Characterization of Vacancy Defects in Electroplated Cu Films by Positron Annihilation and its Impact on Stress Migration Reliability
1986 ◽
Vol 10-12
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pp. 265-270
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2008 ◽
Vol 88
(6)
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pp. 959-976
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1992 ◽
Keyword(s):
2010 ◽
Vol 43
(32)
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pp. 325401
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Keyword(s):