Controlled removal of amorphous Se capping layer from a topological insulator

2014 ◽  
Vol 105 (24) ◽  
pp. 241605 ◽  
Author(s):  
Kumar Virwani ◽  
Sara E. Harrison ◽  
Aakash Pushp ◽  
Teya Topuria ◽  
Eugene Delenia ◽  
...  
2015 ◽  
Vol 5 (1) ◽  
Author(s):  
Jihwey Park ◽  
Yeong-Ah Soh ◽  
Gabriel Aeppli ◽  
Xiao Feng ◽  
Yunbo Ou ◽  
...  

Abstract Thin films of topological insulators are often capped with an insulating layer since topological insulators are known to be fragile to degradation. However, capping can hinder the observation of novel transport properties of the surface states. To understand the influence of capping on the surface states, it is crucial to understand the crystal structure and the atomic arrangement at the interfaces. Here, we use x-ray diffraction to establish the crystal structure of magnetic topological insulator Cr-doped (Bi,Sb)2Te3 (CBST) films grown on SrTiO3 (1 1 1) substrates with and without a Te capping layer. We find that both the film and capping layer are single crystal and that the crystal quality of the film is independent of the presence of the capping layer, but that x-rays cause sublimation of the CBST film, which is prevented by the capping layer. Our findings show that the different transport properties of capped films cannot be attributed to a lower crystal quality but to a more subtle effect such as a different electronic structure at the interface with the capping layer. Our results on the crystal structure and atomic arrangements of the topological heterostructure will enable modelling the electronic structure and design of topological heterostructures.


2014 ◽  
Vol 90 (23) ◽  
Author(s):  
Han Woong Yeom ◽  
Sung Hwan Kim ◽  
Woo Jong Shin ◽  
Kyung-Hwan Jin ◽  
Joonbum Park ◽  
...  

APL Materials ◽  
2016 ◽  
Vol 4 (10) ◽  
pp. 106107 ◽  
Author(s):  
C. I. Fornari ◽  
P. H. O. Rappl ◽  
S. L. Morelhão ◽  
T. R. F. Peixoto ◽  
H. Bentmann ◽  
...  

Author(s):  
Byoung-Joon Kim ◽  
Hae-A-Seul Shin ◽  
In-Suk Choi ◽  
Young-Chang Joo

Abstract The electrical resistance Cu film on flexible substrate was investigated in cyclic bending deformation. The electrical resistance of 1 µm thick Cu film on flexible substrate increased up to 120 % after 500,000 cycles in 1.1 % tensile bending strain. Crack and extrusion were observed due to the fatigue damage of metal film. Low bending strain did not cause any damage on metal film but higher bending strain resulted in severe electrical and mechanical damage. Thinner film showed higher fatigue resistance because of the better mechanical property of thin film. Cu film with NiCr under-layer showed poorer fatigue resistance in tensile bending mode. Ni capping layer did not improve the fatigue resistance of Cu film, but Al capping layer suppressed crack formation and lowered electrical resistance change. The NiCr under layer, Ni capping layer, and Al capping layer effect on electrical resistance change of Cu film was compared with Cu only sample.


2019 ◽  
Vol 129 (3) ◽  
pp. 404-412 ◽  
Author(s):  
S. O. Filnov ◽  
Yu. A. Surnin ◽  
A. V. Koroleva ◽  
I. I. Klimovskikh ◽  
D. A. Estyunin ◽  
...  

2020 ◽  
Vol 4 (9) ◽  
Author(s):  
Nan Liu ◽  
Xuefan Niu ◽  
Yuxin Liu ◽  
Qinghua Zhang ◽  
Lin Gu ◽  
...  

2020 ◽  
Vol 117 (26) ◽  
pp. 262401
Author(s):  
N. Meyer ◽  
K. Geishendorf ◽  
J. Walowski ◽  
A. Thomas ◽  
M. Münzenberg

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