Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling
Keyword(s):
Keyword(s):
2013 ◽
Vol 19
(5)
◽
pp. 1-8
◽
Keyword(s):
2017 ◽
Vol 692
◽
pp. 146-155
◽
Keyword(s):
Keyword(s):
2018 ◽
Vol 750
◽
pp. 451-464
◽
Keyword(s):