Scaling laws for the reduction of threading dislocation densities in homogeneous buffer layers

1996 ◽  
Vol 80 (7) ◽  
pp. 3808-3816 ◽  
Author(s):  
J. S. Speck ◽  
M. A. Brewer ◽  
G. Beltz ◽  
A. E. Romanov ◽  
W. Pompe
Keyword(s):  
Scaling Laws ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Dislocation Densities

Residual Strain and Defect Analysis in as Grown and Annealed SiGe Layers

1991 ◽  
Vol 220 ◽  
Author(s):  
A. R. Powell ◽  
R. A. Kubiak ◽  
T. E. Whall ◽  
E. H. C. Parker ◽  
D. K. Bowen
Keyword(s):  
Residual Strain ◽  
Buffer Layers ◽  
Limited Area ◽  
Threading Dislocation ◽  
Misfit Dislocations ◽  
High Temperature Anneal ◽  
Dislocation Densities ◽  
Acceptable Quality ◽  
Strained Sige

ABSTRACTIn this paper we address the problem of producing SiGe buffer layers of acceptable quality for the growth of symmetrically strained SiGe structures. Initially we consider SiGe layers grown to well beyond the metastable critical thickness and examine the degree of residual strain both as - grown and post anneal. The defect levels in metastable SiGe layers following high temperature anneal were also studied. A buffer layer was grown consisting of stacked metastable SiGe layers each of which is annealed in situ prior to the growth of the next layer and terminating with a 0.45 SiGe alloy. This produces nearly fully relaxed 1.15pim thick structures with threading dislocation densities of 4 × 106cm−2. Limited area growth on Si suggests that elastically relaxed material free of both threading and misfit dislocations can be produced.

Strategies For Direct Monolithic Integration of AlxGa(1−x)As/InxGa(1−x)As LEDS and Lasers On Ge/GeSi/Si Substrates Via Relaxed Graded GexSi(1−x) Buffer Layers

2001 ◽  
Vol 692 ◽  
Author(s):  
Michael E. Groenert ◽  
Christopher W. Leitz ◽  
Arthur J. Pitera ◽  
Vicky K. Yang ◽  
Harry Lee ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Threshold Current ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Carrier Lifetimes ◽  
Si Substrates ◽  
Dislocation Densities ◽  
Minority Carrier Lifetimes ◽  
Current Densities ◽  
High Series

AbstractAlxGa(1−x)As/GaAs quantum well lasers have been demonstrated via organometallic chemical vapor deposition (OMCVD) on relaxed graded GexSi(1−x) virtual substrates on Si. Despite unoptimized laser structures with high series resistance and large threshold current densities, surface threading dislocation densities as low as 2×106 cm−2 enabled cw room-temperature lasing at a wavelength of 858nm. The laser structures are oxide-stripe gain-guided devices with differential quantum efficiencies of 0.16 and threshold current densities of 1550A/cm2. Identical devices grown on commercial GaAs substrates showed differential quantum efficiencies of 0.14 and threshold current densities of 1700A/cm2. This comparative data agrees with our previous measurements of near-bulk minority carrier lifetimes in GaAs grown on Ge/GeSi/Si substrates. A number of GaAs/Ge/Si integration issues including thermal expansion mismatch and Ge autodoping behavior in GaAs were overcome.

scholarly journals Снижение плотности прорастающих дислокаций в темплейтах AlN/c-сапфир, выращенных методом плазменно-активированной молекулярно-пучковой эпитаксии

2020 ◽  
Vol 46 (8) ◽  
pp. 36
Author(s):  
В.В. Ратников ◽  
Д.В. Нечаев ◽  
А.В. Мясоедов ◽  
О.А. Кошелев ◽  
В.Н. Жмерик
Keyword(s):  
Molecular Beam Epitaxy ◽  
Molecular Beam ◽  
Flux Ratio ◽  
Buffer Layers ◽  
Stress Generation ◽  
Threading Dislocation ◽  
X Ray Diffraction ◽  
X Ray ◽  
Temperature Regimes ◽  
Dislocation Densities

Multiple-crystal X-ray diffraction and a multi-beam optical stress sensor were used to study AlN/c-sapphire templates grown by plasma-assisted molecular beam epitaxy. The influence of the nucleation and buffer layers growth regimes, temperature, the ratio between Al and N* growth fluxes on the stress generation and the character of the dislocation structure were analyzed. Templates with the best crystal quality with screw and edge threading dislocation densities in a range of 4∙10^8 and 8∙10^9 cm-2, respectively, were obtained at the flux ratio of Al to N* close to 1 by using two-stage temperature regimes.

Comparison of Buffer Layer Grading Approaches in InGaAs/GaAs (001)

2020 ◽  
Vol 29 (01n04) ◽  
pp. 2040002
Author(s):  
Johanna Raphael ◽  
Tedi Kujofsa ◽  
J. E. Ayers
Keyword(s):  
Lattice Mismatch ◽  
Strain Relaxation ◽  
Lower Surface ◽  
Dislocation Dynamics ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Dislocation Densities ◽  
Threading Dislocation Density ◽  
Dislocations Density ◽  
Graded Structures

Metamorphic semiconductor devices often utilize compositionally-graded buffer layers for the accommodation of the lattice mismatch with controlled threading dislocation density and residual strain. Linear or step-graded buffers have been used extensively in these applications, but there are indications that sublinear, superlinear, S-graded, or overshoot graded structures could offer advantages in the control of defect densities. In this work we compare linear, step-graded, and nonlinear grading approaches in terms of the resulting strain and dislocations density profiles using a state-of-the-art model for strain relaxation and dislocation dynamics. We find that sublinear grading results in lower surface dislocation densities than either linear or superlinear grading approaches.

scholarly journals The effect of periodic silane burst on the properties of GaN on Si (111) substrates

2004 ◽  
Vol 831 ◽  
Author(s):  
K. Y. Zang ◽  
S. J. Chua ◽  
C. V. Thompson ◽  
L. S. Wang ◽  
S. Tripathy ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
X Ray Diffraction ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Gan On Si ◽  
Aln Buffer

ABSTRACTThe periodic silane burst technique was employed during metalorganic chemical vapor deposition of epitaxial GaN on AlN buffer layers grown on Si (111). Periodic silicon delta doping during growth of both the AlN and GaN layers led to growth of GaN films with decreased tensile stresses and decreased threading dislocation densities, as well as films with improved quality as indicated by x-ray diffraction, micro-Raman spectroscopy, atomic force microscopy, and transmission electron microscopy. The possible mechanism of the reduction of tensile stress and the dislocation density is discussed in the paper.

Low Threading Dislocation Densities in Thick, Relaxed Si1−xGex Buffer Layers

1991 ◽  
Vol 220 ◽  
Author(s):  
C. G. Tuppen ◽  
C. J. Gibbings ◽  
M. Hockly
Keyword(s):  
Dislocation Density ◽  
Dislocation Nucleation ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Direct Deposition ◽  
Dislocation Densities ◽  
Defect Densities

ABSTRACTA series of relaxed Si1−xGex alloy layers with germanium contents up to 70% has been deposited on silicon. Although direct deposition ot these highly mismatched layers on silicon gave dislocation densities of 109-1010cm2 and poor morphology, it was found that the use of a linear grade enabled completely relaxed Si.3Ge.7 layers with defect densities of ∼3.105cm−2 to be obtained. However, if the grading was too rapid the dislocation density was much higher. The role of dislocation nucleation and propagation in determining the required thickness of graded layer is discussed.

Defect-Engineered Graded GexSi1-x Buffers on Si (001) with Extreme Low Threading Dislocation Density

1995 ◽  
Vol 378 ◽  
Author(s):  
G. Kissinger ◽  
T. Morgenstern ◽  
G. Morgenstern ◽  
H. B. Erzgräber ◽  
H. Richter
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Atomic Force Microscopy ◽  
Dislocation Density ◽  
Threading Dislocation ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Threading Dislocation Density

AbstractStepwise equilibrated graded GexSii-x (x≤0.2) buffers with threading dislocation densities between 102 and 103 cm−2 on the whole area of 4 inch silicon wafers were grown and studied by transmission electron microscopy, defect etching, atomic force microscopy and photoluminescence spectroscopy.

Totally relaxed GexSi1−xlayers with low threading dislocation densities grown on Si substrates

1991 ◽  
Vol 59 (7) ◽  
pp. 811-813 ◽  
Author(s):  
E. A. Fitzgerald ◽  
Y.‐H. Xie ◽  
M. L. Green ◽  
D. Brasen ◽  
A. R. Kortan ◽  
...  
Keyword(s):  
Threading Dislocation ◽  
Si Substrates ◽  
Dislocation Densities

High Quality AlN Layer Grown on Patterned Sapphire Substrates by Hydride Vapor-Phase Epitaxy: A Route for Cost Efficient AlN Templates for Deep Ultraviolet Light Devices

2021 ◽  
Vol 21 (9) ◽  
pp. 4881-4885
Author(s):  
Seung-Jae Lee ◽  
Seong-Ran Jeon ◽  
Young Ho Song ◽  
Young-Jun Choi ◽  
Hae-Gon Oh ◽  
...  
Keyword(s):  
Vapor Phase ◽  
Vapor Phase Epitaxy ◽  
Hydride Vapor Phase Epitaxy ◽  
Threading Dislocation ◽  
Sapphire Substrates ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Order Of Magnitude ◽  
Cost Efficient ◽  
Patterned Sapphire Substrates

We report the characteristics of AlN epilayers grown directly on cylindrical-patterned sapphire substrates (CPSS) by hydride vapor-phase epitaxy (HVPE). To evaluate the effect of CPSS, we analyzed the threading dislocation densities (TDDs) of AlN films grown simultaneously on CPSS and flat sapphire substrate (FSS) by transmission electron microscopy (TEM). The corresponding TDD is measured to be 5.69 x 108 cm−2 for the AlN sample grown on the CPSS that is almost an order of magnitude lower than the value of 3.43 × 109 cm−2 on the FSS. The CPSS contributes to reduce the TDs originated from the AlN/sapphire interface via bending the TDs by lateral growth during the coalescence process. In addition, the reduction of direct interface area between AlN and sapphire by CPSS reduce the generation of TDs.

Epitaxial GaN Layer Growth Using Nitrogen Enriched TiN Buffer Layers

2006 ◽  
Vol 916 ◽  
Author(s):  
Kazuhiro Ito ◽  
Yu Uchida ◽  
Sang-jin Lee ◽  
Susumu Tsukimoto ◽  
Yuhei Ikemoto ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Light Emission ◽  
Chemical Vapor ◽  
Nucleation Site ◽  
Layer Growth ◽  
Buffer Layers ◽  
Organic Chemical ◽  
Nitrogen Enrichment ◽  
Threading Dislocation ◽  
Sapphire Substrates

AbstractAbout 20 years ago, the discovery of an AlN buffer layer lead to the breakthrough in epitaxial growth of GaN layers with mirror-like surface, using a metal organic chemical vapor deposition (MOCVD) technique on sapphire substrates. Since then, extensive efforts have been continued to develop a conductive buffer layer/substrate for MOCVD-grown GaN layers to improve light emission of GaN light-emitting diodes. In the present study, we produced MOCVD-grown, continuous, flat epitaxial GaN layers on nitrogen enriched TiN buffer layers with the upper limit of the nitrogen content of TiN deposited at room temperature (RT) on sapphire substrates. It was concluded that the nitrogen enrichment would reduce significantly the TiN/GaN interfacial energy. The RT deposition of the TiN buffer layers suppresses their grain growth during the nitrogen enrichment and the grain size refining must increase nucleation site of GaN. In addition, threading dislocation density in the GaN layers grown on TiN was much lower than that in the GaN layers grown on AlN.

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