Thermal sintering of solution-deposited nanoparticle silver ink films characterized by spectroscopic ellipsometry

2008 ◽  
Vol 93 (23) ◽  
pp. 234104 ◽  
Author(s):  
Heng Pan ◽  
Seung H. Ko ◽  
Costas P. Grigoropoulos
Keyword(s):  
Spectroscopic Ellipsometry ◽  
Silver Ink ◽  
Thermal Sintering

scholarly journals Effects of different thermal sintering temperatures on pattern resistivity of printed silver ink with multiple particle sizes

AIP Advances ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 115116
Author(s):  
Zhiheng Yu ◽  
Fengli Huang ◽  
Tiancheng Zhang ◽  
Chengli Tang ◽  
Xihua Cui ◽  
...  
Keyword(s):  
Particle Sizes ◽  
Silver Ink ◽  
Thermal Sintering ◽  
Multiple Particle

Investigation of Different Sintering Methods on Ink-Jet-Printed Conductive Structures

2016 ◽  
Vol 856 ◽  
pp. 217-223
Author(s):  
Joachim Bahr ◽  
Oleksander Kravchuk ◽  
Marcus Reichenberger
Keyword(s):  
Organic Compounds ◽  
Energy Input ◽  
Raw Materials ◽  
Laser Sintering ◽  
Ink Jet Printing ◽  
Silver Ink ◽  
Ink Jet ◽  
Jet Printing ◽  
Thermal Sintering ◽  
The Individual

Over the last decades ink-jet-printing has developed in many applications. The di-rect writing of materials such as silver (for conductive circuits) or polymers (for insulation or second layer) is an attractive method to reduce costs and save raw materials. For conductor paths silver inks with nanoparticles are used. To ensure a good dispersion the nanoparticles are mostly covered with organic compounds. To guarantee electrical conductivity the organic compounds have to be removed and the particles have to be sintered to minimize resistivity. This is done by heating up the silver structures. In this article we compare different meth- ods of sintering conductive paths printed using a silver ink with a particle size of ≤ 50 nm. The methods of sintering are the established thermal sintering in an oven, and alternatively laser sintering as well as electrical resistive sintering. Laser sintering is carried out with a semiconductor laser with a wavelength of 408 nm and different feeding speeds so the energy input in the structures can be varied. For electrical resistive sintering a DC-current is injected to the structures whereby they are heated up by the current. During electrical sintering the actual value of the resistance of the hot structures can be observed. Thereby the sintering can be stopped, when a certain value (of the hot structure) is reached. The best parameters for both sintering alternatives are identified. The conductivity and the deviation of the conductivity of the sintered paths are determined and compared with the results achieved for thermal sintering. As a result, it can be stated, that both alternatives pro-vide specific advantages over thermal sintering such as lower deviations of the measured values or significantly lower process times. On the other hand, specific limitations might occur when using laser or electrical sintering. Additionally, the individual amount of energy input for the three respective sintering pro-cesses is calculated and compared with each other to determine the most energy efficient sintering method. Also the process of direct contacting electrical devices with ink-jet-printing is compared with the standard process wire bonding related to the consumption of material and energy.

Correlation Between the Tunnelling Oxide and I-V Curves of MIS Photodiodes

2003 ◽  
Vol 762 ◽  
Author(s):  
H. Águas ◽  
L. Pereira ◽  
A. Goullet ◽  
R. Silva ◽  
E. Fortunato ◽  
...  
Keyword(s):  
Hydrogen Peroxide ◽  
Oxide Layer ◽  
Spectroscopic Ellipsometry ◽  
Chemical Deposition ◽  
Oxide Thickness ◽  
Electrical Performance ◽  
Signal To Noise ◽  
Rectification Factor ◽  
Mis Devices ◽  
The Ideal

AbstractIn this work we present results of a study performed on MIS diodes with the following structure: substrate (glass) / Cr (2000Å) / a-Si:H n+ (400Å) / a-Si:H i (5500Å) / oxide (0-40Å) / Au (100Å) to determine the influence of the oxide passivation layer grown by different techniques on the electrical performance of MIS devices. The results achieved show that the diodes with oxides grown using hydrogen peroxide present higher rectification factor (2×106)and signal to noise (S/N) ratio (1×107 at -1V) than the diodes with oxides obtained by the evaporation of SiO2, or by the chemical deposition of SiO2 by plasma of HMDSO (hexamethyldisiloxane), but in the case of deposited oxides, the breakdown voltage is higher, 30V instead of 3-10 V for grown oxides. The ideal oxide thickness, determined by spectroscopic ellipsometry, is dependent on the method used to grow the oxide layer and is in the range between 6 and 20 Å. The reason for this variation is related to the degree of compactation of the oxide produced, which is not relevant for applications of the diodes in the range of ± 1V, but is relevant when high breakdown voltages are required.

scholarly journals Heat Scanning for the Fabrication of Conductive Fibers

Polymers ◽  
2021 ◽  
Vol 13 (9) ◽  
pp. 1405
Author(s):  
Jina Jang ◽  
Haoyu Zhou ◽  
Jungbae Lee ◽  
Hakgae Kim ◽  
Jung Bin In
Keyword(s):  
Silver Nanowires ◽  
Building Blocks ◽  
Dip Coating ◽  
Coating Materials ◽  
Scanning Time ◽  
Silver Ink ◽  
Nylon Fiber ◽  
Coating Method ◽  
Conductive Fibers ◽  
Tubular Heater

Conductive fibers are essential building blocks for implementing various functionalities in a textile platform that is highly conformable to mechanical deformation. In this study, two major techniques were developed to fabricate silver-deposited conductive fibers. First, a droplet-coating method was adopted to coat a nylon fiber with silver nanoparticles (AgNPs) and silver nanowires (AgNWs). While conventional dip coating uses a large ink pool and thus wastes coating materials, droplet-coating uses minimal quantities of silver ink by translating a small ink droplet along the nylon fiber. Secondly, the silver-deposited fiber was annealed by similarly translating a tubular heater along the fiber to induce sintering of the AgNPs and AgNWs. This heat-scanning motion avoids excessive heating and subsequent thermal damage to the nylon fiber. The effects of heat-scanning time and heater power on the fiber conductance were systematically investigated. A conductive fiber with a resistance as low as ~2.8 Ω/cm (0.25 Ω/sq) can be produced. Finally, it was demonstrated that the conductive fibers can be applied in force sensors and flexible interconnectors.

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