Formation of etch pits during carbon doping of gallium arsenide with carbon tetrachloride by metalorganic vapor-phase epitaxy

1999 ◽  
Vol 86 (1) ◽  
pp. 318-324 ◽  
Author(s):  
M. J. Begarney ◽  
L. Li ◽  
B.-K. Han ◽  
D. C. Law ◽  
C. H. Li ◽  
...  
2016 ◽  
Vol 52 (10) ◽  
pp. 985-989 ◽  
Author(s):  
P. B. Boldyrevskii ◽  
D. O. Filatov ◽  
I. A. Kazantseva ◽  
D. S. Smotrin ◽  
M. V. Revin

1993 ◽  
Vol 63 (2) ◽  
pp. 214-215 ◽  
Author(s):  
Douglas F. Foster ◽  
Christopher Glidewell ◽  
David J. Cole‐Hamilton

1984 ◽  
Vol 45 (11) ◽  
pp. 1196-1198 ◽  
Author(s):  
V. S. Sundaram ◽  
A. P. Roth ◽  
D. F. Williams ◽  
R. Yakimova

1995 ◽  
Vol 378 ◽  
Author(s):  
J. W. Huang ◽  
T. F. Kuech

AbstractIntentional defect incorporation in metalorganic vapor phase epitaxy (MOVPE) InxGai-xAs was achieved by controlled oxygen doping using diethylaluminum ethoxide (DEALO). DEALO doping has led to the incorporation of Al and O, and the compensation of shallow Si donors in InxGai-xAs:Si with 0≤x≤ 0.25. DLTS analysis on a series of InxGa1-xAs:Si:O samples with 0≤x≤ 0.18 showed that oxygen incorporation led to a set of deep levels, similar to those found in DEALO doped GaAs. The characteristic deep levels appear to remain at a relatively constant energy with respect to the valence band.


2000 ◽  
Vol 88 (1) ◽  
pp. 508-512 ◽  
Author(s):  
D. C. Law ◽  
L. Li ◽  
M. J. Begarney ◽  
R. F. Hicks

1988 ◽  
Vol 53 (14) ◽  
pp. 1317-1319 ◽  
Author(s):  
T. F. Kuech ◽  
M. A. Tischler ◽  
P.‐J. Wang ◽  
G. Scilla ◽  
R. Potemski ◽  
...  

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