Threading dislocation reduction in strained layers

1999 ◽  
Vol 85 (1) ◽  
pp. 182-192 ◽  
Author(s):  
A. E. Romanov ◽  
W. Pompe ◽  
S. Mathis ◽  
G. E. Beltz ◽  
J. S. Speck
1993 ◽  
Vol 32 (Part 1, No. 1B) ◽  
pp. 614-617 ◽  
Author(s):  
Yae Okuno ◽  
Toshihiro Kawano ◽  
Tomonobu Tsuchiya ◽  
Tsuyoshi Taniwatari

2007 ◽  
Vol 300 (1) ◽  
pp. 70-74 ◽  
Author(s):  
M.J. Kappers ◽  
R. Datta ◽  
R.A. Oliver ◽  
F.D.G. Rayment ◽  
M.E. Vickers ◽  
...  

1990 ◽  
Vol 198 ◽  
Author(s):  
Hyunchul Sohn ◽  
Eicke R. Weber ◽  
Jay Tu ◽  
Henry P. Lee ◽  
Shy Wang

ABSTRACTThe growth of GaAs films by MBE on mesa-type patterned Si substrates has been investigated. Mesa widths were varied from 10 µm to 200 µm and were prepared using chemical etching with Si3N4 masks and reactive ion etching. The residual stress in the epitaxial layer was estimated using low temperature (7K) photoluminescence and the defect distribution was studied by cross sectional TEM, dislocation densities were in addition determined by etch pits. The residual stress and the dislocation density decreased monotonically with the reduction of growth area. By the incorporation of strained layers with the reduction of growth area, the etch pit density in GaAs layers on mesas was reduced further.


Author(s):  
X. H. Wu ◽  
L. M. Brown ◽  
D. Kapolnek ◽  
S. Kellert ◽  
B. Kellert ◽  
...  

The defect density and their configuration in epitaxial GaN films on sapphire are strongly related to the optical and electrical properties of the films. The crystalline quality of GaN on sapphire can be greatly improved by introducing a low temperature GaN buffer layer. However, recent studies in our group demonstrate that the pre-growth substrate treatment can significantly change the defects structure and electron properties of the films. In this paper, we present our results on studies of the film microstructures and their corresponding nucleation layers. We propose a novel mechanism for dislocation reduction for GaN on sapphire.The growths for this study were achieved in a horizontal flow reactor operating at atmospheric pressure. Basal plane AI2O3 (Union Carbide) substrates were first cleaned in solvents and then heated in flowing H2 at 1050°C. Sample A was exposed to an ammonia flow of 3 1/min for 60s, sample B for 400s before the temperature was then reduced to 600°C and a nominal 190 Å thick GaN layer was grown.


2020 ◽  
Vol 98 (5) ◽  
pp. 185-194
Author(s):  
Yuji Yamamoto ◽  
Cedric Corley ◽  
Markus Andreas Schubert ◽  
Marvin Zöllner ◽  
Bernd Tillack

Author(s):  
Yuji Yamamoto ◽  
Cedric Corley ◽  
Marcus Andreas Schubert ◽  
Marvin Zoellner ◽  
Bernd Tillack

1998 ◽  
Vol 2 (1-4) ◽  
pp. 772-776 ◽  
Author(s):  
Kenzo Maehashi ◽  
Hisao Nakashima ◽  
Frank Bertram ◽  
Peter Veit ◽  
Jürgen Christen

2001 ◽  
Vol 673 ◽  
Author(s):  
Y.W. Zhang ◽  
T.C. Wang ◽  
S.J. Chua

ABSTRACTA kinetic model is presented to simulate the strain relaxation in the GexSi1−x/Si(100) systems. In the model, the nucleation, propagation and annihilation of threading dislocations, the interaction between threading dislocations and misfit dislocations, and surface roughness are taken into account. The model reproduces a wide range of experimental results. The implications of its predictions on the threading dislocation reduction during the growth processes of the heteoepitaxial thin film systems are discussed.


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