Dependence of effective desorption kinetic parameters on surface coverage and adsorption temperature: CO on Pd(111)

1989 ◽  
Vol 90 (11) ◽  
pp. 6761-6766 ◽  
Author(s):  
Xingcai Guo ◽  
John T. Yates
Keyword(s):  
Kinetic Parameters ◽  
Surface Coverage ◽  
Desorption Kinetic ◽  
Adsorption Temperature

scholarly journals Direct immunoassays and their performance – theoretical modelling of the effects of antibody orientation and associated kinetics

2018 ◽  
Vol 10 (10) ◽  
pp. 598-604 ◽  
Author(s):  
Dana Mackey ◽  
Eilís Kelly ◽  
Robert Nooney ◽  
Richard O'Kennedy
Keyword(s):  
Kinetic Parameters ◽  
Surface Coverage ◽  
Computational Modelling ◽  
Theoretical Modelling ◽  
Antibody Orientation ◽  
Optimal Surface

Mathematical and computational modelling are used to quantify immunoassay signals for various immobilized antibody orientations, antigen sizes and kinetic parameters, in order to determine optimal surface coverage.

Equilibrium determination of H2O desorption kinetic parameters of H2O/K/Ni(111)

1994 ◽  
Vol 101 (2) ◽  
pp. 1687-1692 ◽  
Author(s):  
W. Kuch ◽  
W. Schnurnberger ◽  
M. Schulze ◽  
K. Bolwin
Keyword(s):  
Kinetic Parameters ◽  
Desorption Kinetic

scholarly journals Mathematical Modeling of Cyclic Voltammogram Curves of Copper Deposition

2021 ◽  
Author(s):  
Shuvodeep De
Keyword(s):  
Steady State ◽  
Kinetic Parameters ◽  
Deposition Rate ◽  
Surface Coverage ◽  
Dynamic Equilibrium ◽  
Rotating Disk Electrode ◽  
Copper Deposition ◽  
Cyclic Voltammogram ◽  
Additive Concentration ◽  
Organic Additives

The manufacturing of interconnects and the packaging of integrated circuits are achieved with electrodeposition of copper or other metals. In order to increase the rate of deposition, especially for the large features in packaging, forced convection is provided with certain agitation mechanisms. Although this reduces deposition time, it leads to non-uniform mass transport within each feature and between different features. Special organic additives are used in the solution during the process in order to tune the nucleation and growth of metal, as well as to modify the deposition rate and improve the uniformity. A mathematical model to describe the behavior of organic additives in conjugation with fluid flow and features of various geometry and dimensions is very much desired to facilitate chemistry and process development. In order to achieve this, the physiochemical kinetics of additive and their influence on the Cu deposition rate need to be described precisely. This presentation focuses on a method to extract the kinetic parameters describing the combined effect of multiple additives during copper deposition using rotating disk electrode (RDE). The one-dimensional steady state convection-diffusion equation for each of the chemical species including copper is solved by a semi-analytical method for a range of potentials. The boundary conditions of these differential equations are coupled on the surface of the RDE through the surface coverage of the absorbed species. The steady state of surface coverage of the species represents a dynamic equilibrium of three key processes i.e., adsorption, desorption, and consumption (incorporation). When equilibrium is achieved, the net rate of adsorption and desorption becomes equal to the rate of consumption. At each value of potential, the surface coverage of the additives is solved. At first, the solution is obtained with only one species known as suppressor and it was found that in a specific range of voltage and kinetic parameter multiple solutions of the surface coverage exist at same applied potential. This mathematically explains the S-shaped negative differential resistance (NDR) feature in experimental Cyclic Voltammogram (CV) curves. Figure 1 shows three such experimental S-shaped curves for different concentration of suppressors. The NDR region obtained in the theoretical CV curve is sensitive to the kinetic parameters of the additives. It is possible to match the theoretical and the experimental CV curves by optimizing the kinetic parameters. Determination of the kinetic parameters by particle swarm optimization using experimental data for multiple additive concentration will be discussed in detail in this talk.

Shape- and size- dependent desorption kinetics and surface acidity on nano-SnO2

2022 ◽  
Author(s):  
Zixiang Cui ◽  
Yidi Xue ◽  
Yongqiang Xue ◽  
Mengying Wang ◽  
Jiaojiao Chen ◽  
...  
Keyword(s):  
Activation Energy ◽  
Kinetic Parameters ◽  
Surface Acidity ◽  
Acid Sites ◽  
Desorption Kinetics ◽  
Exponential Factor ◽  
Desorption Kinetic ◽  
Size Dependent ◽  
Desorption Activation Energy ◽  
Shape And Size

The desorption kinetic parameters (the desorption activation energy (Ed) and the desorption pre-exponential factor (A)) and the surface acidity (the strength and number of acid sites) of spherical and octahedral...

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