Effect of stress sign and film thickness on interface nucleation of misfit dislocations in strained multilayers

1994 ◽  
Vol 75 (10) ◽  
pp. 4990-4993 ◽  
Author(s):  
Hyo‐Hoon Park ◽  
Ji Beom Yoo ◽  
Dae Kon Oh ◽  
Jeong Soo Kim ◽  
Jeong Yong Lee
Keyword(s):  
Film Thickness ◽  
Misfit Dislocations

Magnetic Anisotropy of Crystalline Defects

1991 ◽  
Vol 231 ◽  
Author(s):  
B.M. Clemens ◽  
R.L. White ◽  
W.D. Nix ◽  
J.A. Bain
Keyword(s):  
Film Thickness ◽  
Magnetic Anisotropy ◽  
Strain Field ◽  
Coherency Strain ◽  
Misfit Dislocations ◽  
Surface Anisotropy ◽  
Crystalline Defects ◽  
Preferred Direction ◽  
Coherency Strains

AbstractWe consider the anisotropies due to coherency strains and the inilioliogcliotis stratlus associated with misfit dislocations, both of which give rise to anisotropy through maguctostrictive coupling. Coherency strains can give rise to anl apparent surface anisotrnpy due to the decrease in coherency strain with the film thickness. This anisotropy is comparable in magnitude to that observed experimentally for Fe [110] epitaxial thiut films on W [110]. The strain field associated with misfit dislocations produces a. surface anisotropy which is also comparable in magnitude to experimentally observed anisotropies. Dislocatioms along the inplane [001] and [110] directions both produce the same preferred direction of maguctization orientation.

Misfit Strain Relief Beyond the Critical Thickness Using Curvature Measurements and in Situ Characterization of the Magneto-Optic Kerr Effect

1994 ◽  
Vol 356 ◽  
Author(s):  
H. E. Inglefield ◽  
G. Bochi ◽  
C. A. Ballentine ◽  
R. C. O’Handley ◽  
C. V. Thompson
Keyword(s):  
Film Thickness ◽  
Magnetic Anisotropy ◽  
Kerr Effect ◽  
Critical Thickness ◽  
Misfit Strain ◽  
Misfit Dislocations ◽  
Wafer Curvature ◽  
Curvature Measurements ◽  
Magneto Optic

AbstractEpitaxial misfit has been characterized in Ni/Cu/Si (100) as a function of Ni film thickness using wafer curvature measurements. This strain can be related to measurements of magnetic anisotropy made in the deposition system using the magneto-optic Kerr effect. Films were deposited using molecular beam epitaxy (MBE) with varying Ni epilayer thickness between 10 and 1000Å. The change in wafer curvature due to misfit strain was measured using optical interferometry and the strain was calculated using Stoney’s equation. Transmission electron microscopy was used to characterize misfit dislocations at the Ni/Cu interface. It has been determined that misfit strain can have a very strong effect on magnetic anisotropy, particularly in the regime between the critical thickness and complete misfit accommodation, where strain has been found to decrease significantly as a function of film thickness. A critical strain has been determined at which a transition in the direction of magnetization easy axis from perpendicular to the film to in the film plane occurs. This discovery allows the use of Kerr effect measurements to characterize misfit strain in situ.

Dislocation Behaviour in GexSi1-x Epilayers on (001)Si

1989 ◽  
Vol 160 ◽  
Author(s):  
Eric P. Kvam ◽  
D.M. Maher ◽  
C.J. Humphreys
Keyword(s):  
Dislocation Density ◽  
Film Thickness ◽  
Critical Thickness ◽  
Three Dimensional ◽  
Critical Value ◽  
Misfit Dislocations ◽  
Island Growth ◽  
Edge Type ◽  
Dislocation Behaviour ◽  
Step Mechanism

AbstractWe have observed that the nature of misfit dislocations introduced near the critical thickness in GexSi1-x alloys on (001)Si changes markedly in the region 0.4 ≤ x ≤ 0.5. At or below the lower end of this compositional range, the observed microstructure is comprised almost entirely of 60° type dislocations, while at the high end, the dislocation structure is almost entirely Lomer edge type. Concurrent with this change, the dislocation density at the top of the epilayer varies by a factor of about 60X. Similarly, several other observables (e.g. dislocation length and spacing) also change appreciably.Part of the reason for the morphological variation seems to be a change in the source for dislocation introduction, in conjunction with a change in glide behaviour of dislocations as a function of film thickness. Evidence will be presented that indicates strain, as well as thickness, has a critical value for some dislocation introduction mechanisms, and that these together determine the resulting microstructure.Furthermore, it appears unlikely that the edge-type Lomer dislocations which appear at about x = 0.5 are either introduced directly, by climb, or grown in, as in the three-dimensional island growth and coalescence which occurs when x approaches unity. Instead, a two-step mechanism involving glissile dislocations is proposed and discussed.

A TEM study of microstructures of YBa2Cu3O7−x thin films deposited on LaAlO3 by laser ablation

1991 ◽  
Vol 6 (9) ◽  
pp. 1823-1828 ◽  
Author(s):  
S.N. Basu ◽  
A.H. Carim ◽  
T.E. Mitchell
Keyword(s):  
Thin Films ◽  
Laser Ablation ◽  
Film Thickness ◽  
Single Crystal ◽  
Grain Boundaries ◽  
Misfit Dislocations ◽  
High Angle ◽  
Interfacial Structures ◽  
High Degree ◽  
Periodic Spacing

The microstructures of YBa2Cu3O7−x thin films deposited by laser ablation on single crystal (001) LaAlO3 substrates have been investigated. The orientation of the YBa2Cu3O7−x layer next to the interface is found to be completely c-perpendicular, with a high degree of epitaxy between the film and the substrate. Misfit dislocations, with a periodic spacing of around 13 nm, are present at the interface. Two distinct interfacial structures are seen in these films. At a film thickness of around 400 nm, nucleation of c-parallel grains occurs, leading to a switchover from a c, and, and-perpendicular to a c-parallel microstructure. Amorphous particulates, ejected from the target during processing, lead to the formation of misoriented grains, giving rise to high-angle grain boundaries in the film.

Tuning the Tunability in Epitaxial Barium Strontium Titanate Film via Internal Stresses

2002 ◽  
Vol 748 ◽  
Author(s):  
Z.-G. Ban ◽  
S. P. Alpay
Keyword(s):  
Film Thickness ◽  
Strontium Titanate ◽  
Barium Strontium Titanate ◽  
Film Growth ◽  
Structural Phase ◽  
Misfit Strain ◽  
Substrate Material ◽  
Internal Stresses ◽  
Misfit Dislocations ◽  
Barium Strontium

ABSTRACTThe tunability of epitaxial barium strontium titanate films is analyzed theoretically for the first time using a modified phenomenological Landau-Devonshire approach taking into account the formation of unusual ferroelectric phases that cannot form in bulk and single-crystal ceramics. It is shown that enhanced tunability can be achieved by adjusting the misfit strain especially in the vicinity of a structural phase transformation. The internal stresses in epitaxial films as characterized by the misfit strain can be controlled by changing the substrate material and/or varying the film thickness. The latter is due to the possibility of stress relaxation by formation of misfit dislocations that relieve epitaxial stresses at film growth temperature. Based on the thermodynamic model, we provide quantitative estimations of tunability of (001) Ba0.5Sr0.5TiO3 films on (001) LaAlO3 (LAO) and SrTiO3 (STO) as a function of film thickness. The analysis indicates that films on STO substrates should be as thick as possible in order to achieve optimum tunability. To obtain maximum tunability on LAO substrates, the thickness of films should be as close as possible to a critical film thickness (∼120 nm).

Misfit Strain Driven Phase Transformations in Epitaxial Barium Strontium Titanate Films

2002 ◽  
Vol 718 ◽  
Author(s):  
Z.-G. Ban ◽  
S. P. Alpay
Keyword(s):  
Film Thickness ◽  
Strontium Titanate ◽  
Barium Strontium Titanate ◽  
Misfit Strain ◽  
Design Parameters ◽  
Misfit Dislocations ◽  
Barium Strontium ◽  
Bst Films ◽  
The One ◽  
Selection Of

AbstractWe develop phase diagrams for single domain epitaxial barium strontium titanate films on cubic substrates as a function of the misfit strain based on a Landau-Devonshire phenomenological model similar to the one developed by Pertsev et al. [Phys. Rev. Lett. 80, 1988 (1998)]. Unusual ferroelectric phases that are not possible in single crystals and bulk ceramics are demonstrated in epitaxially constrained BST films. The misfit strain is correlated with the film thickness quantitatively by taking into account the formation of misfit dislocations that relieve epitaxial stresses during deposition. Theoretical estimation of the dielectric constant of (001) Ba0.7Sr0.3TiO3 and Ba0.6Sr0.4TiO3 films grown on Si, MgO, LaAlO3, and SrTiO3 substrates as a function of film thickness is provided. It is shown that the selection of the substrate and the film thickness can be chosen as design parameters to manipulate the internal stress level in the film to achieve enhanced dielectric response.

Surface Films on Zircaloy-2 Samples Cracked in Neutral Aqueous NaCl by Stress Corrosion

1973 ◽  
Vol 31 ◽  
pp. 46-47
Author(s):  
R.A. Ploc
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Film Thickness ◽  
Stress Corrosion ◽  
Zirconium Dioxide ◽  
Surface Film ◽  
Surface Films ◽  
Continuous Layer ◽  
Transmission Electron ◽  
Product Film

Samples of low-nickel Zircaloy-2 (material MLI-788-see(1)), when anodically polarized in neutral 5 wt% NaCl solutions, were found to be susceptible to pitting and stress corrosion cracking. The SEM revealed that pitting of stressed samples was occurring below a 2000Å thick surface film which behaved differently from normal zirconium dioxide in that it did not display interference colours. Since the initial film thickness was approximately 65Å, attempts were made to examine the product film by transmission electron microscopy to deduce composition and how the corrosion environment could penetrate the continuous layer.

Structural aspects of silicon diffusion in quaternary III-V thin-film semiconductors

1991 ◽  
Vol 49 ◽  
pp. 850-851
Author(s):  
F. A. Ponce ◽  
R. L. Thornton ◽  
G. B. Anderson
Keyword(s):  
Semiconductor Lasers ◽  
Wide Bandgap ◽  
Semiconductor Diode ◽  
Visible Range ◽  
P System ◽  
Misfit Dislocations ◽  
Lattice Match ◽  
Semiconductor Diode Laser ◽  
Thin Film Semiconductors ◽  
Silicon Diffusion

The InGaAlP quaternary system allows the production of semiconductor lasers emitting light in the visible range of the spectrum. Recent advances in the visible semiconductor diode laser art have established the viability of diode structures with emission wavelengths comparable to the He-Ne gas laser. There has been much interest in the growth of wide bandgap quaternary thin films on GaAs, a substrate most commonly used in optoelectronic applications. There is particular interest in compositions which are lattice matched to GaAs, thus avoiding misfit dislocations which can be detrimental to the lifetime of these materials. As observed in Figure 1, the (AlxGa1-x)0.5In0.5P system has a very close lattice match to GaAs and is favored for these applications.In this work, we have studied the effect of silicon diffusion in GaAs/InGaAlP structures. Silicon diffusion in III-V semiconductor alloys has been found to have an disordering effect which is associated with removal of fine structures introduced during growth. Due to the variety of species available for interdiffusion, the disordering effect of silicon can have severe consequences on the lattice match at GaAs/InGaAlP interfaces.

(111) Monocrystalline Nickel Films

1972 ◽  
Vol 30 ◽  
pp. 512-513
Author(s):  
T.E. Pratt ◽  
R.W. Vook
Keyword(s):  
Film Thickness ◽  
Deposition Rate ◽  
Room Temperature ◽  
Narrow Range ◽  
High Vacuum ◽  
Residual Pressure ◽  
Temperature Dependent ◽  
Deposition Parameters ◽  
Transmission Electron ◽  
Substrate Temperatures

(111) oriented thin monocrystalline Ni films have been prepared by vacuum evaporation and examined by transmission electron microscopy and electron diffraction. In high vacuum, at room temperature, a layer of NaCl was first evaporated onto a freshly air-cleaved muscovite substrate clamped to a copper block with attached heater and thermocouple. Then, at various substrate temperatures, with other parameters held within a narrow range, Ni was evaporated from a tungsten filament. It had been shown previously that similar procedures would yield monocrystalline films of CU, Ag, and Au.For the films examined with respect to temperature dependent effects, typical deposition parameters were: Ni film thickness, 500-800 A; Ni deposition rate, 10 A/sec.; residual pressure, 10-6 torr; NaCl film thickness, 250 A; and NaCl deposition rate, 10 A/sec. Some additional evaporations involved higher deposition rates and lower film thicknesses.Monocrystalline films were obtained with substrate temperatures above 500° C. Below 450° C, the films were polycrystalline with a strong (111) preferred orientation.

In situ TEM measurements of the electrical properties of interface dislocations

1992 ◽  
Vol 50 (2) ◽  
pp. 1338-1339
Author(s):  
F. M. Ross ◽  
R. Hull ◽  
D. Bahnck ◽  
J. C. Bean ◽  
L. J. Peticolas ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Electronic Device ◽  
In Situ Tem ◽  
Device Performance ◽  
Misfit Dislocations ◽  
Electrical Characteristics ◽  
Strained Layer ◽  
Transmission Electron ◽  
Interfacial Dislocations

We describe an investigation of the electrical properties of interfacial dislocations in strained layer heterostructures. We have been measuring both the structural and electrical characteristics of strained layer p-n junction diodes simultaneously in a transmission electron microscope, enabling us to correlate changes in the electrical characteristics of a device with the formation of dislocations.The presence of dislocations within an electronic device is known to degrade the device performance. This degradation is of increasing significance in the design and processing of novel strained layer devices which may require layer thicknesses above the critical thickness (hc), where it is energetically favourable for the layers to relax by the formation of misfit dislocations at the strained interfaces. In order to quantify how device performance is affected when relaxation occurs we have therefore been investigating the electrical properties of dislocations at the p-n junction in Si/GeSi diodes.

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