scholarly journals Magnetic permeability of (FeCoGe)88Zr6B5Cu1 alloys: Thermal stability in a wide temperature range

2008 ◽  
Vol 103 (7) ◽  
pp. 07E721 ◽  
Author(s):  
J. S. Blázquez ◽  
C. F. Conde ◽  
V. Franco ◽  
A. Conde ◽  
L. F. Kiss
2013 ◽  
Vol 113 (17) ◽  
pp. 17A310 ◽  
Author(s):  
Jia Wang ◽  
Zhi Wang ◽  
Yun-yun Jia ◽  
Rui-min Shi ◽  
Zhuan-ping Wen ◽  
...  

RSC Advances ◽  
2019 ◽  
Vol 9 (28) ◽  
pp. 16183-16186 ◽  
Author(s):  
W. Xu ◽  
S. S. Yu ◽  
H. Zhang ◽  
H. B. Duan

A MOFs compound [NH2(CH3)2]2[Zn3(bpdc)4]·3DMF (1) shows two step dielectric relaxation and its guest-free framework (1′) possesses an ultra-low κ value of 1.80 (at 100 kHz) over a wide temperature range and high thermal stability.


2020 ◽  
Vol 23 (04) ◽  
pp. 361-365
Author(s):  
M.K. Bakhadyrkhanov ◽  
◽  
B.K. Ismaylov ◽  
S.A. Tachilin ◽  
K.A. Ismailov ◽  
...  

The results of this study show that creation of clusters from impurity nickel atoms almost completely suppresses generation of thermal donors within the temperature range 450 to 1200 °C. The composition of these clusters was determined using the technique of energy dispersive X-ray spectroscopy, which revealed that the typical cluster consists of silicon atoms (65%), nickel atoms (15%) and oxygen atoms (19%). Based on the experimental results, the authors have suggested that the nickel atoms intensively perform the role of getter for oxygen atoms in the course of clusterization. It was shown that the additional doping of silicon with nickel at T = 1100…1200 °C enables to ensure a sufficiently high thermal stability of its electrical parameters within a wide temperature range.


Author(s):  
Jinpeng Li ◽  
Junhao Jiang ◽  
Qilin Cheng ◽  
Zhong-Kai Cui ◽  
Xiaoyun Liu ◽  
...  

Polymeric dielectrics with high-temperature resilience are of critical importance in developing advanced electrostatic capacitors. Poly-(p-phenylene benzobisoxazole) (PBO) is a polymer with excellent thermal stability. However, the poor processability and low...


Author(s):  
A. B. Baranov ◽  
I. N. Tsapenko ◽  
A. V. Petrogradsky ◽  
I. D. Simonov-Emelyanov ◽  
N. L. Shembel

The rheological properties of polysulfide (PPS) melts and composite materials based on them were investigated in a wide range of temperatures and concentrations of fillers of different nature. It was established that the introduction of rheological additives into dispersed and hybrid-filled composite materials allows significantly reducing the viscosity and improving the processability of the compositions. Introduction of heat-stabilizing additives into PPS allows expanding the temperature interval of processing the composite materials based on PFC from 320 to 340°С. Complete thermal stability curves for the PPS compositions in a wide temperature range were obtained.


1987 ◽  
Vol 134 (5) ◽  
pp. 291 ◽  
Author(s):  
K.T.V. Grattan ◽  
J.D. Manwell ◽  
S.M.L. Sim ◽  
C.A. Willson

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