Electrical resistance of island-containing thin metal interconnects on polymer substrates under high strain

2005 ◽  
Vol 98 (8) ◽  
pp. 086107 ◽  
Author(s):  
D. P. Wang ◽  
Frederick Y. Biga ◽  
A. Zaslavsky ◽  
Gregory P. Crawford
Keyword(s):  
Electrical Resistance ◽  
High Strain ◽  
Thin Metal ◽  
Polymer Substrates ◽  
Metal Interconnects

Non-specular scattering of carriers from surface defects in thin metal interconnects

2020 ◽  
Vol 128 (18) ◽  
pp. 185103
Author(s):  
Aniruddha Konar ◽  
Prashant P. Shinde ◽  
Shanthi Pandian ◽  
Shashishekar P. Adiga ◽  
K. Subramanya Mayya ◽  
...  
Keyword(s):  
Surface Defects ◽  
Thin Metal ◽  
Specular Scattering ◽  
Metal Interconnects

scholarly journals FIB TEM Cross-Section Sample Preparation of Thin Metal Films Deposited on Polymer Substrates

2011 ◽  
Vol 17 (S2) ◽  
pp. 638-639 ◽  
Author(s):  
F Rivera ◽  
J Abbott ◽  
R Davis ◽  
R Vanfleet
Keyword(s):  
Sample Preparation ◽  
Cross Section ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films ◽  
Polymer Substrates ◽  
Section Sample

Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.

Monte-Carlo Calculations of the Electrical Resistance of Ultra-Thin Metal Films

1985 ◽  
Vol 40 (2) ◽  
pp. 161-163 ◽  
Author(s):  
H.-U. Finzel ◽  
P. Wißmann
Keyword(s):  
Monte Carlo ◽  
Network Analysis ◽  
Electrical Resistance ◽  
Deposition Process ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films ◽  
Monte Carlo Calculations ◽  
Random Generator ◽  
Shape And Size

The thickness dependence of the electrical resistance of ultra-thin metal films is calculated under the assumption that atoms or clusters of equal shape and size impinge and stick upon the substrate with statistical equipartition. The deposition process is simulated with the aid of a random generator. By network analysis an initially strong and then weaker decrease of the resistance with increasing film thickness is found.

Notizen: The Temperature Coefficient of the Resistance of Ultra-Thin Metal Films from Computer Simulations

1985 ◽  
Vol 40 (10) ◽  
pp. 1066-1068 ◽  
Author(s):  
H.-U. Finzel ◽  
P. Wißmann
Keyword(s):  
Monte Carlo ◽  
Temperature Coefficient ◽  
Computer Simulations ◽  
Electrical Resistance ◽  
Metal Films ◽  
Absolute Temperature ◽  
Thin Metal ◽  
Strong Increase ◽  
Thin Metal Films ◽  
Monte Carlo Calculations

The thickness dependence of the absolute temperature coefficient of the resistance of ultra-thin metal films is calculated with the help of Monte-Carlo calculations already successfully applied to the simulation of the electrical resistance. An initially strong increase and then a weaker decrease of the ATCR with increasing thickness is found.

Effect of Crack Formation under Elongation in Carbon Nanotube Networks Embedded in Polyurethane

2014 ◽  
Vol 605 ◽  
pp. 231-234
Author(s):  
Petr Slobodian ◽  
Pavel Riha ◽  
Ruhan Benlikaya ◽  
Robert Olejnik
Keyword(s):  
Carbon Nanotubes ◽  
Electrical Resistance ◽  
Structural Changes ◽  
Crack Formation ◽  
High Strain ◽  
Tensile Deformation ◽  
Strain Sensing ◽  
Resistance Change ◽  
Electrically Conductive ◽  
Carbon Nanotube Networks

A highly deformable composite composed of a network of electrically-conductive entangled carbon nanotubes embedded in elastic polyurethane for sensing tensile deformation by changes in strain has been prepared. The testing has shown that the composite can be extended as by much as 400 % during which the electrical resistance increases more than 270 times. The high strain sensing can be attributed to the network cracking upon extension. To understand the cracking mechanism and explain the resistance change, the structural changes of networks made of pristine carbon nanotubes (as well as functionalized multi-walled) were examined. The microscopic observation of crack formation and resistance change of the networks correlates well with the amount of cracking.

scholarly journals In-Situ Electrical Resistance and Microstructure for Ultra-Thin Metal Film Coated by Magnetron Sputtering

2011 ◽  
Vol 21 (3) ◽  
pp. 174-179
Author(s):  
Na-Hyun Kwon ◽  
Hoi-Bong Kim ◽  
Bin Hwang ◽  
Dong-Su Bae ◽  
Young-Rae Cho
Keyword(s):  
Magnetron Sputtering ◽  
Electrical Resistance ◽  
Metal Film ◽  
Thin Metal Film ◽  
Thin Metal
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