Erratum: ‘‘Thermionic emission diffusion model of current conduction in polycrystalline silicon and temperature dependence of mobility’’ [J. Appl. Phys. 57, 2793 (1985)]

1986 ◽  
Vol 59 (4) ◽  
pp. 1404-1404
Author(s):  
S. N. Singh ◽  
R. Kishore ◽  
P. K. Singh
Keyword(s):  
Temperature Dependence ◽  
Diffusion Model ◽  
Polycrystalline Silicon ◽  
Thermionic Emission ◽  
Current Conduction

scholarly journals A Study of a-Sic/C-Si(n) Isotype Heterojunctions

1993 ◽  
Vol 16 (1) ◽  
pp. 55-64 ◽  
Author(s):  
N. Georgoulas ◽  
L. Magafas ◽  
A. Thanailakis
Keyword(s):  
Temperature Dependence ◽  
Crystalline Silicon ◽  
Diffusion Mechanism ◽  
Thermionic Emission ◽  
Reverse Current ◽  
Emission Mechanism ◽  
Drift Diffusion ◽  
Si Substrates ◽  
Current Voltage ◽  
Capacitance Voltage

In the present work a study of the electrical properties of heterojunctions between rf sputtered amorphous silicon carbide (a-SiC) thin films and n-type crystalline silicon (c-Si) substrates is reported. The current-voltage (I-V) and capacitance-voltage (C-V) characteristics, as well as the temperature dependence of the current of a-SiC/c-Si(n) heterojunctions were measured. The I-V characteristics of a-SiC/ c-Si(n) heterojunctions exhibit poor rectification properties, with a high reverse current, at higher temperatures (T > 250K), whereas good rectification properties are obtained at lower temperatures (T < 250K). It was found that the a-SiC/c-Si(n) heterojunctions are isotype, suggesting that-the conductivity of a-SiC is n-type. The temperature dependence of the current (from 185K to 320K) showed that the majority carriers of c-Si(n) (i.e. electrons) are transported from c-Si(n) to a-SiC mainly by the thermionic emission mechanism, or by the drift-diffusion mechanism. From C-V measurements of a-SiC/c-Si(n) heterojunctions the electron affinity of a-SiC was found to be X1= 4.20 ± 0.04 eV. Finally, the a-SiC/ c-Si(n) isotype heterojunctions are expected to be interesting devices as infrared

Metastable Defect Kinetics in Hydrogen Passivated Polycrystalline Silicon

1994 ◽  
Vol 336 ◽  
Author(s):  
N. H. Nickel ◽  
R. A. Street ◽  
W. B. Jackson ◽  
N. M. Johnson
Keyword(s):  
Temperature Dependence ◽  
Polycrystalline Silicon ◽  
Direct Evidence ◽  
Slow Cool ◽  
Dark Conductivity ◽  
Active Hydrogen ◽  
Thermally Activated ◽  
Rate Dependent ◽  
Si Films ◽  
Metastable Defect

ABSTRACTThe temperature dependence of the dark conductivity, σD, of unhydrogenated and hydrogen passivated polycrystalline silicon (poly-Si) films was Measured. While σD of unhydrogenated poly-Si did not exhibit any influence of thermal treatment prior to the measurement, striking effects were observed in hydrogenated poly-Si films. Below 268 K a cooling-rate dependent metastable change of σD is observed. The dark conductivity increases by more than 8 orders of magnitude. This frozen-in state is metastable: Annealing and a slow cool restore the temperature dependence of the relaxed state. The time and temperature dependence of the relaxation reveal that this process is thermally activated with 0.74 eV. The lack of the quenching metastability in unhydrogenated poly-Si is direct evidence that the metastable changes in σD are due to the formation and dissociation of an electrically active hydrogen complex, in the grain-boundary regions.

Impact of Grain Boundary Character on Electrical Property in Polycrystalline Silicon

1999 ◽  
Vol 586 ◽  
Author(s):  
Shu Hamada ◽  
Koichi Kawahara ◽  
Sadahiro Tsurekawa ◽  
Tadao Watanabe ◽  
Takashi Sekiguchi
Keyword(s):  
Electrical Activity ◽  
Temperature Dependence ◽  
Grain Boundaries ◽  
Band Gap ◽  
Misorientation Angle ◽  
Polycrystalline Silicon ◽  
Dominant Role ◽  
Localized States ◽  
Localized State ◽  
The Difference

ABSTRACTGrain boundaries in polycrystalline silicon are most likely to generate localized states in band gap. The localized states play a dominant role in determining the performance of solar cells by acting as traps or recombination center of carriers. In the present investigation, the scanning electron microscope - electron channeling pattern(SEM/ECP) method and SEM - electron back scattered diffraction pattern(SEM/EBSD) technique were applied to characterize the grain boundaries in p-type polycrystalline silicon with 99.999%(5N) in purity. Thereafter, temperature dependence of electrical activity of individual grain boundaries was measured by an electron beam induced current(EBIC) technique.It has been found that temperature dependence of EBIC contrast at grain boundaries can change, depending on the misorientation angle the orientation of the boundary plane. The results can be explained by the difference in the position of the localized state within the band gap on the basis of the Shockley-Read-Hall statistics. The {111} ∑3 symmetrical tilt boundary has shallow states, while high ∑ boundaries have deep states. Low angle boundaries reveal high electrical activities. The EBIC contrast at low angle boundaries was found to increase with increasing misorientation angle up to 2° followed by an almost constant value. High electrical activity at low angle boundaries is probably attributed to a stress field of primary dislocations forming low angle boundaries.

TEMPERATURE DEPENDENCE OF ELECTRICAL CHARACTERISTICS OF Cr/p–Si(100) SCHOTTKY BARRIER DIODES

2008 ◽  
Vol 22 (14) ◽  
pp. 2309-2319 ◽  
Author(s):  
K. ERTURK ◽  
M. C. HACIISMAILOGLU ◽  
Y. BEKTORE ◽  
M. AHMETOGLU
Keyword(s):  
Temperature Dependence ◽  
Schottky Barrier ◽  
Barrier Height ◽  
Thermionic Emission ◽  
Electrical Characteristics ◽  
Schottky Barrier Diodes ◽  
Semiconductor Interface ◽  
Linear Portion ◽  
Barrier Heights ◽  
P Type

The electrical characteristics of Cr / p – Si (100) Schottky barrier diodes have been measured in the temperature range of 100–300 K. The I-V analysis based on thermionic emission (TE) theory has revealed an abnormal decrease of apparent barrier height and increase of ideality factor at low temperature. The conventional Richardson plot exhibits non-linearity below 200 K with the linear portion corresponding to activation energy 0.304 eV and Richardson constant (A*) value of 5.41×10-3 Acm-2 K -2 is determined from the intercept at the ordinate of this experimental plot, which is much lower than the known value of 32 Acm-2 K -2 for p-type Si . It is demonstrated that these anomalies result due to the barrier height inhomogeneities prevailing at the metal-semiconductor interface. Hence, it has been concluded that the temperature dependence of the I-V characteristics of the Cr/p – Si Schottky barrier diode can be successfully explained on the basis of TE mechanism with a Gaussian distribution of the barrier heights. Furthermore, the value of the Richardson constant found is much closer than that obtained without considering the inhomogeneous barrier heights.

Hall mobility minimum of temperature dependence in polycrystalline silicon

1998 ◽  
Vol 83 (1) ◽  
pp. 292-296 ◽  
Author(s):  
H. Nussbaumer ◽  
F. P. Baumgartner ◽  
G. Willeke ◽  
E. Bucher
Keyword(s):  
Temperature Dependence ◽  
Hall Mobility ◽  
Polycrystalline Silicon
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