Kinetic roughening of amorphous silicon during hot-wire chemical vapor deposition at low temperature

2007 ◽  
Vol 101 (2) ◽  
pp. 024915 ◽  
Author(s):  
Brent A. Sperling ◽  
John R. Abelson
Keyword(s):  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Amorphous Silicon ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Hot Wire ◽  
Kinetic Roughening

Light-Induced Increase in Two-Level Tunneling States in Hydrogenated Amorphous Silicon

1999 ◽  
Vol 557 ◽  
Author(s):  
Xiao Liu ◽  
R.O. Pohl ◽  
R.S. Crandall
Keyword(s):  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Internal Friction ◽  
Amorphous Silicon ◽  
Vapor Deposition ◽  
Room Temperature ◽  
Hydrogenated Amorphous Silicon ◽  
Chemical Vapor ◽  
Hot Wire ◽  
Hydrogenated Amorphous

AbstractWe observe an increase of the low-temperature internal friction of hydrogenated amorphous silicon prepared by both hot-wire and plasma-enhanced chemical-vapor deposition after extended light-soaking at room temperature. This increase, and the associated change in sound velocity, can be explained by an increase of the density of two-level tunneling states, which serves as a measure of the lattice disorder. The amount of increase in internal friction is remarkably similar in both types of films although the amount and the microstructure of hydrogen are very different. Experiments conducted on a sample prepared by hot-wire chemical-vapor deposition show that this change anneals out gradually at room temperature in about 70 days. Possible relation of the light-induced changes in the low-temperature elastic properties to the Staebler-Wronski effect is discussed.

Low Temperature Vibrational Properties of Amorphous Silicon

1998 ◽  
Vol 507 ◽  
Author(s):  
R. S. Crandall ◽  
E. Iwaniczko ◽  
A. H. Mahan ◽  
X. Liu ◽  
R.O. Pohl
Keyword(s):  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Internal Friction ◽  
Amorphous Silicon ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Amorphous Solids ◽  
Vibrational Properties ◽  
Deposition Method ◽  
Hot Wire

ABSTRACTWe present internal friction and shear modulus measurements of amorphous silicon (a-Si) and germanium (a-Ge) films. The temperature independent plateau in internal friction below 10 K, common to all amorphous solids, also exists in these films. However, its magnitude which depends critically on the deposition method is smaller than found for all other amorphous solids. In particular, hydrogenated a-Si with about 1 at. % H prepared by hot-wire chemical-vapor-deposition leads to an internal friction nearly three orders of magnitude smaller than observed for all other amorphous solids. The internal friction increases after the hydrogen is removed by effusion.

Deposition of amorphous silicon films by hot-wire chemical vapor deposition

1999 ◽  
Vol 85 (9) ◽  
pp. 6843-6852 ◽  
Author(s):  
K. F. Feenstra ◽  
R. E. I. Schropp ◽  
W. F. Van der Weg
Keyword(s):  
Chemical Vapor Deposition ◽  
Amorphous Silicon ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Silicon Films ◽  
Hot Wire

Hot-wire CVD a-Si:H TFT on Plastic Substrates

2006 ◽  
Vol 910 ◽  
Author(s):  
Farhad Taghibakhsh ◽  
K.S. Karim
Keyword(s):  
Thin Film ◽  
Chemical Vapor Deposition ◽  
Amorphous Silicon ◽  
Vapor Deposition ◽  
Thin Film Transistors ◽  
Gate Dielectric ◽  
Chemical Vapor ◽  
Plastic Substrate ◽  
Hot Wire ◽  
Low Leakage

AbstractFabrication of hot-wire chemical vapor deposition (HWCVD) of amorphous silicon (a-Si) thin film transistors (TFT) on thin polyamide sheets is reported. A single graphite filament at 1500 °C was used for HWCVD and device quality amorphous silicon films were deposited with no thermal damage to plastic substrate. Top-gate staggered thin film transistors (TFTs) were fabricated at 150°C using hot-wire deposited a-Si channel, Plasma enhanced chemical vapor deposition (PECVD) silicon nitride gate dielectric, and microcrystalline n+ drain/source contacts. Low leakage current of 5×10-13 A, high switching current ratio of 1.3×107, and small sub threshold swing of 0.3 V/dec was obtained for TFTs with aspect ratio of 1300μm/100μm. The field effect mobility was extracted to be 0.34 cm2/V.s.

scholarly journals A Comparison between Thin-Film Transistors Deposited by Hot-Wire Chemical Vapor Deposition and PECVD

10.30544/128 ◽  
2015 ◽  
Vol 21 (1) ◽  
pp. 7-14
Author(s):  
Meysam Zarchi ◽  
Shahrokh Ahangarani
Keyword(s):  
Thin Film ◽  
Chemical Vapor Deposition ◽  
Amorphous Silicon ◽  
Vapor Deposition ◽  
Thin Film Transistors ◽  
Chemical Vapor ◽  
Silicon Films ◽  
Intrinsic Stress ◽  
Hot Wire ◽  
Microcrystalline Silicon

The effect of new growth techniques on the mobility and stability of amorphous silicon (a-Si:H) thin film transistors (TFTs) has been studied. It was suggested that the key parameter controlling the field-effect mobility and stability is the intrinsic stress in the a-Si:H layer. Amorphous and microcrystalline silicon films were deposited by radiofrequency plasma enhanced chemical vapor deposition (RF-PECVD) and hot-wire chemical vapor deposition (HW-CVD) at 100 ºC and 25 ºC. Structural properties of these films were measured by Raman Spectroscopy. Electronic properties were measured by dark conductivity, σd, and photoconductivity, σph. For amorphous silicon films deposited by RF-PECVD on PET, photosensitivity's of >105 were obtained at both 100 º C and 25 ºC. For amorphous silicon films deposited by HW-CVD, a photosensitivity of > 105 was obtained at 100 ºC. Microcrystalline silicon films deposited by HW-CVD at 95% hydrogen dilution show σph~ 10-4 Ω-1cm-1, while maintaining a photosensitivity of ~102 at both 100 ºC and 25 ºC. Microcrystalline silicon films with a large crystalline fraction (> 50%) can be deposited by HW-CVD all the way down to room temperature.

Low-temperature silicon homoepitaxy by hot-wire chemical vapor deposition with a Ta filament

2006 ◽  
Vol 287 (2) ◽  
pp. 414-418 ◽  
Author(s):  
Charles W. Teplin ◽  
Qi Wang ◽  
Eugene Iwaniczko ◽  
Kim M. Jones ◽  
Mowafak Al-Jassim ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Hot Wire
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