Effect of process parameters on properties of YBCO thin films deposited by off-axis planar magnetron sputtering

1992 ◽  
Author(s):  
M. Ihsan ◽  
M. Fardmanesh ◽  
A. Rothwarf ◽  
K. Pourrezaei
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Process Parameters ◽  
Ybco Thin Films ◽  
Planar Magnetron

Voltage controlled, reactive planar magnetron sputtering of AlN thin films

1982 ◽  
Vol 20 (3) ◽  
pp. 376-378 ◽  
Author(s):  
R. McMahon ◽  
J. Affinito ◽  
R. R. Parsons
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Planar Magnetron

Orientation Characteristics with Process Parameters of PLZT(X/70/100) Thin Films Prepared by RF-Magnetron Sputtering

1997 ◽  
Vol 472 ◽  
Author(s):  
S.K. Kang ◽  
M.S. Park ◽  
D.B. Kim ◽  
K.S. No ◽  
S.H. Cho
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Substrate Temperature ◽  
Process Parameters ◽  
Surface Characterization ◽  
Rf Magnetron Sputtering ◽  
Gas Pressure ◽  
Axis Orientation ◽  
X Ray ◽  
Dominant Influence

ABSTRACTPLZT(X/70/100) thin films on MgO(100), Pt/Ti/MgO(100), and Pt/Ti/Si(100) have been prepared by RF-magnetron sputtering process from sintered target with compositions of PLZT(X/70/100), where X=5, 10, and 15, respectively. The effects of substrate temperature, substrate and gas pressure on deposited thin films were studied. Crystalline and surface characterization was analyzed using XRD, SEM, AES, and AFM. X-ray rocking curves were measured to examine the film orientation. It was observed that the gas pressure was the dominant influence on having (001) preferred orientation. As a result, the degree of c-axis orientation increased as gas pressure decreased.

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