scholarly journals Reducing GaN-on-diamond interfacial thermal resistance for high power transistor applications

2015 ◽  
Vol 106 (11) ◽  
pp. 111906 ◽  
Author(s):  
Huarui Sun ◽  
Roland B. Simon ◽  
James W. Pomeroy ◽  
Daniel Francis ◽  
Firooz Faili ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
High Power ◽  
Interfacial Thermal Resistance ◽  
Power Transistor

Design Key Points for High Power LED Encapsulation

2013 ◽  
Vol 651 ◽  
pp. 706-709 ◽  
Author(s):  
Zhan Feng Zhao ◽  
Juan Ye
Keyword(s):  
Thermal Resistance ◽  
High Power ◽  
Interfacial Thermal Resistance ◽  
Chip Design ◽  
Optical Efficiency ◽  
Packaging Design ◽  
Materials Properties ◽  
Key Points ◽  
High Power Led ◽  
Efficiency And Reliability

LED performance was significantly improved because of the improvement of encapsulation design and materials properties. The design key points were reviewed in point view of optical, electrical, thermal, and reliability consideration. It was concluded that the packaging design should be simultaneously implemented with the chip design, integrally considering the optics, electrics, thermal, and reliability together. The interfacial thermal resistance and stress from packaging also play critical roles for the optical efficiency and reliability of packaged LED device.

CNT@NiO/natural rubber with excellent impedance matching and low interfacial thermal resistance toward flexible and heat-conducting microwave absorption applications

2021 ◽  
Author(s):  
Maofan Zhou ◽  
Gengping Wan ◽  
Pengpeng Mou ◽  
Shengjie Teng ◽  
Shiwei Lin ◽  
...  
Keyword(s):  
Natural Rubber ◽  
Thermal Resistance ◽  
Microwave Absorption ◽  
Impedance Matching ◽  
Interfacial Thermal Resistance ◽  
Heat Conducting ◽  
Rubber Composites ◽  
Natural Rubber Composites

Herein, CNT@NiO/natural rubber composites were fabricated to apply as flexible and heat-conducting microwave absorption materials.

A 4 GHz High Power Transistor - Design and Reliability

1973 ◽  
Author(s):  
P. Wang ◽  
J. Chen ◽  
P. Froess ◽  
S. Kakihana
Keyword(s):  
High Power ◽  
Power Transistor

scholarly journals Thermal Conductivity of Unidirectionally Aligned SiC Whisker Reinforced Al Alloy Matrix Composite with Interfacial Thermal Resistance

2005 ◽  
Vol 46 (2) ◽  
pp. 148-151 ◽  
Author(s):  
Yibin Xu ◽  
Yoshihisa Tanaka ◽  
Masaharu Murata ◽  
Kazushige Kamihira ◽  
Yukihiro Isoda ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Matrix Composite ◽  
Interfacial Thermal Resistance ◽  
Al Alloy ◽  
Alloy Matrix

Enhanced Thermal Conductivity of Composite Materials by Filling Sheet and Fiber Under Effect of Filler Contact

2021 ◽  
Author(s):  
Xiao-jian Wang ◽  
Liang-Bi Wang
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Composite Materials ◽  
Thermal Resistance ◽  
Percolation Threshold ◽  
Filler Content ◽  
Interfacial Thermal Resistance ◽  
Combined Effects ◽  
Enhanced Thermal Conductivity ◽  
The Ideal

Abstract The most common non-granular fillers are sheet and fiber. When they are distributed along the heat flux direction, the thermal conductivity of composite increases greatly. Meanwhile, the filler contact also has large effect on the thermal conductivity. However, the effect of filler contact on the thermal conductivity of composite with directional fillers has not been investigated. In this paper, the combined effects of filler contact, content and orientation are investigated. The results show that the effect of filler orientation on the thermal conductivity is greater than filler contact in low filler content, and exact opposite in high filler content. The effect of filler contact on fibrous and sheet fillers is far greater than cube and sphere fillers. This rule is affected by the filler contact. The filler content of 8% is the ideal percolation threshold of composite with fibrous and sheet filler. It is lower than cube filler and previous reports. The space for thermal conductivity growth of composite with directional filler is still very large. The effect of interfacial thermal resistance should be considered in predicting the thermal conductivity of composite under high Rc (>10-4).

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