Plasma channel charging by an intense short pulse laser and ion Coulomb explosion

2005 ◽  
Vol 12 (4) ◽  
pp. 043106 ◽  
Author(s):  
V. K. Tripathi ◽  
T. Taguchi ◽  
C. S. Liu
Keyword(s):  
Pulse Laser ◽  
Plasma Channel ◽  
Short Pulse ◽  
Coulomb Explosion ◽  
Short Pulse Laser

Plasma channel formation by short pulse laser

1996 ◽  
Vol 3 (4) ◽  
pp. 1356-1359 ◽  
Author(s):  
R. Annou ◽  
V. K. Tripathi ◽  
M. P. Srivastava
Keyword(s):  
Pulse Laser ◽  
Plasma Channel ◽  
Short Pulse ◽  
Channel Formation ◽  
Short Pulse Laser

Allowable propagation of short pulse laser beam in a plasma channel and electromagnetic solitary waves

2011 ◽  
Vol 375 (45) ◽  
pp. 4022-4028 ◽  
Author(s):  
Shan Zhang ◽  
Xue-Ren Hong ◽  
Hong-Yu Wang ◽  
Bai-Song Xie
Keyword(s):  
Laser Beam ◽  
Pulse Laser ◽  
Solitary Waves ◽  
Plasma Channel ◽  
Short Pulse ◽  
Pulse Laser Beam ◽  
Short Pulse Laser

Plasma Channel Formation and Guiding during High Intensity Short Pulse Laser Plasma Experiments

1997 ◽  
Vol 78 (21) ◽  
pp. 4047-4050 ◽  
Author(s):  
K. Krushelnick ◽  
A. Ting ◽  
C. I. Moore ◽  
H. R. Burris ◽  
E. Esarey ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Laser Plasma ◽  
High Intensity ◽  
Plasma Channel ◽  
Short Pulse ◽  
Channel Formation ◽  
Short Pulse Laser

scholarly journals The measurement and analysis of the prolonged lifetime of the plasma channel formed by short pulse laser in air

2005 ◽  
Vol 54 (7) ◽  
pp. 3247
Author(s):  
Dong Quan-Li ◽  
Yan Fei ◽  
Zhang Jie ◽  
Jin Zhan ◽  
Yang Hui ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Plasma Channel ◽  
Short Pulse ◽  
Short Pulse Laser ◽  
Measurement And Analysis

Silicon Thinning using Ultra-Short Pulse Laser Ablation

2004 ◽  
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Sample Preparation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Short Pulse ◽  
Special Care ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

Chromium oxide dissolution in steels via short pulse laser processing

2013 ◽  
Vol 115 (4) ◽  
pp. 1469-1477 ◽  
Author(s):  
Evgeny Kharanzhevskiy ◽  
Sergey Reshetnikov
Keyword(s):  
Pulse Laser ◽  
Chromium Oxide ◽  
Laser Processing ◽  
Short Pulse ◽  
Oxide Dissolution ◽  
Short Pulse Laser
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