Morphology of basal plane dislocations in 4H-SiC homoepitaxial layers grown by chemical vapor deposition

2007 ◽  
Vol 101 (5) ◽  
pp. 053517 ◽  
Author(s):  
X. Zhang ◽  
S. Ha ◽  
Y. Hanlumnyang ◽  
C. H. Chou ◽  
V. Rodriguez ◽  
...  
2012 ◽  
Vol 717-720 ◽  
pp. 105-108 ◽  
Author(s):  
Wan Shun Zhao ◽  
Guo Sheng Sun ◽  
Hai Lei Wu ◽  
Guo Guo Yan ◽  
Liu Zheng ◽  
...  

A vertical 3×2〞low pressure chemical vapor deposition (LPCVD) system has been developed to realize fast epitaxial growth of 4H-SiC. The epitaxial growth process was optimized and it was found that the growth rate increases with increasing C/Si ratio and tends to saturate when C/Si ratio exceeded 1. Mirror-like thick 4H-SiC homoepitaxial layers are obtained at 1500 °C and C/Si ratio of 0.5 with a growth rate of 25 μm/h. The minimum RMS roughness is 0.20 nm and the FWHM of rocking curves of epilayers grown for 1 hour and 2 hours are 26.2 arcsec and 32.4 arcsec, respectively. These results indicate that high-quality thick 4H-SiC epilayers can be grown successfully on the off-orientation 4H-SiC substrates.


2017 ◽  
Vol 897 ◽  
pp. 55-58 ◽  
Author(s):  
Naoto Ishibashi ◽  
Keisuke Fukada ◽  
Akira Bandoh ◽  
Kenji Momose ◽  
Hiroshi Osawa

This paper presents a high-quality 100/150 mm p-type 4H-SiC epitaxial wafer prepared by chemical vapor deposition; this wafer is suitable for high-voltage bipolar device applications. The density of killer defects for bipolar devices including downfalls, triangular-shaped defects, and basal plane dislocations (BPDs), is less than 0.1 cm-2 in the proposed 100 mm n/p multilayer epitaxial wafer. The in-plane thickness and doping uniformity of the 150 mm p-layer is 3.0% and 11.0%, respectively. The doping concentration of the p-layer can be controlled in the 1E+16 cm-3 to 1E+19 cm-3 range.


2019 ◽  
Vol 954 ◽  
pp. 114-120
Author(s):  
Ying Xi Niu ◽  
Xiao Yan Tang ◽  
Li Xin Tian ◽  
Liu Zheng ◽  
Wen Ting Zhang ◽  
...  

70-um thick homoepitaxial layers with very low defect density were grown on 6-inch 4° off-axis wafers using hot-wall chemical vapor deposition (CVD). Process optimization resulted in reduction of the density of triangular defects from 1.01 cm-2 to 0.14 cm-2. The treatment of wafer (CMP or selection) was essential. The in-situ etch process was optimized prior to the epitaxial growth. Junction Barrier Schottky diodes fabricated on the epitaxial films presented a typical I–V characteristic and a block voltage of 6500 V.


2012 ◽  
Vol 717-720 ◽  
pp. 157-160
Author(s):  
Jawad ul Hassan ◽  
Louise Lilja ◽  
I.D. Booker ◽  
Peder Bergman ◽  
Erik Janzén

In this report we present homoepitaxial growth of 4H-SiC on Si-face, nominally on-axis substrates with diameters up to 76 mm in a hot-wall chemical vapor deposition reactor. A comparatively low carrier lifetime has been observed in these layers; local variations in carrier lifetime are different from standard epilayers on off-cut substrates. The properties of the layers were studied with focus on charge carrier lifetime and its correlation with starting growth conditions, inhomogeneities of surface morphology and different growth mechanisms.


2014 ◽  
Vol 778-780 ◽  
pp. 261-264 ◽  
Author(s):  
Tomasz Sledziewski ◽  
Svetlana Beljakowa ◽  
Kassem Alassaad ◽  
Pawel Kwasnicki ◽  
Roxana Arvinte ◽  
...  

We have investigated the electrical properties of n-type 4H-SiC in-situ germanium-doped homoepitaxial layers grown by chemical vapor deposition. Germanium is an isoelectronic impurity and, therefore, not expected to contribute to the conductivity. However, Hall effect measurements taken on samples with and without germanium revealed an enhanced mobility by a factor of ≈2 at T ≈ 55 K in the germanium-doped sample despite equal free electron concentration and equal compensation. Deep level transient spectroscopy (DLTS) measurements taken on germanium-doped samples reveal negative peaks indicating the presence of charged extended defects.


2016 ◽  
Vol 120 (20) ◽  
pp. 205701 ◽  
Author(s):  
T. Sledziewski ◽  
M. Vivona ◽  
K. Alassaad ◽  
P. Kwasnicki ◽  
R. Arvinte ◽  
...  

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