Enhanced thermal conductivity of polymer composites filled with three-dimensional brushlike AlN nanowhiskers

2009 ◽  
Vol 95 (22) ◽  
pp. 224104 ◽  
Author(s):  
Zhongqi Shi ◽  
Mohamed Radwan ◽  
Soshu Kirihara ◽  
Yoshinari Miyamoto ◽  
Zhihao Jin
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Three Dimensional ◽  
Enhanced Thermal Conductivity

Constructing Three-dimensional Nano-crystalline Diamond Network within Polymer Composites for Enhanced Thermal Conductivity

Nanoscale ◽  
2021 ◽  
Author(s):  
Shaoyang Xiong ◽  
Yue Qin ◽  
Linhong Li ◽  
Guoyong Yang ◽  
Maohua Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Performance ◽  
Thermal Transport ◽  
High Performance ◽  
Rapid Development ◽  
Electronic Devices ◽  
Three Dimensional ◽  
Nano Crystalline ◽  
Enhanced Thermal Conductivity

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing thermal...

Enhanced thermal conductivity of epoxy/three-dimensional carbon hybrid filler composites for effective heat dissipation

RSC Advances ◽  
2015 ◽  
Vol 5 (58) ◽  
pp. 46989-46996 ◽  
Author(s):  
Ji Sun Park ◽  
You Jin An ◽  
Kwonwoo Shin ◽  
Jong Hun Han ◽  
Churl Seung Lee
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Hybrid Filler ◽  
Effective Heat ◽  
Enhanced Thermal Conductivity ◽  
Carbon Based

A three-dimensional carbon-based heat-dissipating material was designed to improve the thermal conductivity of polymer composites in both the xy- and z-directions.

Exceptionally high thermal and electrical conductivity of three-dimensional graphene-foam-based polymer composites

RSC Advances ◽  
2016 ◽  
Vol 6 (27) ◽  
pp. 22364-22369 ◽  
Author(s):  
Zhiduo Liu ◽  
Dianyu Shen ◽  
Jinhong Yu ◽  
Wen Dai ◽  
Chaoyang Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Polymer Composites ◽  
Epoxy Matrix ◽  
Three Dimensional ◽  
Neat Epoxy ◽  
Graphene Foam

Three dimensional graphene foam incorporated into epoxy matrix greatly enhance its thermal conductivity (up to 1.52 W mK−1) at low graphene foam loading (5.0 wt%), over an eight-fold enhancement in comparison with that of neat epoxy.

Enhanced thermal conductivity for polyimide composites with a three-dimensional silicon carbide nanowire@graphene sheets filler

2015 ◽  
Vol 3 (9) ◽  
pp. 4884-4891 ◽  
Author(s):  
Wen Dai ◽  
Jinhong Yu ◽  
Yi Wang ◽  
Yingze Song ◽  
Fakhr E. Alam ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Three Dimensional ◽  
Graphene Sheets ◽  
Polyimide Composites ◽  
Polyimide Matrix ◽  
Enhanced Thermal Conductivity

3DSG incorporated into a polyimide matrix greatly enhanced its thermal conductivity (up to 2.63 W m−1 K−1), approximately a 10-fold enhancement in comparison with that of neat polyimide.

Enhanced thermal conductivity by combined fillers in polymer composites

2019 ◽  
Vol 676 ◽  
pp. 198-204 ◽  
Author(s):  
Haitong Li ◽  
Wei Chen ◽  
Jinzao Xu ◽  
Jia Li ◽  
Lin Gan ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Enhanced Thermal Conductivity

Fabrication of thermally conductive and electrically insulating polymer composites with isotropic thermal conductivity by constructing a three-dimensional interconnected network

Nanoscale ◽  
2019 ◽  
Vol 11 (23) ◽  
pp. 11360-11368 ◽  
Author(s):  
Hao Yuan ◽  
Yang Wang ◽  
Ting Li ◽  
Yijie Wang ◽  
Piming Ma ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Management ◽  
Three Dimensional ◽  
Heat Removal ◽  
Interconnected Network ◽  
Microelectronic Devices ◽  
Thermally Conductive

Efficient heat removal via thermal management materials has become one of the most critical challenges in the development of modern microelectronic devices.

Design of network Al2O3 spheres for significantly enhanced thermal conductivity of polymer composites

2020 ◽  
Vol 128 ◽  
pp. 105673 ◽  
Author(s):  
Yuge Ouyang ◽  
Fei Ding ◽  
Liuyang Bai ◽  
Xiaofei Li ◽  
Guolin Hou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Enhanced Thermal Conductivity

Zinc Composites With Enhanced Thermal Conductivity for Use in Fused Deposition Modeling Systems

2017 ◽  
Author(s):  
Tyler J. Sonsalla ◽  
Leland Weiss ◽  
Arden Moore ◽  
Adarsh Radadia ◽  
Debbie Wood ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Fused Deposition Modeling ◽  
Waste Heat ◽  
Conductive Polymer ◽  
Three Dimensional ◽  
Sem Images ◽  
Fused Deposition ◽  
Thermally Conductive ◽  
Deposition Modeling ◽  
Enhanced Thermal Conductivity

Waste heat is a major energy loss in manufacturing facilities. Thermally conductive polymer composite heat exchangers could be utilized in the ultralow temperature range (below 200° C) for waste heat recovery. Fused deposition modeling (FDM), also known as three-dimensional (3-D) printing, has become an increasingly popular technology and presents one approach to fabrication of these exchangers. The primary challenge to the use of FDM is the low-conductivity of the materials themselves. This paper presents a study of a new polymer-Zn composite designed for enhanced thermal conductivity for usage in FDM systems. Thermal properties were assessed in addition to basic printability. Filler volume percentages were varied to study the effects on material properties. Scanning electron microscope (SEM) images were taken of the 3-D printed test pieces to determine filler orientation and filler distribution. Lastly, experimentally obtained thermal conductivity values were compared to the theoretical thermal conductivity values predicted from the Lewis-Nielsen model.

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