Luminescence study of rapid thermal annealing of ion implantation damage in cadmium telluride

1986 ◽  
Vol 60 (10) ◽  
pp. 3699-3710 ◽  
Author(s):  
K. M. James ◽  
J. L. Merz ◽  
C. E. Jones
1988 ◽  
Vol 144 ◽  
Author(s):  
A. G. Cullis ◽  
D. C. Jacobson ◽  
J. M. Poate ◽  
N. G. Chew ◽  
C. R. Whitehouse ◽  
...  

ABSTRACTThe implantation of Ar+ ions into AlAs/GaAs layered samples is shown to give very different damage structures in the two materials. While the GaAs is relatively easily amorphised, the AlAs is quite resistant to damage accumulation and remains crystalline for the ion doses employed in these investigations. The behaviour of the different damage structures when subjected to rapid thermal annealing treatments is described in some detail. It is demonstrated that differences in the initial damage state have a strong influence upon the nature of lattice defects produced by annealing.


1992 ◽  
Vol 72 (1) ◽  
pp. 73-77 ◽  
Author(s):  
H. B. Erzgräber ◽  
P. Zaumseil ◽  
E. Bugiel ◽  
R. Sorge ◽  
K. Tittelbach‐Helmrich ◽  
...  

1989 ◽  
Vol 147 ◽  
Author(s):  
Samuel Chen ◽  
S.-Tong Lee ◽  
G. Braunstein ◽  
G. Rajeswaran ◽  
P. Fellinger

AbstractDefects induced by ion implantation and subsequent annealing are found to either promote or suppress layer intermixing in Ill-V compound semiconductor superlattices (SLs). We have studied this intriguing relationship by examining how implantation and annealing conditions affect defect creation and their relevance to intermixing. Layer intermixing has been induced in SLs implanted with 220 keV Si+ at doses < 1 × 1014 ions/cm2 and annealed at 850°C for 3 hrs or 1050°C for 10 s. Upon furnace annealing, significant Si in-diffusion is observed over the entire intermixed region, but with rapid thermal annealing layer intermixing is accompanied by negligible Si movement. TEM showed that the totally intermixed layers are centered around a buried band of secondary defects and below the Si peak position. In the nearsurface region layer intermixing is suppressed and is only partially completed at ≤1 × 1015 Si/cm2. This inhibition is correlated to a loss of the mobile implantation-induced defects, which are responsible for intermixing.


2017 ◽  
Vol 05 (01) ◽  
pp. 15-25
Author(s):  
Junji Yamanaka ◽  
Shigenori Inoue ◽  
Keisuke Arimoto ◽  
Kiyokazu Nakagawa ◽  
Kentarou Sawano ◽  
...  

1985 ◽  
Vol 52 ◽  
Author(s):  
D. L. Kwong ◽  
N. S. Alvi ◽  
Y. H. Ku ◽  
A. W. Cheung

ABSTRACTDouble-diffused shallow junctions have been formed by ion implantation of both phosphorus and arsenic ions into silicon substrates and rapid thermal annealing. Experimental results on defect removal, impurity activation and redistribution, effects of Si preamorphization, and electrical characteristics of Ti-silicided junctions are presented.


1986 ◽  
Vol 69 ◽  
Author(s):  
D. Kirillov ◽  
P. Ho ◽  
G. A. Davis

AbstractRaman scattering was applied to study mixing of GaAs/AlAs superlattices. Different implantation ions and doses were used. The evolution from partially amorphous to completely amorphous and from partially mixed to completely mixed structures was observed. Rapid thermal annealing caused recrystallization of the damaged material. Different types of structures were obtained, depending on the implantation doses and species of ions. Completely mixed crystalline alloys could be obtained only for high implantation doses.


1987 ◽  
Vol 5 (9) ◽  
pp. 311-314 ◽  
Author(s):  
M.C. Ozturk ◽  
J.J. Wortman ◽  
W.K. Chu ◽  
G. Rozgonyi ◽  
D.P. Griffis

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