Comprehensive study of AuMnp‐type ohmic contact for GaAs/GaAlAs heterojunction bipolar transistors

1986 ◽  
Vol 59 (11) ◽  
pp. 3783-3786 ◽  
Author(s):  
C. Dubon‐Chevallier ◽  
M. Gauneau ◽  
J. F. Bresse ◽  
A. Izrael ◽  
D. Ankri
1994 ◽  
Vol 08 (16) ◽  
pp. 2221-2243
Author(s):  
F. REN

Process technologies for self-aligned AlGaAs/GaAs and InGaP/GaAs heterojunction bipolar transistors (HBTs) as well as gate definition and dry etching fabrication schemes for submicron gate length AlGaAs/GaAs-based field effect transistors (FETs) are presented. Multiple energy F + and H + ions were used to isolate the active devices for HBTs. The resistance of test wafers at 200° C showed no change over periods of more than 50 days. Highly selective dry and wet etch techniques for InGaP/GaAs and AlGaAs/GaAs material systems were used to uniformly expose heterojunctions. Reliability of the alloyed ohmic contact and feasibility of the nonalloyed ohmic contact metallizations for both p and n type GaAs layers will be discussed. The reproducible gate recess etching is one of the critical steps for AlGaAs/GaAs-based FETs. The etching selectivity, damage, pre- and post-clean procedures were studied in terms of device performance. A simple low temperature SiN x deposition and an etch-back process with optical stepper were used to demonstrate 0.1 µm Y-shape gate feature.


1994 ◽  
Vol 33 (Part 1, No. 1B) ◽  
pp. 786-789 ◽  
Author(s):  
Tohru Sugiyama ◽  
Yasuhiko Kuriyama ◽  
Masayuki Asaka ◽  
Norio Iizuka ◽  
Torakichi Kobayashi ◽  
...  

1997 ◽  
Vol 71 (13) ◽  
pp. 1854-1856 ◽  
Author(s):  
Il-Ho Kim ◽  
Sung Ho Park ◽  
Tae-Woo Lee ◽  
Moon-Pyung Park

1993 ◽  
Vol 300 ◽  
Author(s):  
F. Ren

ABSTRACTProcess technologies for self-aligned AlGaAs/GaAs and lnGaP/GaAs heterojunction bipolar transistors (HBTs) as well as dry etching fabrication schemes for submicron AlGaAs/GaAs based field effect transistors (FETs) are presented. Multiple energy F+ and H+ ions were used to isolate the active devices for HBTs. The resistance of test wafers at 200 °C showed no change over periods of 50 days. Highly selective dry and wet etch techniques for InGaP/GaAs and AlGaAs/GaAs material systems were used to uniformly expose junctions. Reliability of the alloyed ohmic contact and feasibility of the non-alloyed ohmic contact metallizations for both p and n type GaAs layers will be discussed. The reproducible gate recess etching is one of the critical steps for AlGaAs/GaAs based FETs. The etching selectivity, damage, pre and post-clean procedure were studied in terms of device performance. A simple low temperature SiNx deposition and an etch-back process with optical stepper were used to demonstrate 0.1 μm Y-shape gate feature.


2003 ◽  
Vol 19 (3) ◽  
pp. 351-358 ◽  
Author(s):  
Shiou-Ying Cheng ◽  
Jing-Yuh Chen ◽  
Chun-Yuan Chen ◽  
Hung-Ming Chuang ◽  
Chih-Hung Yen ◽  
...  

ChemInform ◽  
1990 ◽  
Vol 21 (30) ◽  
Author(s):  
C. DUBON-CHEVALLIER ◽  
P. BLANCONNIER ◽  
C. BESOMBES ◽  
C. MAYEUX ◽  
J. F. BRESSE ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document