Erratum: “In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper” [J. Appl. Phys. 105, 023521 (2009)]

2010 ◽  
Vol 108 (9) ◽  
pp. 099901 ◽  
Author(s):  
Di Xu ◽  
Vinay Sriram ◽  
Vidvuds Ozolins ◽  
Jenn-Ming Yang ◽  
K. N. Tu ◽  
...  
Keyword(s):  
In Situ Measurements ◽  
Pulse Electrodeposition ◽  
Stress Evolution

In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper

2009 ◽  
Vol 105 (2) ◽  
pp. 023521 ◽  
Author(s):  
Di Xu ◽  
Vinay Sriram ◽  
Vidvuds Ozolins ◽  
Jenn-Ming Yang ◽  
K. N. Tu ◽  
...  
Keyword(s):  
In Situ Measurements ◽  
Pulse Electrodeposition ◽  
Stress Evolution

Layered intermetallic compounds and stress evolution in Sn and Ni(P) films

2007 ◽  
Vol 22 (7) ◽  
pp. 2025-2031 ◽  
Author(s):  
Jae Yong Song
Keyword(s):  
Phase Transformation ◽  
Tensile Stress ◽  
Intermetallic Compounds ◽  
In Situ Measurements ◽  
The Self ◽  
Stress Evolution

In situ measurements of stresses due to the phase transformation in Sn and Ni(P) films were analyzed relating to the formation of layered intermetallic compounds such as Ni3Sn4, Ni3Sn2, Ni3P, and the crystallization of Ni(P) films. When Sn/Ni(11.7P) films were heated up to 480 °C, the first tensile stress developed due to formation of Ni3Sn4 and Ni3P around 220 °C, and the second one appeared at 335 °C due to formation of Ni3Sn2 as well as the self-crystallization of Ni(11.7P). For Sn/Ni(3P), a tensile stress developed mildly with the temperature between 300 and 410 °C due to formation of Ni3Sn2 and precipitation of Ni3P. The onset temperatures of self-crystallization of Ni(P) and Ni3P precipitation decreased due to the Ni–Sn reaction.

Stress Evolution During Growth of Sputtered Ni/Cu Multilayers

1998 ◽  
Vol 528 ◽  
Author(s):  
Vidya Ramaswamy ◽  
Bruce M. Clemens ◽  
William D. Nix
Keyword(s):  
Stress Relaxation ◽  
Relaxation Process ◽  
Relaxation Mechanism ◽  
In Situ Measurements ◽  
Stress Evolution ◽  
Uniform Compression ◽  
Uniform Tension ◽  
Defect Densities ◽  
High Defect Densities

AbstractResults from in-situ measurements of stress during growth of (111)-textured Ni/Cu multilayers with small and large bilayer periods are presented. In multilayers with small bilayer periods, Ni is in uniform tension and Cu in uniform compression. This behavior is modeled as the growth of a coherent multilayer with alloying in the layers. In multilayers with large bilayer periods, stress relaxation is observed but the measured stresses are much lower than expected based on a Mathews-Blakeslee relaxation process. An alternative stress relaxation mechanism based on high defect densities is presented and discussed.

scholarly journals In situ measurements of stress evolution in silicon thin films during electrochemical lithiation and delithiation

2010 ◽  
Vol 195 (15) ◽  
pp. 5062-5066 ◽  
Author(s):  
Vijay A. Sethuraman ◽  
Michael J. Chon ◽  
Maxwell Shimshak ◽  
Venkat Srinivasan ◽  
Pradeep R. Guduru
Keyword(s):  
Thin Films ◽  
In Situ Measurements ◽  
Stress Evolution ◽  
Silicon Thin Films ◽  
Electrochemical Lithiation

In-situ measurements of stress evolution in composite sulfur cathodes

2019 ◽  
Vol 16 ◽  
pp. 491-497 ◽  
Author(s):  
Yuwei Zhang ◽  
Yuting Luo ◽  
Coleman Fincher ◽  
Scott McProuty ◽  
Garrett Swenson ◽  
...  
Keyword(s):  
In Situ Measurements ◽  
Stress Evolution ◽  
Sulfur Cathodes
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