scholarly journals Controlling the thermal contact resistance of a carbon nanotube heat spreader

2010 ◽  
Vol 97 (6) ◽  
pp. 063105 ◽  
Author(s):  
Kamal H. Baloch ◽  
Norvik Voskanian ◽  
John Cumings
Keyword(s):  
Carbon Nanotube ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Heat Spreader

Surface Chemistry and Characteristics Based Model for the Thermal Contact Resistance of Fluidic Interstitial Thermal Interface Materials

2001 ◽  
Vol 123 (5) ◽  
pp. 969-975 ◽  
Author(s):  
Ravi S. Prasher
Keyword(s):  
Experimental Data ◽  
Thermal Conductivity ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Interface Materials ◽  
Heat Spreader ◽  
Thermal Interface ◽  
Thermal Solution ◽  
Interface Materials

Microprocessor powers are increasing at a phenomenal rate, which requires very small thermal resistance between the die (chip) and the ambient, if the current economical methods of conduction and convection cooling are to be utilized. A typical thermal solution in flip chip technology utilizes two levels of thermal interface materials: between the die and the heat spreader, and between the heat spreader and the heat sink. Phase change materials and thermal greases are among the most prominent interstitial thermal interface materials (TIM) used in electronic packaging. These TIMs are typically polymeric matrix loaded with highly conducting filler particles. The dwindling thermal budget has necessitated a better understanding of the thermal resistance of each component of the thermal solution. Thermal conductivity of these particle-laden materials is better understood than their contact resistance. A careful review of the literature reveals the lack of analytical models for the prediction of contact resistance of these types of interstitial materials, which possess fluidic properties. This paper introduces an analytical model for the thermal contact resistance of these types of interstitial materials. This model is compared with the experimental data obtained on the contact resistance of these TIMs. The model, which depends on parameters such as, surface tension, contact angle, thermal conductivity, roughness and pressure matches very well with the experimental data at low pressures and is still within the error bars at higher pressures.

A Model of the Contact Thermal Resistance of Vertical Carbon Nanotube Arrays

2016 ◽  
Author(s):  
Jin Zhang ◽  
Bo Shi
Keyword(s):  
Carbon Nanotube ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Interfacial Thermal Resistance ◽  
Elastic Rod ◽  
Aligned Carbon Nanotubes ◽  
Vertically Aligned ◽  
Thin Elastic Rod

This paper developes a model to predict the thermal contact resistance of the vertically aligned carbon nanotubes (VACNTs). The model includes the effects of CNT array properties and surface roughness, with the aim of providing useful information for optimizing CNT array thermal contact resistance. The contact resistance is consisted of two parts: interfacial thermal resistance and constriction thermal resistance. The carbon nanotube (CNT) is treated as a thin elastic rod and macroscopic mechanical is used to calculate the mechanical properties of CNT. Greenwood-Williamson (GW) model is used to describe the roughness. The interfacial thermal resistance is calculated by molecular dynamics. The calculated values are in good agreement with experimental data. The interfacial thermal resistance is the domain major factor.

THERMAL CONTACT RESISTANCE MATCHING TO OPTIMIZE PERFORMANCE IN THERMOELECTRIC GENERATORS

2020 ◽  
Vol 27 (7) ◽  
pp. 617-627
Author(s):  
Yuanyuan Tian ◽  
Mengjun Zhang ◽  
Junli Wang ◽  
Anbang Liu ◽  
Huaqing Xie ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermoelectric Generators
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