Enhanced thermal conductivity of epoxy/three-dimensional carbon hybrid filler composites for effective heat dissipation

RSC Advances ◽  
2015 ◽  
Vol 5 (58) ◽  
pp. 46989-46996 ◽  
Author(s):  
Ji Sun Park ◽  
You Jin An ◽  
Kwonwoo Shin ◽  
Jong Hun Han ◽  
Churl Seung Lee
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Hybrid Filler ◽  
Effective Heat ◽  
Enhanced Thermal Conductivity ◽  
Carbon Based

A three-dimensional carbon-based heat-dissipating material was designed to improve the thermal conductivity of polymer composites in both the xy- and z-directions.

Constructing Three-dimensional Nano-crystalline Diamond Network within Polymer Composites for Enhanced Thermal Conductivity

Nanoscale ◽  
2021 ◽  
Author(s):  
Shaoyang Xiong ◽  
Yue Qin ◽  
Linhong Li ◽  
Guoyong Yang ◽  
Maohua Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Performance ◽  
Thermal Transport ◽  
High Performance ◽  
Rapid Development ◽  
Electronic Devices ◽  
Three Dimensional ◽  
Nano Crystalline ◽  
Enhanced Thermal Conductivity

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing thermal...

Enhanced thermal conductivity of polymer composites filled with hybrid filler

2006 ◽  
Vol 37 (5) ◽  
pp. 727-734 ◽  
Author(s):  
Geon-Woong Lee ◽  
Min Park ◽  
Junkyung Kim ◽  
Jae Ik Lee ◽  
Ho Gyu Yoon
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Hybrid Filler ◽  
Enhanced Thermal Conductivity

Enhanced thermal conductivity of polymer composites filled with three-dimensional brushlike AlN nanowhiskers

2009 ◽  
Vol 95 (22) ◽  
pp. 224104 ◽  
Author(s):  
Zhongqi Shi ◽  
Mohamed Radwan ◽  
Soshu Kirihara ◽  
Yoshinari Miyamoto ◽  
Zhihao Jin
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Three Dimensional ◽  
Enhanced Thermal Conductivity

Exceptionally high thermal and electrical conductivity of three-dimensional graphene-foam-based polymer composites

RSC Advances ◽  
2016 ◽  
Vol 6 (27) ◽  
pp. 22364-22369 ◽  
Author(s):  
Zhiduo Liu ◽  
Dianyu Shen ◽  
Jinhong Yu ◽  
Wen Dai ◽  
Chaoyang Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Polymer Composites ◽  
Epoxy Matrix ◽  
Three Dimensional ◽  
Neat Epoxy ◽  
Graphene Foam

Three dimensional graphene foam incorporated into epoxy matrix greatly enhance its thermal conductivity (up to 1.52 W mK−1) at low graphene foam loading (5.0 wt%), over an eight-fold enhancement in comparison with that of neat epoxy.

Enhanced thermal conductivity for polyimide composites with a three-dimensional silicon carbide nanowire@graphene sheets filler

2015 ◽  
Vol 3 (9) ◽  
pp. 4884-4891 ◽  
Author(s):  
Wen Dai ◽  
Jinhong Yu ◽  
Yi Wang ◽  
Yingze Song ◽  
Fakhr E. Alam ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Three Dimensional ◽  
Graphene Sheets ◽  
Polyimide Composites ◽  
Polyimide Matrix ◽  
Enhanced Thermal Conductivity

3DSG incorporated into a polyimide matrix greatly enhanced its thermal conductivity (up to 2.63 W m−1 K−1), approximately a 10-fold enhancement in comparison with that of neat polyimide.

scholarly journals Development of Thermally Conductive Polyurethane Composite by Low Filler Loading of Spherical BN/PMMA Composite Powder

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Kai-Han Su ◽  
Cherng-Yuh Su ◽  
Cheng-Ta Cho ◽  
Chung-Hsuan Lin ◽  
Guan-Fu Jhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Filler Loading ◽  
High Thermal Conductivity ◽  
Heat Diffusion ◽  
Composite Powders ◽  
Polyurethane Composite ◽  
Uniform Dispersion ◽  
Thermally Conductive

Abstract The issue of electronic heat dissipation has received much attention in recent times and has become one of the key factors in electronic components such as circuit boards. Therefore, designing of materials with good thermal conductivity is vital. In this work, a thermally conductive SBP/PU composite was prepared wherein the spherical h-BN@PMMA (SBP) composite powders were dispersed in the polyurethane (PU) matrix. The thermal conductivity of SBP was found to be significantly higher than that of the pure h-BN/PU composite at the same h-BN filler loading. The SBP/PU composite can reach a high thermal conductivity of 7.3 Wm−1 K−1 which is twice as high as that of pure h-BN/PU composite without surface treatment in the same condition. This enhancement in the property can be attributed to the uniform dispersion of SBP in the PU polymer matrix that leads to a three-dimensional continuous heat conduction thereby improving the heat diffusion of the entire composite. Hence, we provide a valuable method for preparing a 3-dimensional heat flow path in polyurethane composite, leading to a high thermal conductivity with a small amount of filler.

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