SU4 light stop signature analysis at ATLAS

2007 ◽  
Author(s):  
Jelena Krstic ◽  
Marija Milosavljevic ◽  
Dragan Popovic
Keyword(s):  
Signature Analysis ◽  
Light Stop

Signature Analysis: Statistical Models and Their Application to FA

1996 ◽  
Author(s):  
C.K. Lakshminarayan ◽  
S. Pabbisetty ◽  
O. Adams ◽  
F. Pires ◽  
M. Thomas ◽  
...  
Keyword(s):  
Risk Assessment ◽  
Failure Analysis ◽  
Statistical Models ◽  
Essential Elements ◽  
Assessment Model ◽  
Signature Analysis ◽  
Risk Assessment Model ◽  
Sample Sizes ◽  
Reliability Engineering ◽  
Semiconductor Chips

Abstract This paper deals with the basic concepts of Signature Analysis and the application of statistical models for its implementation. It develops a scheme for computing sample sizes when the failures are random. It also introduces statistical models that comprehend correlations among failures that fail due to the same failure mechanism. The idea of correlation is important because semiconductor chips are processed in batches. Also any risk assessment model should comprehend correlations over time. The statistical models developed will provide the required sample sizes for the Failure Analysis lab to state "We are A% confident that B% of future parts will fail due to the same signature." The paper provides tables and graphs for the evaluation of such a risk assessment. The implementation of Signature Analysis will achieve the dual objective of improved customer satisfaction and reduced cycle time. This paper will also highlight it's applicability as well as the essential elements that need to be in place for it to be effective. Different examples have been illustrated of how the concept is being used by Failure Analysis Operations (FA) and Customer Quality and Reliability Engineering groups.

Signature Analysis of Package Delamination Using Scanning Acoustic Microscope

1996 ◽  
Author(s):  
S.X. Li ◽  
K. Lee ◽  
J. Hulog ◽  
R. Gannamani ◽  
S. Yin
Keyword(s):  
Failure Analysis ◽  
Early Stage ◽  
Signature Analysis ◽  
Acoustic Microscope ◽  
Reflow Soldering ◽  
Moisture Expansion ◽  
Scanning Acoustic Microscope ◽  
Package Reliability

Abstract Package delaminations are often associated with electrical and package reliability problems in IC devices. Delaminations caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns. A Scanning Acoustic Microscope (SAM) can be used to detect package delaminations. Understanding these delamination signatures can help us quickly identify the failure cause at an early stage of the failure analysis.

Mutational Signature Analysis Reveals NTHL1 Deficiency to Cause a Multi-Tumor Phenotype Including a Predisposition to Colon and Breast Cancer

2018 ◽  
Author(s):  
Judith E. Grolleman ◽  
Richarda M. de Voer ◽  
Fadwa A. Elsayed ◽  
Maartje Nielsen ◽  
Robbert D. A. Weren ◽  
...  
Keyword(s):  
Breast Cancer ◽  
Signature Analysis ◽  
Mutational Signature ◽  
Tumor Phenotype
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