durance ◽  
GR Hogg ◽  
...  

A rotamak device is described in which compact torus plasmas are generated using relatively low RF input powers (~ a few kW). Compact torus configurations are generated in both argon and hydrogen plasmas and are sustained for ~ 9 ms. These configurations appear to be grossly stable and show no tendency to disrupt even when subjected to large amplitude forced oscillations. A configuration incorporating a toroidal field is also investigated.


2014 ◽  
Vol 125 (6) ◽  
pp. 1323-1326
Author(s):  
D. Czylkowski ◽  
B. Hrycak ◽  
M. Jasiński ◽  
J. Mizeraczyk

2007 ◽  
Vol 19 (10) ◽  
pp. 744-746 ◽  
Author(s):  
S. K. Mondal ◽  
B. Roycroft ◽  
P. Lambkin ◽  
F. Peters ◽  
B. Corbett ◽  
...  
Keyword(s):  

2016 ◽  
Vol 856 ◽  
pp. 201-208 ◽  
Author(s):  
Georg Götz ◽  
Johannes Fink ◽  
Christoph Richter ◽  
Gunther Reinhart

The improvements of the format-flexibility as well as the resource and energy efficiency are important for the users and manufacturers of packaging machines. There is a positive interconnection of resource and energy efficiency with format-flexibility because e.g. the reduction of stand-by phases. To reach these goals, it is necessary to reduce the downtime and to increase the overall equipment effectiveness (OEE). The application of laser beam based processing technologies is very common in many different branches, e.g. automotive. One big advantage of the laser beam as a working tool is the high inherent flexibility. Different contours could be sealed and cut without any changeover by the use of flexible motion systems, e.g. deflection units or robots. However, there is a lack of use of laser based technologies in packaging machines. The focus of this paper is the experimental investigation of laser beam sealing and cutting with the same laser source. For this a 2 μm diode-pumped thulium fiber laser is used. Furthermore a flexible processing device will be shown and the practical use will be demonstrated.


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