Simultaneous measurement of Young’s modulus, Poisson ratio, and coefficient of thermal expansion of thin films on substrates

2000 ◽  
Vol 87 (3) ◽  
pp. 1575-1577 ◽  
Author(s):  
Jie-Hua Zhao ◽  
Yong Du ◽  
Michael Morgen ◽  
Paul S. Ho
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Simultaneous Measurement ◽  
Coefficient Of Thermal Expansion ◽  
Young's Modulus ◽  
Poisson Ratio

Determination of Mechanical Properties of Thin Film on Silicon Wafer

2003 ◽  
Author(s):  
Enboa Wu ◽  
Albert J. D. Yang ◽  
Ching-An Shao ◽  
C. S. Yen
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Silicon Wafer ◽  
Coefficient Of Thermal Expansion ◽  
Young's Modulus ◽  
Poisson Ratio ◽  
Bulk State

Nondestructive determination of Young’s modulus, coefficient of thermal expansion, Poisson ratio, and thickness of a thin film has long been a difficult but important issue as the film of micrometer order thick might behave differently from that in the bulk state. In this paper, we have successfully demonstrated the capability of determining all these four parameters at one time. This novel method includes use of the digital phase-shifting reflection moire´ (DPRM) technique to record the slope of wafer warpage under temperature drop condition. In the experiment, 1-um thick aluminum was sputtered on a 6-in silicon wafer. The convolution relationship between the measured data and the mechanical properties was constructed numerically using the conventional 3D finite element code. The genetic algorithm (GA) was adopted as the searching tool for search of the optimal mechanical properties of the film. It was found that the determined data for Young’s modulus (E), Coefficient of Thermal Expansion (CTE), Poisson ratio (ν), and thickness (h) of the 1.00 um thick aluminum film were 104.2Gpa, 38.0 ppm/°C, 0.38, and 0.98 um, respectively, whereas that in the bulk state were measured to be E=71.4 Gpa, CTE=23.0 ppm/°C, and ν=0.34. The significantly larger values on the Young’s modulus and the coefficient of thermal expansion determined by this method might be attributed to the smaller dislocation density due to the thin dimension and formation of the 5-nm layer of Al2O3 formed on top of the 1-um thick sputtered film. The Young’s Modulus and the Poisson ratio of this nano-scale Al2O3 film were then determined. Their values are consistent with the physical intuition of the microstructure.

scholarly journals Out-of-Plane Thermal Expansion Coefficient and Biaxial Young’s Modulus of Sputtered ITO Thin Films

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 153
Author(s):  
Chuen-Lin Tien ◽  
Tsai-Wei Lin
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Young's Modulus ◽  
Heating Temperature ◽  
Glass Substrates ◽  
Ito Thin Films

This paper proposes a measuring apparatus and method for simultaneous determination of the thermal expansion coefficient and biaxial Young’s modulus of indium tin oxide (ITO) thin films. ITO thin films simultaneously coated on N-BK7 and S-TIM35 glass substrates were prepared by direct current (DC) magnetron sputtering deposition. The thermo-mechanical parameters of ITO thin films were investigated experimentally. Thermal stress in sputtered ITO films was evaluated by an improved Twyman–Green interferometer associated with wavelet transform at different temperatures. When the heating temperature increased from 30 °C to 100 °C, the tensile thermal stress of ITO thin films increased. The increase in substrate temperature led to the decrease of total residual stress deposited on two glass substrates. A linear relationship between the thermal stress and substrate heating temperature was found. The thermal expansion coefficient and biaxial Young’s modulus of the films were measured by the double substrate method. The results show that the out of plane thermal expansion coefficient and biaxial Young’s modulus of the ITO film were 5.81 × 10−6 °C−1 and 475 GPa.

Size- and temperature-dependent Young's modulus and size-dependent thermal expansion coefficient of thin films

2016 ◽  
Vol 18 (31) ◽  
pp. 21508-21517 ◽  
Author(s):  
Xiao-Ye Zhou ◽  
Bao-Ling Huang ◽  
Tong-Yi Zhang
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Material Properties ◽  
Essential Role ◽  
Young's Modulus ◽  
Temperature Dependent ◽  
Size Dependent

Surfaces of nanomaterials play an essential role in size-dependent material properties.

Tangguh LNG Project Statistical Young’s Modulus and Thermal Expansion Coefficient Testing of Clad Pipe Specimens

2011 ◽  
Author(s):  
Terry Griffiths ◽  
Isabel Hadley ◽  
Richard Johnson ◽  
Fabio Micari
Keyword(s):  
Thermal Expansion ◽  
Young’S Modulus ◽  
Room Temperature ◽  
Structural Reliability ◽  
Coefficient Of Thermal Expansion ◽  
Young's Modulus ◽  
Linear Thermal Expansion ◽  
Upheaval Buckling ◽  
Analysis Of Results ◽  
Mean And Variance

Material testing was undertaken on samples taken from clad pipe manufactured by JSW for the Tangguh LNG project. The test programme involved testing Young’s Modulus (E) and Coefficient of Linear Thermal Expansion (α) from room temperature to above 110° on each layer. This paper summarises testing and analysis of results which enabled mean and variance on each material property to be found. Checks were also undertaken for any correlations in properties between clad and parent layers, and between Young’s Modulus and Coefficient of Thermal Expansion. Analysis results are compared to existing industry norms and their implications for the Tangguh project UHB (Upheaval Buckling) SRA (Structural Reliability Analysis) are summarised.

Basic Research on Combinatorial Evaluation Method for Coefficient of Thermal Expansion

2007 ◽  
Vol 1024 ◽  
Author(s):  
Yuko Aono ◽  
Seiichi Hata ◽  
Junpei Sakurai ◽  
Ryusuke Yamauchi ◽  
Hiroyuki Tachikawa ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Thermal Behavior ◽  
Young’S Modulus ◽  
Evaluation Method ◽  
Coefficient Of Thermal Expansion ◽  
Young's Modulus ◽  
Ccd Camera ◽  
Basic Research ◽  
Film Library ◽  
Combinatorial Methods

AbstractThe coefficient of thermal expansion (CTE) is one of the most important material properties for actuators driven by heat or structure over a wide temperature. The CTE of an alloy depends on its composition, and combinatorial methods are very effective for researching new alloys. A CTE evaluation method, which can be applied to combinatorial methods or a thin film library, is proposed in this paper. The thermal behavior of a bi-layer cantilever couple was used for the evaluation, and the Young's modulus, which is also an important property, was simultaneously obtained. Firstly, one bi-layer cantilever was fabricated and agreement of the thermal behavior with the theoretical behavior was confirmed. The estimated error of the measurement device (CCD camera) resolution was then analyzed. The results indicate that combinatorial evaluation does not enable an accurate evaluation of Young's modulus, but does allow the CTE be accurately determined.

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