Unveiling the morphology of buried In(Ga)As nanostructures by selective wet chemical etching: From quantum dots to quantum rings

2007 ◽  
Vol 90 (17) ◽  
pp. 173104 ◽  
Author(s):  
Fei Ding ◽  
Lijuan Wang ◽  
Suwit Kiravittaya ◽  
Elisabeth Müller ◽  
Armando Rastelli ◽  
...  
2012 ◽  
Vol 1468 ◽  
Author(s):  
D. Beke ◽  
Zs. Szekrényes ◽  
I. Balogh ◽  
M. Veres ◽  
É Fazakas ◽  
...  

ABSTRACTLuminescence nanocrystals or quantum dots give grate potential for bio-analysis as well as optoelectronics. Here we report an effective and non-expensive fabrication method of silicon carbide nanocrystals, with diameter below 10 nm, based on electroless wet chemical etching. Our samples show strong violet-blue emission in the 410-450 nm region depending on the used solvents and particle size. Raman and infrared measurements suggest the varied nature of surfaces of silicon carbide nanocrystals which elucidate the behavior of the silicon carbide colloid solvents and also give opportunity to modify the surface easily for specific biological, medical or other application.


2012 ◽  
Vol 28 (1) ◽  
pp. 44-49 ◽  
Author(s):  
David Beke ◽  
Zsolt Szekrényes ◽  
István Balogh ◽  
Zsolt Czigány ◽  
Katalin Kamarás ◽  
...  

Abstract


2005 ◽  
Vol 86 (6) ◽  
pp. 063111 ◽  
Author(s):  
G. Fasching ◽  
K. Unterrainer ◽  
W. Brezna ◽  
J. Smoliner ◽  
G. Strasser

Author(s):  
Dongmei Meng ◽  
Joe Rupley ◽  
Chris McMahon

Abstract This paper presents decapsulation solutions for devices bonded with Cu wire. By removing mold compound to a thin layer using a laser ablation tool, Cu wire bonded packages are decapsulated using wet chemical etching by controlling the etch time and temperature. Further, the paper investigates the possibilities of decapsulating Cu wire bonded devices using full wet chemical etches without the facilitation of laser ablation removing much of mold compound. Additional discussion on reliability concerns when evaluating Cu wirebond devices is addressed here. The lack of understanding of the reliability of Cu wire bonded packages creates a challenge to the FA engineer as they must develop techniques to help understanding the reliability issue associated with Cu wire bonding devices. More research and analysis are ongoing to develop appropriate analysis methods and techniques to support the Cu wire bonding device technology in the lab.


Small ◽  
2020 ◽  
Vol 16 (51) ◽  
pp. 2007045
Author(s):  
Mei Sun ◽  
Bocheng Yu ◽  
Mengyu Hong ◽  
Zhiwei Li ◽  
Fengjiao Lyu ◽  
...  

Author(s):  
Albert Grau-Carbonell ◽  
Sina Sadighikia ◽  
Tom A. J. Welling ◽  
Relinde J. A. van Dijk-Moes ◽  
Ramakrishna Kotni ◽  
...  

2015 ◽  
Vol 48 (36) ◽  
pp. 365303 ◽  
Author(s):  
Jingchang Sun ◽  
Ting Zhao ◽  
Zhangwei Ma ◽  
Ming Li ◽  
Cheng Chang ◽  
...  

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