Silicon nanowire atomic force microscopy probes for high aspect ratio geometries

2012 ◽  
Vol 100 (21) ◽  
pp. 213106 ◽  
Author(s):  
Brian A. Bryce ◽  
B. Robert Ilic ◽  
Mark C. Reuter ◽  
Sandip Tiwari
Keyword(s):  
Atomic Force Microscopy ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Silicon Nanowire ◽  
Force Microscopy ◽  
Atomic Force

Focused ion beam-assisted fabrication of soft high-aspect ratio silicon nanowire atomic force microscopy probes

2017 ◽  
Vol 179 ◽  
pp. 24-32 ◽  
Author(s):  
Peter Knittel ◽  
Nicolas Hibst ◽  
Boris Mizaikoff ◽  
Steffen Strehle ◽  
Christine Kranz
Keyword(s):  
Atomic Force Microscopy ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Silicon Nanowire ◽  
Force Microscopy ◽  
Atomic Force

Ultrasharp and high aspect ratio carbon nanotube atomic force microscopy probes for enhanced surface potential imaging

2008 ◽  
Vol 19 (23) ◽  
pp. 235704 ◽  
Author(s):  
Minhua Zhao ◽  
Vaneet Sharma ◽  
Haoyan Wei ◽  
Robert R Birge ◽  
Jeffrey A Stuart ◽  
...  
Keyword(s):  
Atomic Force Microscopy ◽  
Carbon Nanotube ◽  
Aspect Ratio ◽  
Surface Potential ◽  
High Aspect Ratio ◽  
Force Microscopy ◽  
Atomic Force ◽  
Enhanced Surface

On-Demand 3D Printing of Nanowire Probes for High-Aspect-Ratio Atomic Force Microscopy Imaging

2020 ◽  
Vol 12 (41) ◽  
pp. 46571-46577
Author(s):  
Heekwon Lee ◽  
Zhuofei Gan ◽  
Mojun Chen ◽  
Siyi Min ◽  
Jihyuk Yang ◽  
...  
Keyword(s):  
Atomic Force Microscopy ◽  
3D Printing ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Microscopy Imaging ◽  
Force Microscopy ◽  
On Demand ◽  
Atomic Force ◽  
Atomic Force Microscopy Imaging

Profiles of a high-aspect-ratio grating determined by spectroscopic scatterometry and atomic-force microscopy

2006 ◽  
Vol 45 (14) ◽  
pp. 3201 ◽  
Author(s):  
J. Garnaes ◽  
P.-E. Hansen ◽  
N. Agersnap ◽  
J. Holm ◽  
F. Borsetto ◽  
...  
Keyword(s):  
Atomic Force Microscopy ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Force Microscopy ◽  
Atomic Force

High Aspect Ratio Nanometrology using Carbon Nanotube Probes in Atomic Force Microscopy

CIRP Annals ◽  
2007 ◽  
Vol 56 (1) ◽  
pp. 533-536 ◽  
Author(s):  
F.Z. Fang ◽  
Z.W. Xu ◽  
S. Dong ◽  
G.X. Zhang
Keyword(s):  
Atomic Force Microscopy ◽  
Carbon Nanotube ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Force Microscopy ◽  
Atomic Force

scholarly journals Measuring the Blind Holes: Three-Dimensional Imaging of through Silicon via Using High Aspect Ratio AFM Probe

2020 ◽  
Author(s):  
Imtisal Akhtar ◽  
Malik Abdul Rehman ◽  
Yongho Seo
Keyword(s):  
Atomic Force Microscopy ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Three Dimensional ◽  
Through Silicon Via ◽  
Force Microscopy ◽  
Atomic Force ◽  
Via Holes ◽  
Afm Probe ◽  
3D Stacking

Three-dimensional integration and stacking of semiconductor devices with high density, its compactness, miniaturization and vertical 3D stacking of nanoscale devices highlighted many challenging problems in the 3D parameter’s such as CD (critical dimension) measurement, depth measurement of via holes, internal morphology of through silicon via (TSV), etc. Current challenge in the high-density 3D semiconductor devices is to measure the depth of through silicon via (TSV) without destructing the sample; TSVs are used in 3D stacking devices to connect the wafers stacked vertically to reduce the wiring delay, power dissipation, and of course, the form factor in the integration system. Special probes and algorithms have been designed to measure 3D parameters like wall roughness, sidewall angle, but these are only limited to deep trench-like structures and cannot be applied to structures like via holes and protrusions. To address these problems, we have proposed an algorithm based nondestructive 3D Atomic Force Microscopy (AFM). Using the high aspect ratio (5, 10, 20, 25) multiwall carbon nanotubes (MWCNTs) AFM probe, the depth of holes up to 1 micron is faithfully obtained. In addition to this, internal topography, side walls, and location of via holes are obtained faithfully. This atomic force microscopy technique enables to 3D scan the features (of any shape) present above and below the surface.

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