A comparative study of thermal stress induced dislocation generation in pulled GaAs, InP, and Si crystals

1981 ◽  
Vol 52 (5) ◽  
pp. 3331-3336 ◽  
Author(s):  
A. S. Jordan ◽  
R. Caruso ◽  
A. R. VonNeida ◽  
J. W. Nielsen
Keyword(s):  
Thermal Stress ◽  
Comparative Study ◽  
Dislocation Generation ◽  
Induced Dislocation

Oxide Precipitate‐Induced Dislocation Generation in Heavily Boron‐Doped Czochralski Silicon

1999 ◽  
Vol 146 (9) ◽  
pp. 3461-3465 ◽  
Author(s):  
T. Ono ◽  
A. Romanowski ◽  
E. Asayama ◽  
H. Horie ◽  
K. Sueoka ◽  
...  
Keyword(s):  
Dislocation Generation ◽  
Czochralski Silicon ◽  
Boron Doped ◽  
Induced Dislocation ◽  
Oxide Precipitate

scholarly journals On the Stress Dependence of Subgrain Size

1982 ◽  
Vol 5 (3) ◽  
pp. 127-152 ◽  
Author(s):  
G. H. Edward ◽  
M. A. Etheridge ◽  
B. E. Hobbs
Keyword(s):  
Material Properties ◽  
Subgrain Size ◽  
Dynamic Balance ◽  
Dislocation Generation ◽  
Proportionality Constant ◽  
Creep Stress ◽  
Dislocation Annihilation ◽  
Size Relation ◽  
Induced Dislocation ◽  
Environmental Dependence

A simple model of the dynamic balance between deformation induced dislocation generation and climb controlled dislocation annihilation in subgrain walls is outlined. This results in a stress-subgrain size relationship which involves various material properties, including the creep stress exponent and the creep diffusivity.Assuming a fixed slip distance for mobile dislocations, the theory predicts that the subgrain size (d) depends on the stress (σ) as d4∝σ−n, where n is the creep exponent, and the proportionality constant is dependent on material properties, temperature, and other environmental variables. This theoretical prediction is satisfactorily compared with published experimental results for a variety of materials.The implications of the environmental dependence of the stress-subgrain size relation with regard to its use as a palaeopiezometer in naturally deformed minerals are discussed.

Comparative study on residual strain and thermal stress in 4-in GaAs crystals grown by LEC and VB techniques

2005 ◽  
Vol 275 (1-2) ◽  
pp. e2161-e2165
Author(s):  
Tomohiro Kawase ◽  
Masami Tatsumi ◽  
Masayoshi Yamada
Keyword(s):  
Thermal Stress ◽  
Comparative Study ◽  
Residual Strain

Impact of Silicon Wafer Material on Dislocation Generation in Local Oxidation

1998 ◽  
Vol 532 ◽  
Author(s):  
I. V. Peidous ◽  
R. Sundaresan ◽  
E. Quek ◽  
Y. K. Leung ◽  
M. Beh
Keyword(s):  
Surface Defect ◽  
Depth Distribution ◽  
Defect Density ◽  
Dislocation Generation ◽  
Local Oxidation ◽  
Dislocation Movement ◽  
Defect Nucleation ◽  
Critical Resolved Shear Stress ◽  
Induced Dislocation

ABSTRACTCrystalline quality of locally oxidized silicon wafers has been studied. Wafers from different supply sources were found to be differently susceptible to stress-induced dislocation generation, although they had been produced to the same specification. On the basis of the analysis of a depth distribution of the dislocations, critical resolved shear stress of dislocation movement in the bulk areas of the wafers was determined. It varied from about 1.65 to 5.12 MPa and correlated positively to the surface defect density. The results show that uncontrollable variations of bulk silicon properties may significantly influence the stress-induced defect nucleation on the surface of wafers during processing.

Thermal stress induced dislocation distribution in directional solidification of Si for PV application

2014 ◽  
Vol 408 ◽  
pp. 19-24 ◽  
Author(s):  
Karolin Jiptner ◽  
Bing Gao ◽  
Hirofumi Harada ◽  
Yoshiji Miyamura ◽  
Masayuki Fukuzawa ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Directional Solidification ◽  
Dislocation Distribution ◽  
Induced Dislocation

Local oxidation induced dislocation generation near [100] Si3N4film edges

1983 ◽  
Vol 43 (12) ◽  
pp. 1120-1122 ◽  
Author(s):  
J. Vanhellemont ◽  
J. Van Landuyt ◽  
S. Amelinckx ◽  
C. Claeys ◽  
G. Declerck ◽  
...  
Keyword(s):  
Dislocation Generation ◽  
Local Oxidation ◽  
Induced Dislocation
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