Solid‐phase epitaxial regrowth and dopant activation of P‐implanted metastable pseudomorphic Ge0.12Si0.88on Si(100)

1995 ◽  
Vol 77 (10) ◽  
pp. 5160-5166 ◽  
Author(s):  
D. Y. C. Lie ◽  
N. D. Theodore ◽  
J. H. Song ◽  
M.‐A. Nicolet
Keyword(s):  
Solid Phase ◽  
Dopant Activation ◽  
Epitaxial Regrowth

Supersaturated Substitutional Solid Solution after Solid Phase Epitaxial Regrowth by Incoherent Light Scanning.

1981 ◽  
Vol 4 ◽  
Author(s):  
L. Pedulli ◽  
L. Correra
Keyword(s):  
Solid Phase ◽  
Substitutional Solid Solution ◽  
Dislocation Loops ◽  
Incoherent Light ◽  
Dopant Activation ◽  
Epitaxial Regrowth ◽  
Electron Microscopy Analysis ◽  
Residual Damage ◽  
Microscopy Analysis ◽  
Minority Carriers

ABSTRACTSupersaturated substitutional solid solutions of 2×101531P+ /cm2 implanted at 10 keV in (100) Silicon were obtained after solid phase epitaxial regrowth using a scanning beam of incoherent light. The main results are: a) the maximum P+ concentration exceeds of about 5 times the maximum solid solubility at the temperature reached by the sample; b) the carrier concentration profile shows a complete dopant activation without diffusion of the implanted ions; c) an improvement of minority carriers diffusion length in the bulk is often observed; d) the values of carrier mobilities are similar to those obtained after liquid phase regrowth by pulsed ruby laser; e) a very good recovery of the damage is obtained: Rutherford backscattering spectra show that the dechanneling fraction is very close to the value of virgin samples and Trasmission Electron Microscopy analysis shows that the residual damage consists of dislocation loops of about 30 Å diameter confined in a region at about 500 Å depth.

Dopant Activation And Epitaxial Regrowth in P-Implanted Pseudomorphic Ge0.12Si0.88 Layers on Si (100)

1993 ◽  
Vol 321 ◽  
Author(s):  
D. Y. C. Lie ◽  
T. K. Cams ◽  
N. D. Theodore ◽  
F. Eisen ◽  
M.-A. Nicolet ◽  
...  
Keyword(s):  
Molecular Beam Epitaxy ◽  
Film Thickness ◽  
Electron Mobility ◽  
Room Temperature ◽  
Molecular Beam ◽  
Solid Phase ◽  
Dopant Activation ◽  
Projected Range ◽  
Epitaxial Regrowth ◽  
Virgin Sample

AbstractA pseudomorphic Ge0.12Si0.88 film 265 nm thick grown on a Si (100) substrate by molecular beam epitaxy was implanted at room temperature with a dose of 1.5 × 1015 cm2 of 100 keV P ions. The projected range of the ions is about 125 nm, which is well within the film thickness. Only the top portion of the Ge0.12Si0.88 layer was amorphized by the implantation. Both implanted and non-implanted samples were subsequently annealed in vacuum for 30 Minutes from 400 °C to 800 °C. Values of electron Hall sheet mobility and concentration in the implanted Ge0.12Si0.88 epilayer were measured after annealing. The solid phase epitaxial regrowth is complete at 550 °C, where the implanted phosphorus reaches - 100 % activation. The regrown Ge0.12Si0.88 layer exhibits inferior crystalline quality to that of the virgin sample and is relaxed, but the non-implanted portion of the film remains pseudomorphic at 550 °C. When annealed at 800 °C, the strain in the whole epilayer relaxes. The sheet electron mobility values measured at room temperature in the regrown samples (Tann ≥ 550 °C) are about 20% less than those of pure Si.

Boron Activation During Solid Phase Epitaxial Regrowth

2000 ◽  
Vol 610 ◽  
Author(s):  
C. D. Lindfors ◽  
K. S. Jones ◽  
M. E. Law ◽  
D. F. Downey ◽  
R. W. Murto
Keyword(s):  
Secondary Ion Mass Spectrometry ◽  
Solid Phase ◽  
Dose Range ◽  
Amorphous Layer ◽  
Silicon Wafers ◽  
Dopant Activation ◽  
Epitaxial Regrowth ◽  
High Concentrations ◽  
Secondary Ion ◽  
Resistance Data

AbstractTo continue scaling dimensions of transistors, higher dopant concentration levels are needed for ultra-shallow contacts. Therefore studies of dopant activation have been performed in preamorphized silicon wafers with various boron implant conditions to determine the maximum achievable dopant concentrations after Solid Phase Epitaxial Regrowth (SPER) alone. In the first experiment a silicon piece was preamorphized with a 30 keV, 1×1015 cm−2 and 90 keV, 1×1015 cm−2 Si+ implant followed by a 30 keV, 1×1015 cm−2 B+ implant. Solid phase epitaxial regrowth at 500 °C indicates that boron can be activated at low temperatures. Ultra Low Energy (ULE) implants were studied in the second experiment. Silicon wafers were implanted with 2.5 keV, 1×1015 cm−2 Si+ to amorphize and then B+ was implanted at 0.5 keV in the dose range of 1×1015 to 9×1015 cm−2. Samples were annealed in the temperature range of 500 to 650 °C. High concentrations of boron make it difficult to fully regrow amorphous layers and thus yield marginal electrical properties. Much of the boron remains inactive, particularly at the higher dose implants. In both experiments Variable Angle Spectroscopic Ellipsometry (VASE) is used to measure amorphous layer thickness and Hall effect measures active boron dose. For the first experiment, Secondary Ion Mass Spectrometry (SIMS) data compares chemical dose to active dose during the regrowth process. Sheet resistance data is obtained from a four point probe for the ULE implant experiment.

Performance of (110) p-channel SOI-MOSFETs fabricated by deep-amorphization and solid-phase epitaxial regrowth processes

2011 ◽  
Vol 88 (7) ◽  
pp. 1265-1268
Author(s):  
A. Ohata ◽  
Y. Bae ◽  
T. Signamarcheix ◽  
J. Widiez ◽  
B. Ghyselen ◽  
...  
Keyword(s):  
Solid Phase ◽  
Epitaxial Regrowth

Solid phase epitaxial regrowth of Si1−xGex/Si strained‐layer structures amorphized by ion implantation

1989 ◽  
Vol 54 (1) ◽  
pp. 42-44 ◽  
Author(s):  
B. T. Chilton ◽  
B. J. Robinson ◽  
D. A. Thompson ◽  
T. E. Jackman ◽  
J.‐M. Baribeau
Keyword(s):  
Ion Implantation ◽  
Solid Phase ◽  
Strained Layer ◽  
Epitaxial Regrowth ◽  
Layer Structures

USJ formation using solid phase epitaxial regrowth and femtosencond laser anneal

2012 ◽  
Author(s):  
Tzu-Lang Shih ◽  
Sheng-Wen Chen ◽  
Chang-Peng Wu ◽  
Chung-Wei Cheng ◽  
Chih-Wei Chien ◽  
...  
Keyword(s):  
Solid Phase ◽  
Epitaxial Regrowth ◽  
Laser Anneal

scholarly journals Atomistic modeling of the Ge composition dependence of solid phase epitaxial regrowth in SiGe alloys

2017 ◽  
Vol 122 (10) ◽  
pp. 105702
Author(s):  
M. Prieto-Depedro ◽  
A. Payet ◽  
B. Sklénard ◽  
I. Martin-Bragado
Keyword(s):  
Composition Dependence ◽  
Solid Phase ◽  
Atomistic Modeling ◽  
Epitaxial Regrowth

Impact of rapid thermal annealing and hydrogenation on the doping concentration and carrier mobility in solid phase crystallized poly-Si thin films

2011 ◽  
Vol 1321 ◽  
Author(s):  
A. Kumar ◽  
P.I. Widenborg ◽  
H. Hidayat ◽  
Qiu Zixuan ◽  
A.G. Aberle
Keyword(s):  
Thin Films ◽  
Electronic Properties ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Carrier Mobility ◽  
Crystalline Silicon ◽  
Solid Phase ◽  
Dopant Activation ◽  
Hall Effect Measurements ◽  
Probe Measurements

ABSTRACTThe effect of the rapid thermal annealing (RTA) and hydrogenation step on the electronic properties of the n+ and p+ solid phase crystallized (SPC) poly-crystalline silicon (poly-Si) thin films was investigated using Hall effect measurements and four-point-probe measurements. Both the RTA and hydrogenation step were found to affect the electronic properties of doped poly-Si thin films. The RTA step was found to have the largest impact on the dopant activation and majority carrier mobility of the p+ SPC poly-Si thin films. A very high Hall mobility of 71 cm2/Vs for n+ poly-Si and 35 cm2/Vs for p+ poly-Si at the carrier concentration of 2×1019 cm-3 and 4.5×1019 cm-3, respectively, were obtained.

Leakage optimization of ultra-shallow junctions formed by solid phase epitaxial regrowth

2004 ◽  
Vol 22 (1) ◽  
pp. 306 ◽  
Author(s):  
R. Lindsay ◽  
K. Henson ◽  
W. Vandervorst ◽  
K. Maex ◽  
B. J. Pawlak ◽  
...  
Keyword(s):  
Solid Phase ◽  
Epitaxial Regrowth ◽  
Shallow Junctions ◽  
Ultra Shallow Junctions

Time-Resolved Reflectivity Study of Solid-Phase Epitaxial Regrowth in Relaxed and Strained Si1−xGex Epilayers

1992 ◽  
Vol 281 ◽  
Author(s):  
T. E. Haynes ◽  
C. Lee ◽  
K. S. Jones
Keyword(s):  
Composition Dependence ◽  
Solid Phase ◽  
Strain Relaxation ◽  
Alloy Layer ◽  
Atomic Fraction ◽  
Bulk Alloy ◽  
Strained Layers ◽  
Time Resolved ◽  
Epitaxial Regrowth ◽  
Different Types

ABSTRACTThe rate of solid-phase epitaxial regrowth has been studied using time-resolved reflectivity in three different types of SiGe/Si epilayers amorphized by ion implantation. In two of these cases, the alloy epilayer contained either 12% or 20% Ge, and the amorphization depth was greater than the thickness (2000 Å) of the SiGe alloy layer. Time-resolved reflectivity measurements showed that the rate of regrowth was not constant in these two cases, but first decreased after passing the SiGe/Si interface, and then increased. The minimum regrowth rate occurred closer to the SiGe/Si interface in the epilayers with the larger Ge atomic fraction. In the third type of sample, the alloy epilayer thickness was ∼7μm, so that the initial epilayer (15% Ge) had the lattice constant of the bulk alloy. Furthermore, amorphization and regrowth occurred entirely within the relaxed alloy layer. In this case, the regrowth rate was constant. The composition dependence of the regrowth-rate transient in the strained layers is discussed in the context of a ‘critical-thickness’ model of strain relaxation.

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