Plasma enhanced metal‐organic chemical vapor deposition of aluminum oxide dielectric film for device applications

1983 ◽  
Vol 54 (9) ◽  
pp. 5436-5440 ◽  
Author(s):  
K. P. Pande ◽  
V. K. R. Nair ◽  
D. Gutierrez
Keyword(s):  
Chemical Vapor Deposition ◽  
Aluminum Oxide ◽  
Vapor Deposition ◽  
Dielectric Film ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Device Applications ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

Low Temperature Metal Organic Chemical Vapor Deposition of Aluminum Oxide Thin Films for Advanced CMOS Gate Dielectric Applications

2002 ◽  
Vol 716 ◽  
Author(s):  
Spyridon Skordas ◽  
Filippos Papadatos ◽  
Zubin Patel ◽  
Guillermo Nuesca ◽  
Eric Eisenbraun ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Aluminum Oxide ◽  
Vapor Deposition ◽  
Gate Dielectric ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Amorphous Films ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

AbstractA low-temperature metal organic chemical vapor deposition (MOCVD) process for the growth of aluminum oxide for gate dielectric applications has been developed. Amorphous films were deposited on 200-mm Si(100) wafers, employing an Al β-diketonate precursor [Al(III) 2,4-pentanedionate] and H2O. Chemical and microstructural properties of films grown in a temperature range of 250-450°C were studied using x-ray photo-electron spectroscopy (XPS), xray diffraction (XRD), Rutherford back-scattering spectrometry (RBS), nuclear reaction analysis (NRA), cross-sectional (X) scanning and transmission electron microscopy (XSEM and XTEM). A design of experiment (DOE) method was used for process mapping and optimization. An optimized process window was defined for the growth of dense, amorphous films with carbon and hydrogen inclusion as low as 1 at. % and 3 at. % respectively. Post-deposition annealing studies indicated that chemical and structural film properties are generally stable up to 650°C. The electrical performance of the films was evaluated by capacitance-voltage (C-V) and currentvoltage (I-V) measurements on metal-oxide-semiconductor (MOS) structures. The dielectric constant (k) obtained was 6.7-9.6 (depending on annealing conditions), with equivalent oxide thickness (EOT) as low as 1.3 nm. Leakage current densities lower than that of equivalent SiO2 films were also achieved.

scholarly journals Laser‐Assisted Metal–Organic Chemical Vapor Deposition of Gallium Nitride

2021 ◽  
Vol 15 (6) ◽  
pp. 2170024
Author(s):  
Yuxuan Zhang ◽  
Zhaoying Chen ◽  
Kaitian Zhang ◽  
Zixuan Feng ◽  
Hongping Zhao
Keyword(s):  
Gallium Nitride ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

scholarly journals Growth-Etch Metal–Organic Chemical Vapor Deposition Approach of WS2 Atomic Layers

ACS Nano ◽  
2020 ◽  
Author(s):  
Assael Cohen ◽  
Avinash Patsha ◽  
Pranab K. Mohapatra ◽  
Miri Kazes ◽  
Kamalakannan Ranganathan ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

Vertical β-Ga2O3 field plate Schottky barrier diode from metal-organic chemical vapor deposition

2021 ◽  
Vol 118 (16) ◽  
pp. 162109
Author(s):  
Esmat Farzana ◽  
Fikadu Alema ◽  
Wan Ying Ho ◽  
Akhil Mauze ◽  
Takeki Itoh ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Schottky Barrier ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Schottky Barrier Diode ◽  
Organic Chemical ◽  
Field Plate ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition
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