Thermal analysis of flip-chip packaged 280 nm nitride-based deep ultraviolet light-emitting diodes
2017 ◽
Vol 51
(3)
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pp. 035103
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2021 ◽
Vol 16
(4)
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pp. 591-596
2020 ◽
Vol 13
(10)
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pp. 102005
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2010 ◽
Vol 4
(1-2)
◽
pp. 49-51
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