Reconstruction of depth profiles of thermal conductivity of case hardened steels using a three-dimensional photothermal technique

2008 ◽  
Vol 104 (11) ◽  
pp. 113518 ◽  
Author(s):  
Hong Qu ◽  
Chinhua Wang ◽  
XinXin Guo ◽  
Andreas Mandelis
Keyword(s):  
Thermal Conductivity ◽  
Three Dimensional ◽  
Hardened Steels ◽  
Photothermal Technique ◽  
Depth Profiles

Structure and Thermoelectric Properties of New Quaternary Tin and Lead Bismuth Selenides, K1+xM4-2xBi7+xSe15 (M = Sn, Pb) and K1+xSn5-xBi11+xSe22

2000 ◽  
Vol 626 ◽  
Author(s):  
Antje Mrotzek ◽  
Kyoung-Shin Choi ◽  
Duck-Young Chung ◽  
Melissa A. Lane ◽  
John R. Ireland ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Single Crystal ◽  
Thermoelectric Properties ◽  
Three Dimensional ◽  
Structure Type ◽  
Narrow Gap ◽  
Low Thermal Conductivity ◽  
Seebeck Coefficients ◽  
Metal Atoms ◽  
Anionic Framework

ABSTRACTWe present the structure and thermoelectric properties of the new quaternary selenides K1+xM4–2xBi7+xSe15 (M = Sn, Pb) and K1-xSn5-xBi11+xSe22. The compounds K1+xM4-2xBi7+xSe15 (M= Sn, Pb) crystallize isostructural to A1+xPb4-2xSb7+xSe15 with A = K, Rb, while K1-xSn5-xBi11+xSe22 reveals a new structure type. In both structure types fragments of the Bi2Te3-type and the NaCl-type are connected to a three-dimensional anionic framework with K+ ions filled tunnels. The two structures vary by the size of the NaCl-type rods and are closely related to β-K2Bi8Se13 and K2.5Bi8.5Se14. The thermoelectric properties of K1+xM4-2xBi7+xSe15 (M = Sn, Pb) and K1-xSn5-xBi11+xSe22 were explored on single crystal and ingot samples. These compounds are narrow gap semiconductors and show n-type behavior with moderate Seebeck coefficients. They have very low thermal conductivity due to an extensive disorder of the metal atoms and possible “rattling” K+ ions.

Preparation, microstructure and properties of three-dimensional carbon/carbon composites with high thermal conductivity

Carbon ◽  
2021 ◽  
Vol 174 ◽  
pp. 758-759
Author(s):  
Bao-liu Li ◽  
Jian-guang Guo ◽  
Bing Xu ◽  
Hui-tao Xu ◽  
Zhi-jun Dong ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Three Dimensional ◽  
High Thermal Conductivity ◽  
Carbon Composites ◽  
Microstructure And Properties

scholarly journals Numerical simulation of variable thermal conductivity on 3D flow of nanofluid over a stretching sheet

2020 ◽  
Vol 9 (1) ◽  
pp. 233-243 ◽  
Author(s):  
Nainaru Tarakaramu ◽  
P.V. Satya Narayana ◽  
Bhumarapu Venkateswarlu
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Stretching Sheet ◽  
Three Dimensional ◽  
Variable Thermal Conductivity ◽  
Normal Velocity ◽  
Transfer Coefficients ◽  
Similarity Transformations ◽  
Frictional Coefficients ◽  
The Impact

AbstractThe present investigation deals with the steady three-dimensional flow and heat transfer of nanofluids due to stretching sheet in the presence of magnetic field and heat source. Three types of water based nanoparticles namely, copper (Cu), aluminium oxide (Al2O3), and titanium dioxide (TiO2) are considered in this study. The temperature dependent variable thermal conductivity and thermal radiation has been introduced in the energy equation. Using suitable similarity transformations the dimensional non-linear expressions are converted into dimensionless system and are then solved numerically by Runge-Kutta-Fehlberg scheme along with well-known shooting technique. The impact of various flow parameters on axial and transverse velocities, temperature, surface frictional coefficients and rate of heat transfer coefficients are visualized both in qualitative and quantitative manners in the vicinity of stretching sheet. The results reviled that the temperature and velocity of the fluid rise with increasing values of variable thermal conductivity parameter. Also, the temperature and normal velocity of the fluid in case of Cu-water nanoparticles is more than that of Al2O3- water nanofluid. On the other hand, the axial velocity of the fluid in case of Al2O3- water nanofluid is more than that of TiO2nanoparticles. In addition, the current outcomes are matched with the previously published consequences and initiate to be a good contract as a limiting sense.

scholarly journals Advances in Liquid Crystalline Epoxy Resins for High Thermal Conductivity

Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1302
Author(s):  
Younggi Hong ◽  
Munju Goh
Keyword(s):  
Thermal Conductivity ◽  
Network Structure ◽  
Epoxy Resins ◽  
Liquid Crystalline ◽  
Random Network ◽  
Three Dimensional ◽  
Heat Insulator ◽  
Liquid Crystalline Epoxy ◽  
Thermally Conductive ◽  
Substantial Interest

Epoxy resin (EP) is one of the most famous thermoset materials. In general, because EP has a three-dimensional random network, it possesses thermal properties similar to those of a typical heat insulator. Recently, there has been substantial interest in controlling the network structure of EP to create new functionalities. Indeed, the modified EP, represented as liquid crystalline epoxy (LCE), is considered promising for producing novel functionalities, which cannot be obtained from conventional EPs, by replacing the random network structure with an oriented one. In this paper, we review the current progress in the field of LCEs and their application to highly thermally conductive composite materials.

Thermal Design of Highly-Efficient Thermoelectric Materials With Atomic-Scale Three-Dimensional Phononic Crystals

2007 ◽  
Author(s):  
Jean-Numa Gillet ◽  
Yann Chalopin ◽  
Sebastian Volz
Keyword(s):  
Thermal Conductivity ◽  
Bulk Material ◽  
Phononic Crystal ◽  
Three Dimensional ◽  
Mean Free Path ◽  
Dispersion Curves ◽  
Phononic Crystals ◽  
Thermal Design ◽  
Atomic Scale ◽  
Thermal Insulating

Owing to their thermal insulating properties, superlattices have been extensively studied. A breakthrough in the performance of thermoelectric devices was achieved by using superlattice materials. The problem of those nanostructured materials is that they mainly affect heat transfer in only one direction. In this paper, the concept of canceling heat conduction in the three spatial directions by using atomic-scale three-dimensional (3D) phononic crystals is explored. A period of our atomic-scale 3D phononic crystal is made up of a large number of diamond-like cells of silicon atoms, which form a square supercell. At the center of each supercell, we substitute a smaller number of Si diamond-like cells by other diamond-like cells, which are composed of germanium atoms. This elementary heterostructure is periodically repeated to form a Si/Ge 3D nanostructure. To obtain different atomic configurations of the phononic crystal, the number of Ge diamond-like cells at the center of each supercell can be varied by substitution of Si diamond-like cells. The dispersion curves of those atomic configurations can be computed by lattice dynamics. With a general equation, the thermal conductivity of our atomic-scale 3D phononic crystal can be derived from the dispersion curves. The thermal conductivity can be reduced by at least one order of magnitude in an atomic-scale 3D phononic crystal compared to a bulk material. This reduction is due to the decrease of the phonon group velocities without taking into account that of the phonon average mean free path.

High Through-thickness Thermal Conductivity Composites Based on Three-Dimensional Woven Fiber Architectures

AIAA Journal ◽  
2008 ◽  
Vol 46 (11) ◽  
pp. 2944-2954 ◽  
Author(s):  
Keith Sharp ◽  
Alexander E. Bogdanovich ◽  
Wenzhong Tang ◽  
Dirk Heider ◽  
Suresh Advani ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Three Dimensional

Constructing Three-dimensional Nano-crystalline Diamond Network within Polymer Composites for Enhanced Thermal Conductivity

Nanoscale ◽  
2021 ◽  
Author(s):  
Shaoyang Xiong ◽  
Yue Qin ◽  
Linhong Li ◽  
Guoyong Yang ◽  
Maohua Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Performance ◽  
Thermal Transport ◽  
High Performance ◽  
Rapid Development ◽  
Electronic Devices ◽  
Three Dimensional ◽  
Nano Crystalline ◽  
Enhanced Thermal Conductivity

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing thermal...

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