Transient grating measurement of surface acoustic waves in thin metal films with extreme ultraviolet radiation

2006 ◽  
Vol 89 (9) ◽  
pp. 091108 ◽  
Author(s):  
R. I. Tobey ◽  
M. E. Siemens ◽  
M. M. Murnane ◽  
H. C. Kapteyn ◽  
D. H. Torchinsky ◽  
...  
Keyword(s):  
Ultraviolet Radiation ◽  
Acoustic Waves ◽  
Extreme Ultraviolet ◽  
Surface Acoustic Waves ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films ◽  
Transient Grating ◽  
Extreme Ultraviolet Radiation

scholarly journals Generation of coherent phonons by coherent extreme ultraviolet radiation in a transient grating experiment

2018 ◽  
Vol 113 (22) ◽  
pp. 221905 ◽  
Author(s):  
A. A. Maznev ◽  
F. Bencivenga ◽  
A. Cannizzo ◽  
F. Capotondi ◽  
R. Cucini ◽  
...  
Keyword(s):  
Ultraviolet Radiation ◽  
Extreme Ultraviolet ◽  
Transient Grating ◽  
Coherent Phonons ◽  
Extreme Ultraviolet Radiation

Metal Microstructures in Advanced CMOS Devices

1996 ◽  
Vol 54 ◽  
pp. 358-359
Author(s):  
L. M. Gignac ◽  
K. P. Rodbell
Keyword(s):  
Grain Boundaries ◽  
Semiconductor Device ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Metal Films ◽  
Thin Metal ◽  
Electrical Performance ◽  
Thin Metal Films ◽  
Chemical Vapor Deposited ◽  
Boundary Properties

As advanced semiconductor device features shrink, grain boundaries and interfaces become increasingly more important to the properties of thin metal films. With film thicknesses decreasing to the range of 10 nm and the corresponding features also decreasing to sub-micrometer sizes, interface and grain boundary properties become dominant. In this regime the details of the surfaces and grain boundaries dictate the interactions between film layers and the subsequent electrical properties. Therefore it is necessary to accurately characterize these materials on the proper length scale in order to first understand and then to improve the device effectiveness. In this talk we will examine the importance of microstructural characterization of thin metal films used in semiconductor devices and show how microstructure can influence the electrical performance. Specifically, we will review Co and Ti silicides for silicon contact and gate conductor applications, Ti/TiN liner films used for adhesion and diffusion barriers in chemical vapor deposited (CVD) tungsten vertical wiring (vias) and Ti/AlCu/Ti-TiN films used as planar interconnect metal lines.

Plasma-based sources of extreme ultraviolet radiation for lithography and mask inspection

2018 ◽  
Vol 189 (03) ◽  
pp. 323-334 ◽  
Author(s):  
D.B. Abramenko ◽  
P.S. Antsiferov ◽  
D.I. Astakhov ◽  
Aleksandr Yu. Vinokhodov ◽  
Il'ya Yu. Vichev ◽  
...  
Keyword(s):  
Ultraviolet Radiation ◽  
Extreme Ultraviolet ◽  
Mask Inspection ◽  
Extreme Ultraviolet Radiation

scholarly journals Generation and detection of 50 GHz surface acoustic waves by extreme ultraviolet pulses

2021 ◽  
Vol 119 (4) ◽  
pp. 044102
Author(s):  
A. A. Maznev ◽  
R. Mincigrucci ◽  
F. Bencivenga ◽  
V. Unikandanunni ◽  
F. Capotondi ◽  
...  
Keyword(s):  
Acoustic Waves ◽  
Extreme Ultraviolet ◽  
Surface Acoustic Waves
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