scholarly journals Irreversibility line and low-field grain-boundary pinning in electron-doped superconducting thin films

2006 ◽  
Vol 100 (12) ◽  
pp. 123903 ◽  
Author(s):  
S. Sergeenkov ◽  
A. J. C. Lanfredi ◽  
F. M. Araujo-Moreira
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Irreversibility Line ◽  
Superconducting Thin Films ◽  
Low Field ◽  
Grain Boundary Pinning

Dependence on film thickness of grain boundary low-field magnetoresistance in thin films of La0.7Ca0.3MnO3

2001 ◽  
Vol 89 (11) ◽  
pp. 6970-6972 ◽  
Author(s):  
N. K. Todd ◽  
N. D. Mathur ◽  
M. G. Blamire
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Film Thickness ◽  
Low Field

Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

1999 ◽  
Vol 562 ◽  
Author(s):  
J. M. E. Harper ◽  
C. Cabral ◽  
P. C. Andricacos ◽  
L. Gignac ◽  
I. C. Noyan ◽  
...  
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Grain Boundary ◽  
Electron Scattering ◽  
Microstructure Evolution ◽  
Room Temperature ◽  
Tensile Direction ◽  
Transient Period ◽  
Grain Boundary Pinning ◽  
Electroplated Copper

ABSTRACTWe present a model which accounts for the dramatic evolution in the microstructure of electroplated copper thin films near room temperature. Microstructure evolution occurs during a transient period of hours following deposition, and includes an increase in grain size, changes in preferred crystallographic texture, and decreases in resistivity, hardness and compressive stress. As the grain size increases from the as-deposited value of 0.05–0.1 μm up to several μm, the decreasing grain boundary contribution to electron scattering lowers the resistivity by tens of percent to near-bulk values. Concurrently, as the volume of grain boundaries decreases, the stress is shown to change in the tensile direction by tens of MPa. The as-deposited grain size is also shown to be consistent with grain boundary pinning.

Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

1999 ◽  
Vol 564 ◽  
Author(s):  
J. M. E. Harper ◽  
C. Cabral ◽  
P. C. Andricacos ◽  
L. Gignac ◽  
I. C. Noyan ◽  
...  
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Grain Boundary ◽  
Electron Scattering ◽  
Microstructure Evolution ◽  
Room Temperature ◽  
Tensile Direction ◽  
Transient Period ◽  
Grain Boundary Pinning ◽  
Electroplated Copper

AbstractWe present a model which accounts for the dramatic evolution in the microstructure of electroplated copper thin films near room temperature. Microstructure evolution occurs during a transient period of hours following deposition, and includes an increase in grain size, changes in preferred crystallographic texture, and decreases in resistivity, hardness and compressive stress. As the grain size increases from the as-deposited value of 0.05–0.1 μm up to several μm, the decreasing grain boundary contribution to electron scattering lowers the resistivity by tens of percent to near-bulk values. Concurrently, as the volume of grain boundaries decreases, the stress is shown to change in the tensile direction by tens of MPa. The as-deposited grain size is also shown to be consistent with grain boundary pinning.

scholarly journals FABRICATION OF GRAIN BOUNDARY JUNCTIONS USING NdFeAs(O,F) SUPERCONDUCTING THIN FILMS

2018 ◽  
Vol 1054 ◽  
pp. 012024 ◽  
Author(s):  
T Omura ◽  
T Matsumoto ◽  
T Hatano ◽  
K Iida ◽  
H Ikuta
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Superconducting Thin Films

scholarly journals Evidence for low-field crossover in the vortex critical velocity of type-II superconducting thin films

2010 ◽  
Vol 82 (2) ◽  
Author(s):  
G. Grimaldi ◽  
A. Leo ◽  
D. Zola ◽  
A. Nigro ◽  
S. Pace ◽  
...  
Keyword(s):  
Thin Films ◽  
Critical Velocity ◽  
Superconducting Thin Films ◽  
Type Ii ◽  
Low Field

Low field vortex dynamics of BSCCO-2223 superconducting thin films

2004 ◽  
Vol 408-410 ◽  
pp. 568-570 ◽  
Author(s):  
H. Martı́nez ◽  
A. Mariño ◽  
J.E. Rodrı́guez
Keyword(s):  
Thin Films ◽  
Vortex Dynamics ◽  
Superconducting Thin Films ◽  
Low Field
Sign in / Sign up

Export Citation Format

Share Document