Two-side surface photovoltage studies for implanted iron diffusion in silicon during rapid thermal anneal

2010 ◽  
Vol 107 (1) ◽  
pp. 013518 ◽  
Author(s):  
I. Rapoport ◽  
P. Taylor ◽  
J. Kearns ◽  
D. K. Schroder
Keyword(s):  
Side Surface ◽  
Surface Photovoltage ◽  
Rapid Thermal Anneal ◽  
Iron Diffusion

Iron Diffusion Profile Studies by Surface Photo-Voltage for Silicon Iron Implanted Wafers After Rapid Thermal Anneal

2019 ◽  
Vol 2 (10) ◽  
pp. 33-41
Author(s):  
Igor Rapoport ◽  
Patrick Taylor ◽  
Seung-Bae Kim ◽  
Benno Orschel ◽  
W. Huber
Keyword(s):  
Diffusion Profile ◽  
Rapid Thermal Anneal ◽  
Silicon Iron ◽  
Iron Diffusion

Atomic structure of interface of intermetallic compound TiAl and nitride Ti2AIN using HREM and image processing

1991 ◽  
Vol 49 ◽  
pp. 570-571
Author(s):  
E. Sukedai ◽  
H. Mabuchi ◽  
H. Hashimoto ◽  
Y. Nakayama
Keyword(s):  
Mechanical Properties ◽  
Image Processing ◽  
Composite Material ◽  
Intermetallic Compound ◽  
Side Surface ◽  
High Resolution Electron Microscopy ◽  
Hexagonal Structure ◽  
Second Phase ◽  
Resolution Electron ◽  
Compound Tial

In order to improve the mechanical properties of an intermetal1ic compound TiAl, a composite material of TiAl involving a second phase Ti2AIN was prepared by a new combustion reaction method. It is found that Ti2AIN (hexagonal structure) is a rod shape as shown in Fig.1 and its side surface is almost parallel to the basal plane, and this composite material has distinguished strength at elevated temperature and considerable toughness at room temperature comparing with TiAl single phase material. Since the property of the interface of composite materials has strong influences to their mechanical properties, the structure of the interface of intermetallic compound and nitride on the areas corresponding to 2, 3 and 4 as shown in Fig.1 was investigated using high resolution electron microscopy and image processing.

TEM characterization of WSix films

1994 ◽  
Vol 52 ◽  
pp. 848-849
Author(s):  
V. C. Kannan ◽  
S. M. Merchant ◽  
R. B. Irwin ◽  
A. K. Nanda ◽  
M. Sundahl ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Vapor Deposition ◽  
High Purity ◽  
Physical Vapor Deposition ◽  
Thermal Treatments ◽  
Rapid Thermal Anneal ◽  
Tungsten Silicide ◽  
Tem Characterization ◽  
Metal Silicides

Metal silicides such as WSi2, MoSi2, TiSi2, TaSi2 and CoSi2 have received wide attention in recent years for semiconductor applications in integrated circuits. In this study, we describe the microstructures of WSix films deposited on SiO2 (oxide) and polysilicon (poly) surfaces on Si wafers afterdeposition and rapid thermal anneal (RTA) at several temperatures. The stoichiometry of WSix films was confirmed by Rutherford Backscattering Spectroscopy (RBS). A correlation between the observed microstructure and measured sheet resistance of the films was also obtained.WSix films were deposited by physical vapor deposition (PVD) using magnetron sputteringin a Varian 3180. A high purity tungsten silicide target with a Si:W ratio of 2.85 was used. Films deposited on oxide or poly substrates gave rise to a Si:W ratio of 2.65 as observed by RBS. To simulatethe thermal treatments of subsequent processing procedures, wafers with tungsten silicide films were subjected to RTA (AG Associates Heatpulse 4108) in a N2 ambient for 60 seconds at temperatures ranging from 700° to 1000°C.

Electrical Damage Due to Low Energy Plasma Processing of GaAs Structures

1991 ◽  
Vol 223 ◽  
Author(s):  
Hans P. Zappe ◽  
Gudrun Kaufel
Keyword(s):  
Chemical Processes ◽  
Low Energy ◽  
Electrical Behavior ◽  
Rapid Thermal Anneal ◽  
High Temperature Anneal ◽  
Significant Damage ◽  
Low Energies ◽  
Long Time ◽  
Physical Plasma

ABSTRACTThe effect of numerous plasma reative ion etch and physical milling processes on the electrical behavior of GaAs bulk substrates has been investigated by means of electric microwave absorption. It was seen that plasma treatments at quite low energies may significantly affect the electrical quality of the etched semiconductor. Predominantly physical plasma etchants (Ar) were seen to create significant damage at very low energies. Chemical processes (involving Cl or F), while somewhat less pernicious, also gave rise to electrical substrate damage, the effect greater for hydrogenic ambients. Whereas rapid thermal anneal treatments tend to worsen the electrical integrity, some substrates respond positively to long-time high temperature anneal steps.

ANALYSIS OF THE INFLUENCE OF DIMENSIONS OF THE ROPE MIDWATER TRAWLS ON THEIR PERFORMANCE SUBJECT TO GEOMETRIC PROPERTIES OF CONE SHELLS

2017 ◽  
pp. 25-33
Author(s):  
Alexander Vasilievich Dvernik
Keyword(s):  
Surface Properties ◽  
Conical Shell ◽  
Side Surface ◽  
Theoretic Analysis ◽  
Good Convergence ◽  
Large Size ◽  
Quality Coefficient ◽  
Geometric Quality ◽  
The Relationship ◽  
Parameters Calculation

The article studies different shell constructions of mid-water trawls and their properties. The problem settled is suggested to be solved taking into account real geometric interrelations between spacious and surface properties of cone shells. The author suggests to accept a so-called geometric quality coefficient as a criterion of the properties of a conical shell, which represents the ratio of the shell to the area of its side surface and by analogy to use it to the shell of the trawl. The relationship between the trawl dimensions and geometric quality coefficient have been studied. Comparing these figures with the actual characteristics of trawls showed good convergence. According to the results of theoretic analysis and parameters calculation, trawl large-size shells will always have advantages in geometric characteristics over mid-size and, especially, small-size shells. The results of the analysis can be used for approximate calculations of the parameters of the trawl and justification of ways to improve the performance of existing mid-water trawls.

scholarly journals Biaxial 360-degree scanning LIDAR using a liquid crystal control

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Seiji Nishiwaki
Keyword(s):  
Liquid Crystal ◽  
Laser Light ◽  
Side Surface ◽  
Parallel Beam ◽  
Grating Couplers ◽  
Autonomous Cars ◽  
Scanning Lidar ◽  
Center Axis ◽  
Circular Grating ◽  
Segmented Electrode

AbstractSophisticated non-mechanical technology for LIDARs is needed to realize safe autonomous cars. We have confirmed the operating principle of a non-mechanical LIDAR by combining concentric circular-grating couplers (CGCs) with a coaxially aligned rod lens. Laser light incident vertically on the center of the inner CGC along the center axis of the lens is radiated from the outer CGC and passes through the side surface of the lens. It is converted to a parallel beam that scans in two axes by applying voltages to two area-segmented electrode layers sandwiching the CGCs and a liquid crystal layer formed on the CGCs. We have demonstrated scanning whose motion ranges were 360 degrees horizontally and 10° vertically. A beam with a spread angle of 0.3° × 0.8° at a minimum swept vertically up to a frequency of 100 Hz and ten equally spaced beams scanned rotationally with a 6-degree cycle variation of spread of between 0.8° and 3.5°.

Electronic surface properties of SrTiO3 derived from a surface photovoltage study

2013 ◽  
Vol 612 ◽  
pp. 1-9 ◽  
Author(s):  
E. Beyreuther ◽  
J. Becherer ◽  
A. Thiessen ◽  
S. Grafström ◽  
L.M. Eng
Keyword(s):  
Surface Properties ◽  
Surface Photovoltage ◽  
Electronic Surface
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