a-b axis-oriented lanthanum doped Bi4Ti3O12 thin films grown on a TiO2 buffer layer

2006 ◽  
Vol 100 (8) ◽  
pp. 084106 ◽  
Author(s):  
A. Z. Simões ◽  
R. F. C. Pianno ◽  
A. Ries ◽  
J. A. Varela ◽  
E. Longo
2007 ◽  
Vol 51 (5) ◽  
pp. 1732-1735 ◽  
Author(s):  
Yeon-Keon Moon ◽  
Se-Hyun Kim ◽  
Dae-Young Moon ◽  
Woong-Sun Kim ◽  
Jong-Wan Park

2012 ◽  
Vol 407 (23) ◽  
pp. 4518-4522 ◽  
Author(s):  
Tianlin Yang ◽  
Shumei Song ◽  
Yanhui Li ◽  
Yanqing Xin ◽  
Guiqiang Du ◽  
...  

2013 ◽  
Vol 39 (5) ◽  
pp. 5795-5803 ◽  
Author(s):  
Y.C. Lin ◽  
C.Y. Hsu ◽  
S.K. Hung ◽  
D.C. Wen

2005 ◽  
Vol 81 (4) ◽  
pp. 861-864 ◽  
Author(s):  
K. Kato ◽  
K. Suzuki ◽  
K. Tanaka ◽  
D. Fu ◽  
K. Nishizawa ◽  
...  

2000 ◽  
Vol 623 ◽  
Author(s):  
Joo Dong Park ◽  
Tae Sung Oh

AbstractPt/SBT/TiO2/Si structure was proposed for metal/ferroelectric/insulator/semiconductor field effect transistor (MFIS-FET) applications. SrBi2.4 Ta2O9 (SBT) thin films of 400 nm thickness were prepared using liquid source misted chemical deposition (LSMCD) on Si(100) substrates with TiO2 buffer layers deposited by DC reactive sputtering with the thickness ranging from 5 nm to 200 nm and electrical properties of MFIS structures were investigated. Memory window and maximum capacitance of the Pt/SBT/TiO2 /Si structure increased with decreasing the thickness of TiO2 buffer layer. The Pt/SBT(400 nm)/TiO2(10 nm)/Si structure exhibited C-V hysteresis loop with the memory window of 1.6 V at ±5 V, and could be applicable for MFISFET applications.


2001 ◽  
Vol 39 (1-4) ◽  
pp. 143-150 ◽  
Author(s):  
Kwangbae Lee ◽  
Byung Roh Rhee ◽  
Chanku Lee

2012 ◽  
Vol 111 (8) ◽  
pp. 083917 ◽  
Author(s):  
M. S. Gabor ◽  
T. Petrisor ◽  
C. Tiusan ◽  
M. Hehn ◽  
B. S. Vasile ◽  
...  

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