Magnetic properties of very high permeability, low coercivity, and high electrical resistivity in Fe87Zr7B5Ag1amorphous alloy

1995 ◽  
Vol 77 (10) ◽  
pp. 5298-5302 ◽  
Author(s):  
B. G. Kim ◽  
J. S. Song ◽  
H. S. Kim ◽  
Y. W. Oh
Keyword(s):  
Magnetic Properties ◽  
Electrical Resistivity ◽  
High Permeability ◽  
High Electrical Resistivity ◽  
Very High

Fe–6.5% Si/SiO2 powder cores prepared by spark plasma sintering: Magnetic properties and sintering mechanism

2017 ◽  
Vol 31 (16-19) ◽  
pp. 1744011 ◽  
Author(s):  
Lili Xu ◽  
Biao Yan
Keyword(s):  
Magnetic Properties ◽  
Electrical Resistivity ◽  
Spark Plasma Sintering ◽  
Experimental Result ◽  
High Electrical Resistivity ◽  
Sintering Mechanism ◽  
Plasma Sintering ◽  
Core Losses ◽  
Spark Plasma ◽  
Insulation Effect

The Fe–6.5% Si/SiO2 powder cores were prepared by dry-type stirring ball milling and subsequent spark plasma sintering (SPS). Microstructure, magnetic properties and sintering mechanism of Fe–6.5% Si/SiO2 powder core were investigated. The experimental result indicated that Fe–6.5% Si particles were perfectly surrounded by SiO2 insulating layer with cristobalite structure. Compared with Fe–6.5% Si powder core, Fe–6.5% Si/SiO2 powder core has 20 times higher electrical resistivity ([Formula: see text]) and maintained excellent soft magnetic properties ([Formula: see text] emu/g, [Formula: see text] Oe). Core losses decreased to nearly 1/10 of those of Fe–6.5% Si powder core due to the insulation effect of SiO2 particles. Sintering mechanisms of Fe–6.5% Si/SiO2 core-shell powders during spark plasma sintering are proposed on the basis of high electrical resistivity (easy to heat) and pin effects (easy to discharge) of SiO2 particles.

Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package

2005 ◽  
Vol 2 (3) ◽  
pp. 217-222
Author(s):  
Yasunari Ukita ◽  
Kazuki Tateyama ◽  
Masao Segawa ◽  
Yoshihiko Tojo ◽  
Hideyuki Gotoh ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silver Nanoparticles ◽  
Electrical Resistivity ◽  
High Power ◽  
Lead Free ◽  
Silver Particles ◽  
Power Transistor ◽  
Silver Paste ◽  
High Electrical Resistivity ◽  
Very High

Lead-free materials are required to replace conventional lead-containing solder for environmental protection. The Pb-rich solder die mount material in a high-power transistor package is required to be replaced by a silver adhesive paste. The silver paste has disadvantages such as low thermal conductivity and high electrical resistivity, since conduction paths are achieved only by mechanical contacts between silver particles. Recently, a new conductive paste containing silver particles and silver nanoparticles with a particle size of 3–7 nm in diameter was developed. The paste shows very low electrical resistivity of 6×10−6 ohm.cm, since the silver nanoparticles can be fused at temperatures below 200°C. We have been studying the possibility of the paste as a die mount material for high-power transistor packages. It was confirmed that the paste had a very high thermal conductivity of 51 W/mK. We fabricated a high-power transistor package using this paste. As a result, the package showed lower thermal resistance than that fabricated using silver paste or lead-containing solder. Moreover, the package is sufficiently reliable that it passed the thermal cycle and pressure cooker tests. This paste can be applied to a high-power transistor package in place of lead-containing solder.

Effect of Neutron Bombardment on the Magnetic Properties of Very High Permeability Iron

1960 ◽  
Vol 31 (11) ◽  
pp. 2046-2047 ◽  
Author(s):  
G. Biorci ◽  
A. Ferro ◽  
G. Montalenti
Keyword(s):  
Magnetic Properties ◽  
High Permeability ◽  
Neutron Bombardment ◽  
Very High

scholarly journals Enhanced Magnetic Properties of FeSiAl Soft Magnetic Composites Prepared by Utilizing PSA as Resin Insulating Layer

Polymers ◽  
2021 ◽  
Vol 13 (9) ◽  
pp. 1350
Author(s):  
Hao Lu ◽  
Yaqiang Dong ◽  
Xincai Liu ◽  
Zhonghao Liu ◽  
Yue Wu ◽  
...  
Keyword(s):  
Magnetic Properties ◽  
Electrical Resistivity ◽  
High Temperatures ◽  
Core Loss ◽  
Soft Magnetic ◽  
Magnetic Composites ◽  
Thermal Stabilities ◽  
Insulating Layer ◽  
High Electrical Resistivity ◽  
Soft Magnetic Composites

Thermosetting organic resins are widely applied as insulating coatings for soft magnetic powder cores (SMPCs) because of their high electrical resistivity. However, their poor thermal stability and thermal decomposition lead to a decrease in electrical resistivity, thus limiting the annealing temperature of SMPCs. The large amount of internal stress generated by soft magnetic composites during pressing must be mitigated at high temperatures; therefore, it is especially important to find organic resins with excellent thermal stabilities. In this study, we prepared SMPCs using poly-silicon-containing arylacetylene resin, an organic resin resistant to high temperatures, as an insulating layer. With 2 wt % PSA as an insulating layer and annealed at 700 °C for 1 h, the FeSiAl SMPCs achieved the best magnetic properties, including the lowest core loss of 184 mW/cm3 (measured at 0.1 T and 50 kHz) and highest permeability of 96.

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