Experimental characterization of plasma formation and shockwave propagation induced by high power pulsed underwater electrical discharge

2014 ◽  
Vol 85 (6) ◽  
pp. 063701 ◽  
Author(s):  
A. Claverie ◽  
J. Deroy ◽  
M. Boustie ◽  
G. Avrillaud ◽  
A. Chuvatin ◽  
...  
Keyword(s):  
High Power ◽  
Electrical Discharge ◽  
Plasma Formation ◽  
Experimental Characterization

Experimental characterization of an off-axis scheme for pumping high-power photonic crystal fiber lasers

2014 ◽  
Vol 114 (3) ◽  
pp. 327-331 ◽  
Author(s):  
Boris Rosenstein ◽  
Avry Shirakov ◽  
Daniel Belker ◽  
Amiel A. Ishaaya
Keyword(s):  
Photonic Crystal ◽  
Photonic Crystal Fiber ◽  
High Power ◽  
Fiber Lasers ◽  
Experimental Characterization ◽  
Crystal Fiber

scholarly journals Experimental Characterization of Electrical Discharge Machining of Aluminum 6061 T6 Alloy using Different Dielectrics

2019 ◽  
Vol 44 (9) ◽  
pp. 8043-8052 ◽  
Author(s):  
Misbah Niamat ◽  
Shoaib Sarfraz ◽  
Essam Shehab ◽  
Sikiru Oluwarotimi Ismail ◽  
Qazi Salman Khalid
Keyword(s):  
Electrical Discharge ◽  
Electrical Discharge Machining ◽  
Experimental Characterization

scholarly journals Experimental characterization of concrete removal by high-power quasicontinuous wave fiber laser irradiation

2017 ◽  
Vol 29 (4) ◽  
pp. 041501 ◽  
Author(s):  
Nguyen Phi Long ◽  
Hiroyuki Daido ◽  
Tomonori Yamada ◽  
Akihiko Nishimura ◽  
Noboru Hasegawa ◽  
...  
Keyword(s):  
Fiber Laser ◽  
Laser Irradiation ◽  
High Power ◽  
Experimental Characterization

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

Sign in / Sign up

Export Citation Format

Share Document