Improvement in the leakage current characteristic of metal-insulator-metal capacitor by adopting RuO2 film as bottom electrode

2011 ◽  
Vol 99 (2) ◽  
pp. 022901 ◽  
Author(s):  
Jeong Hwan Han ◽  
Sora Han ◽  
Woongkyu Lee ◽  
Sang Woon Lee ◽  
Seong Keun Kim ◽  
...  
2009 ◽  
Vol 95 (11) ◽  
pp. 113502 ◽  
Author(s):  
Yung-Hsien Wu ◽  
Bo-Yu Chen ◽  
Lun-Lun Chen ◽  
Jia-Rong Wu ◽  
Min-Lin Wu

2008 ◽  
Vol 104 (5) ◽  
pp. 054510 ◽  
Author(s):  
Bing Miao ◽  
Rajat Mahapatra ◽  
Nick Wright ◽  
Alton Horsfall

2011 ◽  
Vol 519 (17) ◽  
pp. 5734-5739 ◽  
Author(s):  
C. Baristiran Kaynak ◽  
M. Lukosius ◽  
I. Costina ◽  
B.Tillack ◽  
Ch. Wenger ◽  
...  

2014 ◽  
Vol 1691 ◽  
Author(s):  
H. García ◽  
H. Castán ◽  
S. Dueñas ◽  
E. Pérez ◽  
L. A. Bailón ◽  
...  

ABSTRACTHo2O3-TiO2 based metal-insulator-metal capacitors were grown by ALD, using Ho(thd)3, Ti(OCH(CH3)2)4 and ozone as precursors. The thicknesses of the films were in the range of 7.7 to 25 nm. Some of the films were post-deposited annealed in order to study the treatment effects. The capacitors were electrically characterized. Leakage current decreases as the amount of holmium increased in the films. Resistive switching behavior was obtained in the samples where the leakage current was low. This effect was also observed in Ho2O3 films, where no titanium was present in the films.


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