Radiation‐induced interface‐state generation in reoxidized nitrided SiO2

1992 ◽  
Vol 71 (2) ◽  
pp. 1029-1031 ◽  
Author(s):  
V. Ramgopal Rao ◽  
J. Vasi
1986 ◽  
Vol 33 (6) ◽  
pp. 1177-1184 ◽  
Author(s):  
J. R. Schwank ◽  
P. S. Winokur ◽  
F. W. Sexton ◽  
D. M. Fleetwood ◽  
J. H. Perry ◽  
...  

Author(s):  
Zhicheng Wu ◽  
Jacopo Franco ◽  
Brecht Truijen ◽  
Philippe Roussel ◽  
Ben Kaczer ◽  
...  

1988 ◽  
Vol 27 (Part 2, No. 12) ◽  
pp. L2395-L2397 ◽  
Author(s):  
Naoki Yasuda ◽  
Hiroshi Nakamura ◽  
Kenji Taniguchi ◽  
Chihiro Hamaguchi ◽  
Masakazu Kakumu

1994 ◽  
Vol 342 ◽  
Author(s):  
S.C. Sun ◽  
L.S. Wang ◽  
F.L. Yeh ◽  
T.S. Lai ◽  
Y.H. Lin

ABSTRACTIn this paper, a detailed study is presented for the growth kinetics of rapid thermal oxidation of lightly-doped silicon in N2O and O2 on (100), (110), and (111) oriented substrates. It was found that (110)-oriented Si has the highest growth rate in both N2O and dry O2, and (100) Si has the lowest rate. There is no “crossover” on the growth rate of rapid thermal N2O oxidation between (110) Si and (111) Si as compared to oxides grown in furnace N2O. Pressure dependence of rapid thermal N2O oxidation is reported for the first time. MOS capacitor results show that the low-pressure (40 Torr) N2O-grown oxides have much less interface state generation and charge trapping under constant current stress as compared to oxides grown in either 760 Torr N2O or O2 ambient.


2003 ◽  
Vol 93 (10) ◽  
pp. 6107-6116 ◽  
Author(s):  
J. F. Zhang ◽  
C. Z. Zhao ◽  
G. Groeseneken ◽  
R. Degraeve

1995 ◽  
Vol 38 (2) ◽  
pp. 477-480 ◽  
Author(s):  
R.M. Patrikar ◽  
R. Lal ◽  
J. Vasi

Sign in / Sign up

Export Citation Format

Share Document