Moment mapping of body-centered-cubic FexMn1−x alloy films on MgO(001)

2015 ◽  
Vol 117 (17) ◽  
pp. 17A721 ◽  
Author(s):  
Y. U. Idzerda ◽  
H. Bhatkar ◽  
E. Arenholz
Keyword(s):  
Body Centered Cubic ◽  
Alloy Films ◽  
Moment Mapping

scholarly journals The structure and mechanical properties of Cr-based Cr-Ti alloy films

2022 ◽  
Author(s):  
Gang Liu ◽  
Miao Wang ◽  
Jianjun Xu ◽  
Min Huang ◽  
Chen Wang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Metallic Glasses ◽  
First Principles ◽  
Ti Alloy ◽  
Body Centered Cubic ◽  
Alloy Films ◽  
Reduced Modulus ◽  
Cubic Structure ◽  
Rich Side ◽  
Ti Content

Abstract Previous studies have dealt with Cr and its alloy films that exhibit promising characteristics as surface modification layers for antiwear, anticorrosive, and decorative applications. However, the effect of Ti alloying on the structure and mechanical properties of Cr films has not been studied. This work aimed to the structure and mechanical properties of Cr-Ti alloy films in the Cr-rich side. To this end, pure Cr, Cr-6 at.% Ti, Cr-11 at.% Ti, Cr-16 at.% Ti, and Cr-21 at.% Ti alloy films were prepared by magnetron sputtering, and the structure and mechanical properties of the films were evaluated. The results indicated that all the films exhibited a Cr-based growth with body-centered cubic structure, and increasing the Ti content decreased the (110) orientation growth of Cr basis. Ti alloying increased the hardness of the films, while leaded to a monotonic decrease in the modulus of the films. The first-principles method was employed to demonstrate that the reduced modulus was determined by the Ti alloying degree, rather than the orientation evolution of the films. The analysis of H/E value suggested that the wear resistance of the films was improved by Ti alloying. The mechanical properties of present Cr-Ti alloy films, and other Cr-based alloy films or metallic glasses in publications were compared and discussed. We proposed that Ti alloying is a considerable way to explore advanced mechanical properties of Cr-based alloy films.

Voids in Irradiated Tungsten and Molybdenum

1969 ◽  
Vol 27 ◽  
pp. 190-191
Author(s):  
Robert C. Rau ◽  
Robert L. Ladd
Keyword(s):  
Melting Point ◽  
Fast Neutron ◽  
Neutron Irradiation ◽  
Elevated Temperatures ◽  
Irradiation Temperature ◽  
The Body ◽  
Face Centered Cubic ◽  
Body Centered Cubic ◽  
Cubic Metals ◽  
Face Centered

Recent studies have shown the presence of voids in several face-centered cubic metals after neutron irradiation at elevated temperatures. These voids were found when the irradiation temperature was above 0.3 Tm where Tm is the absolute melting point, and were ascribed to the agglomeration of lattice vacancies resulting from fast neutron generated displacement cascades. The present paper reports the existence of similar voids in the body-centered cubic metals tungsten and molybdenum.

Epitaxial Growth in Dislocation-Free Strained Alloy Films

2002 ◽  
Vol 715 ◽  
Author(s):  
Zhi-Feng Huang ◽  
Rashmi C. Desai
Keyword(s):  
Deposition Rate ◽  
Elastic Moduli ◽  
Composition Dependence ◽  
Critical Thickness ◽  
Lattice Misfit ◽  
Misfit Strain ◽  
Joint Stability ◽  
Alloy Films ◽  
The Stability ◽  
Stability Results

AbstractThe morphological and compositional instabilities in the heteroepitaxial strained alloy films have attracted intense interest from both experimentalists and theorists. To understand the mechanisms and properties for the generation of instabilities, we have developed a nonequilibrium, continuum model for the dislocation-free and coherent film systems. The early evolution processes of surface pro.les for both growing and postdeposition (non-growing) thin alloy films are studied through a linear stability analysis. We consider the coupling between top surface of the film and the underlying bulk, as well as the combination and interplay of different elastic effects. These e.ects are caused by filmsubstrate lattice misfit, composition dependence of film lattice constant (compositional stress), and composition dependence of both Young's and shear elastic moduli. The interplay of these factors as well as the growth temperature and deposition rate leads to rich and complicated stability results. For both the growing.lm and non-growing alloy free surface, we determine the stability conditions and diagrams for the system. These show the joint stability or instability for film morphology and compositional pro.les, as well as the asymmetry between tensile and compressive layers. The kinetic critical thickness for the onset of instability during.lm growth is also calculated, and its scaling behavior with respect to misfit strain and deposition rate determined. Our results have implications for real alloy growth systems such as SiGe and InGaAs, which agree with qualitative trends seen in recent experimental observations.

The formation of low temperature Cu3Si in Ag(Cu)/Si structure upon annealing and its effects on adhesion and resistivity

2003 ◽  
Vol 766 ◽  
Author(s):  
Sungjin Hong ◽  
Seob Lee ◽  
Yeonkyu Ko ◽  
Jaegab Lee
Keyword(s):  
Low Temperature ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Si Substrate ◽  
Copper Silicide ◽  
Alloy Films ◽  
Cu Alloy ◽  
Cu Film ◽  
Rapid Drop

AbstractThe annealing of Ag(40 at.% Cu) alloy films deposited on a Si substrate at 200 – 800 oC in vacuum has been conducted to investigate the formation of Cu3Si at the Ag-Si interface and its effects on adhesion and resistivity of Ag(Cu)/Si structure. Auger electron spectroscopy(AES) analysis showed that annealing at 200°C allowed a diffusion of Cu to the Si surface, leading to the significant reduction in Cu concentration in Ag(Cu) film and thus causing a rapid drop in resistivity. In addition, the segregated Cu to the Si surface reacts with Si, forming a continuous copper silicide at the Ag(Cu)/Si interface, which can contribute to an enhanced adhesion of Ag(Cu)/Si annealed at 200 oC. However, as the temperature increases above 300°C, the adhesion tends to decrease, which may be attributed to the agglomeration of copper silicide beginning at around 300°C.

Supramolecular Assembly of U(IV) Clusters and Superatoms

2020 ◽  
Author(s):  
Ian Colliard ◽  
Gregory Morrosin ◽  
Hans-Conrad zur Loye ◽  
May Nyman
Keyword(s):  
Quantum Dots ◽  
Supramolecular Assembly ◽  
Emergent Properties ◽  
Organic Media ◽  
Body Centered Cubic ◽  
Cluster Anions ◽  
Charge Balance ◽  
Interpenetrating Networks ◽  
Hierarchical Assembly ◽  
Two Parameters

Superatoms are nanometer-sized molecules or particles that can form ordered lattices, mimicking their atomic counterparts. Hierarchical assembly of superatoms gives rise to emergent properties in superlattices of quantum-dots, p-block clusters, and fullerenes. Here, we introduce a family of uranium-oxysulfate cluster anions whose hierarchical assembly in water is controlled by two parameters; acidity and the countercation. In acid, larger Ln<sup>III</sup> (Ln=La-Ho) link hexamer (U<sub>6</sub>) oxoclusters into body-centered cubic frameworks, while smaller Ln<sup>III</sup> (Ln=Er-Lu &Y) promote linking of fourteen U<sub>6</sub>-clusters into hollow superclusters (U<sub>84</sub> superatoms). U<sub>84</sub> assembles into superlattices including cubic-closest packed, body-centered cubic, and interpenetrating networks, bridged by interstitial countercations, and U<sub>6</sub>-clusters. Divalent transition metals (TM=Mn<sup>II </sup>and Zn<sup>II</sup>), with no added acid, charge-balance and promote the fusion of 10 U<sub>6</sub> and 10 U-monomers into a wheel–shaped cluster (U<sub>70</sub>). Dissolution of U<sub>70</sub> in organic media reveals (by small-angle Xray scattering) that differing supramolecular assemblies are accessed, controlled by TM-linking of U<sub>70</sub>-clusters. <br>

scholarly journals Irradiation Behaviors in BCC Multi-Component Alloys with Different Lattice Distortions

Metals ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 706
Author(s):  
Yue Su ◽  
Songqin Xia ◽  
Jia Huang ◽  
Qingyuan Liu ◽  
Haocheng Liu ◽  
...  
Keyword(s):  
Single Phase ◽  
Vacuum Arc ◽  
Face Centered Cubic ◽  
Body Centered Cubic ◽  
Chemical Complexity ◽  
Arc Melting ◽  
Vacuum Arc Melting ◽  
Lattice Distortions ◽  
Face Centered ◽  
Displacement Per Atom

Recently, the irradiation behaviors of multi-component alloys have stimulated an increasing interest due to their ability to suppress the growth of irradiation defects, though the mostly studied alloys are limited to face centered cubic (fcc) structured multi-component alloys. In this work, two single-phase body centered cubic (bcc) structured multi-component alloys (CrFeV, AlCrFeV) with different lattice distortions were prepared by vacuum arc melting, and the reference of α-Fe was also prepared. After 6 MeV Au ions irradiation to over 100 dpa (displacement per atom) at 500 °C, the bcc structured CrFeV and AlCrFeV exhibited significantly improved irradiation swelling resistance compared to α-Fe, especially AlCrFeV. The AlCrFeV alloy possesses superior swelling resistance, showing no voids compared to α-Fe and CrFeV alloy, and scarce irradiation softening appears in AlCrFeV. Owing to their chemical complexity, it is believed that the multi-component alloys under irradiation have more defect recombination and less damage accumulation. Accordingly, we discuss the origin of irradiation resistance and the Al effect in the studied bcc structured multi-component alloys.

First electrochemical synthesis of mesoporous RhNi alloy films for an alkali-mediated hydrogen evolution reaction

2021 ◽  
Vol 9 (5) ◽  
pp. 2754-2763
Author(s):  
Kenya Kani ◽  
Hyunsoo Lim ◽  
Andrew E. Whitten ◽  
Kathleen Wood ◽  
Anya J. E. Yago ◽  
...  
Keyword(s):  
Hydrogen Evolution ◽  
Hydrogen Evolution Reaction ◽  
Electrochemical Synthesis ◽  
Polymeric Micelles ◽  
Deposition Method ◽  
Alloy Films ◽  
Electrocatalytic Properties ◽  
Self Assembled

The mesoporous RhNi alloy films are synthesized by controlling the concentration of Rh precursor, applied potentials, and pH via the electrochemical co-deposition method with self-assembled polymeric micelles templates for enhancing electrocatalytic properties.

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