scholarly journals Thermal stability of sputter-deposited 330 austenitic stainless-steel thin films with nanoscale growth twins

2005 ◽  
Vol 87 (23) ◽  
pp. 233116 ◽  
Author(s):  
X. Zhang ◽  
A. Misra ◽  
H. Wang ◽  
J. G. Swadener ◽  
A. L. Lima ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Stainless Steel ◽  
Austenitic Stainless Steel ◽  
Sputter Deposited ◽  
Thermal Stability Of

Critical factors that determine face-centered cubic to body-centered cubic phase transformation in sputter-deposited austenitic stainless steel films

2004 ◽  
Vol 19 (6) ◽  
pp. 1696-1702 ◽  
Author(s):  
X. Zhang ◽  
A. Misra ◽  
R.K. Schulze ◽  
C.J. Wetteland ◽  
H. Wang ◽  
...  
Keyword(s):  
Thin Films ◽  
Stainless Steel ◽  
Austenitic Stainless Steel ◽  
Phase Stability ◽  
Cubic Phase ◽  
Face Centered Cubic ◽  
Body Centered Cubic ◽  
Bcc Structure ◽  
Face Centered ◽  
Sputter Deposited

Bulk austenitic stainless steels (SS) have a face-centered cubic (fcc) structure. However, sputter deposited films synthesized using austenitic stainless steel targets usually exhibit body-centered cubic (bcc) structure or a mixture of fcc and bcc phases. This paper presents studies on the effect of processing parameters on the phase stability of 304 and 330 SS thin films. The 304 SS thin films with in-plane, biaxial residual stresses in the range of approximately 1 GPa (tensile) to approximately 300 MPa (compressive) exhibited only bcc structure. The retention of bcc 304 SS after high-temperature annealing followed by slow furnace cooling indicates depletion of Ni in as-sputtered 304 SS films. The 330 SS films sputtered at room temperature possess pure fcc phase. The Ni content and the substrate temperature during deposition are crucial factors in determining the phase stability in sputter deposited austenitic SS films.

Thermal stability of immiscible sputter-deposited Cu-Mo thin films

2019 ◽  
Vol 783 ◽  
pp. 208-218 ◽  
Author(s):  
Imane Souli ◽  
Georg C. Gruber ◽  
Velislava L. Terziyska ◽  
Johannes Zechner ◽  
Christian Mitterer
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Sputter Deposited ◽  
Thermal Stability Of

scholarly journals Thermal stability of low-temperature-carburized austenitic stainless steel

2017 ◽  
Vol 128 ◽  
pp. 235-240 ◽  
Author(s):  
Jun Wang ◽  
Zhen Li ◽  
Danqi Wang ◽  
Shaoyu Qiu ◽  
Frank Ernst
Keyword(s):  
Thermal Stability ◽  
Stainless Steel ◽  
Austenitic Stainless Steel ◽  
Low Temperature ◽  
Thermal Stability Of

Thermal stability of sputter-deposited ZnO thin films

1995 ◽  
Vol 24 (2) ◽  
pp. 83-86 ◽  
Author(s):  
Y. Song ◽  
E. S. Kim ◽  
A. Kapila
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Zno Thin Films ◽  
Sputter Deposited ◽  
Thermal Stability Of

Thermal Stability of Amorphous Ni-Nb Thin Films for Use as Diffusion Barriers

1987 ◽  
Vol 108 ◽  
Author(s):  
S. N. Farrens ◽  
J. H. Perepezko ◽  
B. L. Doyle ◽  
S. R. Lee
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
X Ray Diffraction ◽  
Free Standing ◽  
X Ray ◽  
Amorphous Thin Films ◽  
Si Substrates ◽  
Sputter Deposited ◽  
Film Substrate ◽  
Thermal Stability Of

ABSTRACTThe interdiffusion and crystallization reactions between amorphous Ni-Nb alloy films and Si substrates and several overlayer metals have been monitored by x-ray diffraction and high resolution Rutherford backscattering spectroscopy. Free standing amorphous thin films of Ni-Nb alloys crystallize in one hour at temperatures between 600–625 °C and show little dependence of the crystallization temperature, Tx, on composition over the range from 30–80 at.% Ni. However, in films that are sputter deposited onto Si substrates Tx tends to increase with increasing Nb composition. Ni60Nb40 samples without overlayers crystallize at 650–700 °C. Enhancement of the thermal stability to 700–750 °C is achieved with a Nb overlayer. In contrast, a Ni overlayer can reduce Tx to 450 °C. At the film/substrate interface silicide formation reactions with Ni from the film contribute to a destabilization of the amorphous alloy. The modification of Tx with Ni, Nb, and other overlayers appears to be related to changes in the reaction kinetics associated with penetration of the overlayer into the film.

Thermal stability of expanded austenite formed on a DC plasma nitrided 316L austenitic stainless steel

2017 ◽  
Vol 644 ◽  
pp. 156-165 ◽  
Author(s):  
André Paulo Tschiptschin ◽  
Arthur Seiji Nishikawa ◽  
Luis Bernardo Varela ◽  
Carlos Eduardo Pinedo
Keyword(s):  
Thermal Stability ◽  
Stainless Steel ◽  
Austenitic Stainless Steel ◽  
Dc Plasma ◽  
316L Austenitic Stainless Steel ◽  
Expanded Austenite ◽  
Thermal Stability Of

Calorimetric Investigation of Thermal Stability of 304H Cu (Fe-17.7Cr-9.3Ni-2.95Cu-0.91Mn-0.58Nb-0.24Si-0.1C-0.12N-Wt Pct) Austenitic Stainless Steel

2016 ◽  
Vol 3 (4) ◽  
pp. 234-249 ◽  
Author(s):  
Haraprasanna Tripathy ◽  
Raju Subramanian ◽  
Raj Narayan Hajra ◽  
Arun Kumar Rai ◽  
Mythili Rengachari ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Stainless Steel ◽  
Austenitic Stainless Steel ◽  
Calorimetric Investigation ◽  
Thermal Stability Of
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