scholarly journals Advances in Liquid Crystalline Epoxy Resins for High Thermal Conductivity

Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1302
Author(s):  
Younggi Hong ◽  
Munju Goh
Keyword(s):  
Thermal Conductivity ◽  
Network Structure ◽  
Epoxy Resins ◽  
Liquid Crystalline ◽  
Random Network ◽  
Three Dimensional ◽  
Heat Insulator ◽  
Liquid Crystalline Epoxy ◽  
Thermally Conductive ◽  
Substantial Interest

Epoxy resin (EP) is one of the most famous thermoset materials. In general, because EP has a three-dimensional random network, it possesses thermal properties similar to those of a typical heat insulator. Recently, there has been substantial interest in controlling the network structure of EP to create new functionalities. Indeed, the modified EP, represented as liquid crystalline epoxy (LCE), is considered promising for producing novel functionalities, which cannot be obtained from conventional EPs, by replacing the random network structure with an oriented one. In this paper, we review the current progress in the field of LCEs and their application to highly thermally conductive composite materials.

Highly thermal conductive resins formed from wide-temperature-range eutectic mixtures of liquid crystalline epoxies bearing diglycidyl moieties at the side positions

2017 ◽  
Vol 8 (18) ◽  
pp. 2806-2814 ◽  
Author(s):  
Youngsu Kim ◽  
Hyeonuk Yeo ◽  
Nam-Ho You ◽  
Se Gyu Jang ◽  
Seokhoon Ahn ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Wide Temperature Range ◽  
Epoxy Resins ◽  
Liquid Crystalline ◽  
High Thermal Conductivity ◽  
Temperature Range ◽  
Eutectic Mixtures ◽  
Liquid Crystalline Epoxy ◽  
Conductive Resins

Liquid crystalline epoxy resins with a wide temperature range exhibit a high thermal conductivity of 0.4 W m−1 K−1.

Synthesis of Three Novel Aromatic Biazomethine Liquid- Crystalline Epoxy Resins and Curing Reaction with Aromatic Diamine

2011 ◽  
Vol 216 ◽  
pp. 34-38
Author(s):  
Jun Gang Gao ◽  
Xiao Na Zhang ◽  
Yong Gang Du
Keyword(s):  
Melting Point ◽  
Epoxy Resins ◽  
Liquid Crystalline ◽  
Diphenyl Ether ◽  
Hydroxyl Group ◽  
Aromatic Diamine ◽  
Curing Reaction ◽  
Ozawa Equation ◽  
Liquid Crystalline Epoxy ◽  
Clearing Temperature

Three class of novel liquid crystalline epoxy resins containing azomething groups: N,N’-Bis[4-(2,3-epoxypropoxy)benzylidene]-4,4-diamino-diphenyl ether (p-BEPBDDE), N,N’-Bis[4-(2,3-epoxypropoxy)benzylidene]-4,4-diamino-diphenyl methane (p-BEPBDDM) and N,N’-Bis[(4-(2,3-epoxypropoxy)-benzyliden)-1,4- phenylene diamine] (p-BEPBPD) were synthesized and characterized. The results show that p-BEBDDE and p-BEBDDM belong to smectic texture and melting point is 239.5 and 178 oC, respectively. The p-BEPBD is nematic texture between its melting temperature (Tm) of 192 oC and clearing temperature (Ti) of 238 oC. The curing reaction can be described by Ozawa equation, and the alcohol-hydroxyl group can accelerate the curing reaction and decrease Ea in DSC experiment.

scholarly journals Development of Thermally Conductive Polyurethane Composite by Low Filler Loading of Spherical BN/PMMA Composite Powder

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Kai-Han Su ◽  
Cherng-Yuh Su ◽  
Cheng-Ta Cho ◽  
Chung-Hsuan Lin ◽  
Guan-Fu Jhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Filler Loading ◽  
High Thermal Conductivity ◽  
Heat Diffusion ◽  
Composite Powders ◽  
Polyurethane Composite ◽  
Uniform Dispersion ◽  
Thermally Conductive

Abstract The issue of electronic heat dissipation has received much attention in recent times and has become one of the key factors in electronic components such as circuit boards. Therefore, designing of materials with good thermal conductivity is vital. In this work, a thermally conductive SBP/PU composite was prepared wherein the spherical h-BN@PMMA (SBP) composite powders were dispersed in the polyurethane (PU) matrix. The thermal conductivity of SBP was found to be significantly higher than that of the pure h-BN/PU composite at the same h-BN filler loading. The SBP/PU composite can reach a high thermal conductivity of 7.3 Wm−1 K−1 which is twice as high as that of pure h-BN/PU composite without surface treatment in the same condition. This enhancement in the property can be attributed to the uniform dispersion of SBP in the PU polymer matrix that leads to a three-dimensional continuous heat conduction thereby improving the heat diffusion of the entire composite. Hence, we provide a valuable method for preparing a 3-dimensional heat flow path in polyurethane composite, leading to a high thermal conductivity with a small amount of filler.

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