Enhanced high thermal conductivity and low permittivity of polyimide based composites by core-shell Ag@SiO2 nanoparticle fillers

2012 ◽  
Vol 101 (1) ◽  
pp. 012903 ◽  
Author(s):  
Yongcun Zhou ◽  
Lu Wang ◽  
Hu Zhang ◽  
Yuanyuan Bai ◽  
Yujuan Niu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Core Shell ◽  
Sio2 Nanoparticle ◽  
Low Permittivity

High thermal conductivity in polaritonic SiO2 nanoparticle beds

2016 ◽  
Vol 3 (5) ◽  
pp. 434-441 ◽  
Author(s):  
E. J. Tervo ◽  
O. S. Adewuyi ◽  
J. S. Hammonds ◽  
B. A. Cola
Keyword(s):  
Thermal Conductivity ◽  
Experimental Evidence ◽  
Thermal Conduction ◽  
High Thermal Conductivity ◽  
Surface Phonon ◽  
Sio2 Nanoparticle ◽  
Surface Phonon Polaritons ◽  
Phonon Polaritons

Experimental evidence is presented for the first measurement of thermal conduction by surface phonon polaritons in packed nanoparticle beds.

scholarly journals Synergistic Effects of Boron Nitride (BN) Nanosheets and Silver (Ag) Nanoparticles on Thermal Conductivity and Electrical Properties of Epoxy Nanocomposites

Polymers ◽  
2020 ◽  
Vol 12 (2) ◽  
pp. 426 ◽  
Author(s):  
Yunjian Wu ◽  
Xiaoxing Zhang ◽  
Ankit Negi ◽  
Jixiong He ◽  
Guoxiong Hu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Properties ◽  
Boron Nitride ◽  
Polymer Composites ◽  
Synergistic Effects ◽  
High Thermal Conductivity ◽  
Epoxy Nanocomposites ◽  
Transfer Path ◽  
Low Dielectric ◽  
Low Permittivity

Polymer composites, with both high thermal conductivity and high electrical insulation strength, are desirable for power equipment and electronic devices, to sustain increasingly high power density and heat flux. However, conventional methods to synthesize polymer composites with high thermal conductivity often degrade their insulation strength, or cause a significant increase in dielectric properties. In this work, we demonstrate epoxy nanocomposites embedded with silver nanoparticles (AgNPs), and modified boron nitride nanosheets (BNNSs), which have high thermal conductivity, high insulation strength, low permittivity, and low dielectric loss. Compared with neat epoxy, the composite with 25 vol% of binary nanofillers has a significant enhancement (~10x) in thermal conductivity, which is twice of that filled with BNNSs only (~5x), owing to the continuous heat transfer path among BNNSs enabled by AgNPs. An increase in the breakdown voltage is observed, which is attributed to BNNSs-restricted formation of AgNPs conducting channels that result in a lengthening of the breakdown path. Moreover, the effects of nanofillers on dielectric properties, and thermal simulated current of nanocomposites, are discussed.

Enhancing the thermoelectric properties of SnTe via introducing PbTe@C core–shell nanostructures

2021 ◽  
Author(s):  
Jingwen Zhang ◽  
song li ◽  
zhengyi zhu ◽  
Zhenwang Wu ◽  
Jiuxing Zhang
Keyword(s):  
Thermal Conductivity ◽  
Seebeck Coefficient ◽  
Thermoelectric Properties ◽  
Hole Concentration ◽  
High Thermal Conductivity ◽  
Concentration Limit ◽  
Core Shell ◽  
Metal Chalcogenides ◽  
Shell Nanostructures ◽  
High Hole Concentration

SnTe is an emerging IV–VI metal chalcogenides, but its low Seebeck coefficient and high thermal conductivity mainly originating from the high hole concentration limit its thermoelectric performance. In this work,...

Cellulose/boron nitride core–shell microbeads providing high thermal conductivity for thermally conductive composite sheets

RSC Advances ◽  
2016 ◽  
Vol 6 (39) ◽  
pp. 33036-33042 ◽  
Author(s):  
Shoji Nagaoka ◽  
Takuma Jodai ◽  
Yoshihiro Kameyama ◽  
Maki Horikawa ◽  
Tomohiro Shirosaki ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Core Shell ◽  
Conductive Network ◽  
Conductive Composite ◽  
Thermally Conductive

Formation of a thermal conductive network in resin sheet hybridized cellulose/BN core–shell microbeads.

Core–shell Cu@rGO hybrids filled in epoxy composites with high thermal conduction

2018 ◽  
Vol 6 (2) ◽  
pp. 257-265 ◽  
Author(s):  
Shaoqing Liu ◽  
Bo Zhao ◽  
Li Jiang ◽  
Yan-Wu Zhu ◽  
Xian-Zhu Fu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Electronic Packaging ◽  
Thermal Conduction ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Core Shell ◽  
Filled Polymer

3D core–shell Cu@rGO filled polymer composites with high thermal conductivity for advanced electronic packaging techniques.

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