scholarly journals The low-temperature a-SiNx films with high impermeability and high optical gap with application to organic light-emitting diode

2005 ◽  
Vol 98 (8) ◽  
pp. 084501 ◽  
Author(s):  
Hsu-Yu Chang ◽  
Chao-Yu Meng ◽  
Ching-Wei Huang ◽  
Si-Chen Lee
2011 ◽  
Vol 1287 ◽  
Author(s):  
Michael A. Marrs ◽  
Sameer M. Venugopal ◽  
Curtis D. Moyer ◽  
Edward J. Bawolek ◽  
Dirk Bottesch ◽  
...  

ABSTRACTA low temperature amorphous zinc indium oxide (ZIO) thin film transistor (TFT) backplane technology for high information content flexible organic light emitting diode (OLED) displays has been developed. We have fabricated 4.1-in. diagonal OLED backplanes on the Flexible Display Center’s six-inch wafer-scale pilot line using ZIO as the active layer. The ZIO based TFTs exhibited an effective saturation mobility of 18.6 cm2/V-s and a threshold voltage shift of 2.2 Volts or less under positive and negative gate bias DC stress for 10000 seconds. We report on the critical steps in the evolution of the backplane process: the qualification of the low temperature (200°C) ZIO process, the stability of the devices under forward and reverse bias stress, the transfer of the process to flexible plastic substrates, and the fabrication of white organic light emitting diode (OLED) displays.


2004 ◽  
Vol 814 ◽  
Author(s):  
Kalluri R. Sarma

AbstractActive matrix organic light emitting diode (AM OLED) display fabricated on a flexible plastic substrates has a potential for being lower cost, lighter weight, lower power and highly rugged with superior image quality, compared to the current glass substrate based AM LCDs. Amorphous silicon (a-Si) technology offers the potential for fabricating the required active matrix backplanes on low temperature (< 150°C) plastic substrates for producing flexible AM OLED displays. We have developed low-temperature a-Si TFT processes, and backplane electronics designs to fabricate and successfully demonstrate AM OLEDs using 4”-size flexible plastic substrates. Flexible AM OLED test displays with sizes up to 2×2-inch and resolutions up to 80 cgpi equivalent have been designed and fabricated. The required enabling technologies and fabrication and evaluation of these displays are discussed.


PIERS Online ◽  
2007 ◽  
Vol 3 (6) ◽  
pp. 821-824 ◽  
Author(s):  
Chien-Chang Tseng ◽  
Liang-Wen Ji ◽  
Yu Sheng Tsai ◽  
Fuh-Shyang Juang

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