Spacecraft Thermal Management Using Advanced Hybrid Two-Phase Loop Technology

Author(s):  
Chanwoo Park ◽  
Aparna Vallury ◽  
Jon Zuo ◽  
Jeffrey Perez ◽  
Paul Rogers
Author(s):  
Nathan Van Velson ◽  
Srujan Rokkam ◽  
Quang Truong ◽  
Bryan Rasmussen

Two-phase cooling technologies, pumped two-phase and vapor compression systems in particular are highly desirable advanced thermal management systems due to the large amounts of heat transfer capabilities available via boiling flow, as well as the inherent isothermality of two-phase processes. However, two-phase heat exchangers face distinctive challenges such as flow boiling instabilities and critical heat flux. In this work, we make developments toward a simulation framework to provide a real-time capability for thermal modeling, simulation and control using embedded software capabilities of Matlab/Simulink. The framework utilizes a highly accurate finite control volume approach to model two-phase heat exchangers, semi-empirical map model for variable speed pump, and one dimensional fluid flow model for pipe. The framework is validated experimentally under transient heat loads against a pumped two-phase loop with two parallel evaporators at Advanced Cooling Technologies, Inc.


Author(s):  
Chanwoo Park ◽  
Aparna Vallury ◽  
Jon Zuo ◽  
Jeffrey Perez ◽  
Paul Rogers

The paper discusses an advanced Hybrid Two-Phase Loop (HTPL) technology for electronics thermal management. The HTPL combined active mechanical pumping with passive capillary pumping realizing a reliable yet high performance cooling system. The evaporator developed for the HTPL used 3-dimensional metallic wick structures to enhance boiling heat transfer by passive capillary separation of liquid and vapor phases. Through the testing using various prototype hybrid loops, it was demonstrated that the hybrid loops were capable of removing high heat fluxes from multiple heat sources with large surface areas up to 135cm2 and 10kW heat load. Because of the passive capillary phase separation, the hybrid loop operation didn’t require any active flow control of the liquid in the evaporator, even at highly transient and asymmetrical heat inputs between the evaporators. These results represent the significant advance over state-of-the-art heat pipes, loop heat pipes and evaporative spray cooling devices in terms of performance, robustness and simplicity.


2019 ◽  
Vol 141 (9) ◽  
Author(s):  
Gabriela C. Vieira ◽  
Juan Pablo Flórez M ◽  
Marcia B. H. Mantelli

This work presents experimental studies of a two-phase loop thermosyphon, designed to use the aircraft fuselage low temperatures at high altitude to promote passive thermal management of electronics components in avionics. The main purpose of this work is to develop the evaporator of a loop thermosyphon composed of one evaporator coupled to two condensers presented in the literature. The proposed evaporator comprises ten square stacked copper plates bonded by diffusion. Channels were manufactured in the inner plates so that internal grooves are obtained after the stack is bonded. Studies with concentrated and distributed heat sources over the evaporator external surface are under performance. Parameters such as start-up and operation temperatures will be compared, according to the condition submitted.


2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Yoon Jo Kim ◽  
Yogendra K. Joshi ◽  
Andrei G. Fedorov ◽  
Young-Joon Lee ◽  
Sung-Kyu Lim

It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling layer performance. The effects of cooling mode (single-phase versus phase-change) and stack/layer geometry on thermal management performance are quantitatively analyzed, and implications on the through-silicon-via scaling and electrical interconnect congestion are discussed. Also, the thermal and hydraulic performance of several two-phase refrigerants is discussed in comparison with single-phase cooling. The results show that the large internal pressure and the pumping pressure drop are significant limiting factors, along with significant mass flow rate maldistribution due to the presence of hot-spots. Nevertheless, two-phase cooling using R123 and R245ca refrigerants yields superior performance to single-phase cooling for the hot-spot fluxes approaching ∼300 W/cm2. In general, a hybrid cooling scheme with a dedicated approach to the hot-spot thermal management should greatly improve the two-phase cooling system performance and reliability by enabling a cooling-load-matched thermal design and by suppressing the mass flow rate maldistribution within the cooling layer.


2017 ◽  
Vol 18 (5) ◽  
pp. 875-882 ◽  
Author(s):  
Rahman Ataur ◽  
Mohammed Nurul Amin Hawlader ◽  
Helmi Khalid

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