Heteroepitaxy of GaAs on (001) ⇒ 6° Ge substrates at high growth rates by hydride vapor phase epitaxy

2013 ◽  
Vol 113 (17) ◽  
pp. 174903 ◽  
Author(s):  
K. L. Schulte ◽  
A. W. Wood ◽  
R. C. Reedy ◽  
A. J. Ptak ◽  
N. T. Meyer ◽  
...  
2010 ◽  
Vol 312 (18) ◽  
pp. 2537-2541 ◽  
Author(s):  
E. Richter ◽  
U. Zeimer ◽  
S. Hagedorn ◽  
M. Wagner ◽  
F. Brunner ◽  
...  

1998 ◽  
Vol 537 ◽  
Author(s):  
R. Zhang ◽  
L. Zhang ◽  
D.M. Hansen ◽  
Marek P. Boleslawski ◽  
K.L. Chen ◽  
...  

AbstractEpitaxial lateral overgrowth (ELO) of GaN on SiO2-masked (0001) GaN substrates has been investigated by using chloride-based growth chemistries via hydride vapor phase epitaxy (HVPE) and metal organic vapor phase epitaxy (MOVPE). Diethyl gallium chloride, (C2H5)2GaCl, was used in as the MOVPE Ga precursor. The lateral and vertical growth rates as well as the overgrowth morphology of ELO GaN structures are dependent on growth temperature, V/III ratio and the in-plane orientation of the mask opening. A high growth temperature and low V/III ratio increase the lateral growth rate and produce ELO structures with a planar surface to the GaN prisms. High-quality coalesced and planar ELO GaN has been fabricated by both growth chemistries. The use of the diethyl gallium chloride source allows for the benefits of HVPE growth to be realized within the MOVPE growth environment.


2018 ◽  
Vol 112 (4) ◽  
pp. 042101 ◽  
Author(s):  
Kevin L. Schulte ◽  
Anna Braun ◽  
John Simon ◽  
Aaron J. Ptak

2007 ◽  
Vol 305 (2) ◽  
pp. 355-359 ◽  
Author(s):  
Toru Nagashima ◽  
Manabu Harada ◽  
Hiroyuki Yanagi ◽  
Hiroyuki Fukuyama ◽  
Yoshinao Kumagai ◽  
...  

1998 ◽  
Vol 84 (3) ◽  
pp. 1572-1578 ◽  
Author(s):  
J. Mimila-Arroyo ◽  
J. Dı́az-Reyes ◽  
A. Lusson

1999 ◽  
Vol 4 (S1) ◽  
pp. 465-470
Author(s):  
R. Zhang ◽  
L. Zhang ◽  
D.M. Hansen ◽  
Marek P. Boleslawski ◽  
K.L. Chen ◽  
...  

Epitaxial lateral overgrowth (ELO) of GaN on SiO2-masked (0001) GaN substrates has been investigated by using chloride-based growth chemistries via hydride vapor phase epitaxy (HVPE) and metal organic vapor phase epitaxy (MOVPE). Diethyl gallium chloride, (C2H5)2GaCl, was used in as the MOVPE Ga precursor. The lateral and vertical growth rates as well as the overgrowth morphology of ELO GaN structures are dependent on growth temperature, V/III ratio and the in-plane orientation of the mask opening. A high growth temperature and low V/III ratio increase the lateral growth rate and produce ELO structures with a planar surface to the GaN prisms. High-quality coalesced and planar ELO GaN has been fabricated by both growth chemistries. The use of the diethyl gallium chloride source allows for the benefits of HVPE growth to be realized within the MOVPE growth environment.


2013 ◽  
Vol 10 (11) ◽  
pp. 1353-1356 ◽  
Author(s):  
Akinori Ubukata ◽  
Yoshiki Yano ◽  
Yuya Yamaoka ◽  
Yuichiro Kitamura ◽  
Toshiya Tabuchi ◽  
...  

1999 ◽  
Vol 595 ◽  
Author(s):  
T. S. Kuan ◽  
C. K. Inoki ◽  
Y. Hsu ◽  
D. L. Harris ◽  
R. Zhang ◽  
...  

AbstractWe have carried out a series of lateral epitaxial overgrowths (LEO) of GaN through thin oxide windows by the hydride vapor phase epitaxy (HVPE) technique at different growth temperatures. High lateral growth rate at 1100°C allows coalescing of neighboring islands into a continuous and flat film, while the lower lateral growth rate at 1050°C produces triangular-shaped ridges over the growth windows. In either case, threading dislocations bend into laterally grown regions to relax the shear stress developed in the film during growth. In regions close to the mask edge, where the shear stress is highest, dislocations interact and multiply into arrays of edge dislocations lying parallel to the growth window. This multiplication and pileup of dislocations cause a large-angle tilting of the laterally grown regions. The tilt angle is high (∼8 degrees) when the growth is at 1050°C and becomes smaller (3-5 degrees) at 1100°C. At the coalescence of growth facets, a tilt-type grain boundary is formed. During the high-temperature lateral growth, the tensile stress in the GaN seed layer and the thermal stress from the mask layer both contribute to a high shear stress at the growth facets. Finite element stress simulations suggest that this shear stress may be sufficient to cause the observed excessive dislocation activities and tilting of LEO regions at high growth temperatures.


1989 ◽  
Vol 66 (11) ◽  
pp. 5384-5387 ◽  
Author(s):  
D. S. Cao ◽  
A. W. Kimball ◽  
G. S. Chen ◽  
K. L. Fry ◽  
G. B. Stringfellow

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