scholarly journals Thermal stability of copper nitride thin films: The role of nitrogen migration

2010 ◽  
Vol 107 (10) ◽  
pp. 103513 ◽  
Author(s):  
R. Gonzalez-Arrabal ◽  
N. Gordillo ◽  
M. S. Martin-Gonzalez ◽  
R. Ruiz-Bustos ◽  
F. Agulló-López
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Copper Nitride ◽  
Thermal Stability Of

scholarly journals The role of the substrate on the mechanical and thermal stability of Pd thin films during hydrogen (de)sorption

2021 ◽  
Vol 46 (5) ◽  
pp. 4137-4153
Author(s):  
Neha Verma ◽  
Rob Delhez ◽  
Niek M. van der Pers ◽  
Frans D. Tichelaar ◽  
Amarante J. Böttger
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Thermal Stability Of

The role of W on the thermal stability of nanocrystalline NiTiWx thin films

2018 ◽  
Vol 142 ◽  
pp. 181-192 ◽  
Author(s):  
Aslan Ahadi ◽  
Arvind R. Kalidindi ◽  
Junpei Sakurai ◽  
Yoshitaka Matsushita ◽  
Koichi Tsuchiya ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Thermal Stability Of

scholarly journals Structure and Thermal Stability of Copper Nitride Thin Films

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Guangan Zhang ◽  
Zhibin Lu ◽  
Jibin Pu ◽  
Guizhi Wu ◽  
Kaiyuan Wang
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
X Ray Diffraction ◽  
Compact Structure ◽  
Thermal Stabilities ◽  
Cross Sectional ◽  
Copper Nitride ◽  
Partial Pressures ◽  
Dc Reactive Magnetron Sputtering ◽  
Thermal Stability Of

Copper nitride (Cu3N) thin films were deposited on glass via DC reactive magnetron sputtering at various N2 flow rates and partial pressures with 150°C substrate temperature. X-ray diffraction and scanning electron microscopy were used to characterize the microstructure and morphology. The results show that the films are composed of Cu3N crystallites with anti-ReO3 structure. The microstructure and morphology of the Cu3N film strongly depend on the N2 flow rate and partial pressure. The cross-sectional micrograph of the film shows typical columnar, compact structure. The thermal stabilities of the films were investigated using vacuum annealing under different temperature. The results show that the introducing of argon in the sputtering process decreases the thermal stability of the films.

Role of additives (X=Ti, Zr) in phase formation and thermal stability of Fe–X–N thin films

2013 ◽  
Vol 536 ◽  
pp. 39-49 ◽  
Author(s):  
Akhil Tayal ◽  
Mukul Gupta ◽  
Ajay Gupta ◽  
M. Horisberger ◽  
J. Stahn
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Phase Formation ◽  
Thermal Stability Of

Analysis of the role of fluorine content on the thermal stability of a-C:H:F thin films

2002 ◽  
Vol 11 (3-6) ◽  
pp. 1100-1105 ◽  
Author(s):  
L. Valentini ◽  
E. Braca ◽  
J.M. Kenny ◽  
G. Fedosenko ◽  
J. Engemann ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Fluorine Content ◽  
Thermal Stability Of

Mossbauer Study of the Role of Aluminum and Chromium in Nitrogen Implanted Iron

1991 ◽  
Vol 235 ◽  
Author(s):  
M. Kopcewicz ◽  
J. Jagielski ◽  
A. Turos ◽  
D. L. Williamson
Keyword(s):  
Thermal Stability ◽  
Ion Implantation ◽  
Metallic Iron ◽  
Conversion Electron ◽  
Alloying Elements ◽  
Mössbauer Study ◽  
Conversion Electron Mössbauer Spectroscopy ◽  
Conversion Electron Mossbauer Spectroscopy ◽  
Thermal Stability Of

ABSTRACTThe role of alloying elements such as Cr and Al in the formation and stability of the nitride phases formed due to N ion implantation into metallic iron was studied by conversion electron Mössbauer spectroscopy (CEMS). The thermal stability of nitride phases upon 1 h annealing was greatly increased as a result of co-implanting either Cr or Al with N as compared to pure α-Fe implanted only with N.

Sign in / Sign up

Export Citation Format

Share Document