Study of Electromigration Induced Void Nucleation, Growth, and Movement in Cu Interconnects

2004 ◽  
Author(s):  
A. V. Vairagar
Keyword(s):  
Void Nucleation ◽  
Cu Interconnects ◽  
Nucleation Growth

scholarly journals The Modified Void Nucleation and Growth Model (MNAG) for Damage Evolution in BCC Ta

2021 ◽  
Vol 11 (8) ◽  
pp. 3378
Author(s):  
Jie Chen ◽  
Darby J. Luscher ◽  
Saryu J. Fensin
Keyword(s):  
Growth Model ◽  
Damage Evolution ◽  
Volume Fraction ◽  
Void Nucleation ◽  
Nucleation And Growth ◽  
Void Coalescence ◽  
Hydrodynamic Simulations ◽  
Void Evolution ◽  
Void Nucleation And Growth ◽  
Nucleation Growth

A void coalescence term was proposed as an addition to the original void nucleation and growth (NAG) model to accurately describe void evolution under dynamic loading. The new model, termed as modified void nucleation and growth model (MNAG model), incorporated analytic equations to explicitly account for the evolution of the void number density and the void volume fraction (damage) during void nucleation, growth, as well as the coalescence stage. The parameters in the MNAG model were fitted to molecular dynamics (MD) shock data for single-crystal and nanocrystalline Ta, and the corresponding nucleation, growth, and coalescence rates were extracted. The results suggested that void nucleation, growth, and coalescence rates were dependent on the orientation as well as grain size. Compared to other models, such as NAG, Cocks–Ashby, Tepla, and Tonks, which were only able to reproduce early or later stage damage evolution, the MNAG model was able to reproduce all stages associated with nucleation, growth, and coalescence. The MNAG model could provide the basis for hydrodynamic simulations to improve the fidelity of the damage nucleation and evolution in 3-D microstructures.

scholarly journals Void Nucleation, Growth, and Coalescence Observed by Synchrotron Radiation X-ray Laminography during Tensile Deformation of Fe–0.02 mass% N Alloy

2018 ◽  
Vol 58 (5) ◽  
pp. 943-951 ◽  
Author(s):  
Osamu Furukimi ◽  
Shun Harada ◽  
Yasutaka Mugita ◽  
Masatoshi Aramaki ◽  
Masayuki Yamamoto ◽  
...  
Keyword(s):  
Synchrotron Radiation ◽  
Tensile Deformation ◽  
Void Nucleation ◽  
X Ray ◽  
Nucleation Growth

Study of electromigration void nucleation time in Cu interconnects with doping elements

2013 ◽  
Vol 107 ◽  
pp. 145-150 ◽  
Author(s):  
Lucile Arnaud ◽  
P. Lamontagne ◽  
F. Bana ◽  
Y. Le Friec ◽  
P. Waltz
Keyword(s):  
Void Nucleation ◽  
Nucleation Time ◽  
Cu Interconnects

scholarly journals Evaluation of void nucleation, growth, and coalescence parameters for HCP-Zr at extreme strain rates

AIP Advances ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 015343
Author(s):  
Wengang Zhou ◽  
Wenjun Chen ◽  
Jiajun Yuan
Keyword(s):  
Void Nucleation ◽  
Strain Rates ◽  
Nucleation Growth

Analysis of Spherical Void Growth and Coalescence in Metal Plastic Straining Process

2005 ◽  
Vol 297-300 ◽  
pp. 2837-2842
Author(s):  
Cong Hoa Vu ◽  
Do Won Seo ◽  
Jae Kyoo Lim
Keyword(s):  
Ductile Fracture ◽  
Void Nucleation ◽  
Element Model ◽  
Spherical Void ◽  
Finite Matrix ◽  
Yield Functions ◽  
Strain Relationship ◽  
Void Growth And Coalescence ◽  
Hardening Coefficient ◽  
Nucleation Growth

Ductile fracture occurs due to micro-void nucleation, growth and finally coalescence into micro-crack. In this study a new ductile fracture condition that based on the microscopic phenomena of void nucleation, growth and coalescence was proposed. Using this condition and combining with finite element model to predict the fracture locations in bulk metal forming. The macroscopic behavior of the material is described according to the flow rules of Levy-Mises. An idealized spherical void within an finite matrix is assumed. The void volume is calculated by taking the increasing volume of the continuum, caused by plastic straining, incorporated in the yield functions. In the model there includes the strain-hardening coefficient of the Ludwik-Holomom stress-strain relationship and concentration of stress. The accumulated damage value is a phenomenon in this model. The results show that it is in close accordance with observations of some experimental specimens. However, in order to obtaining the high trustiness many experiments have to be carried out.

Void evolution and its dependence on segment length in Cu interconnects

2004 ◽  
Vol 19 (11) ◽  
pp. 3135-3138 ◽  
Author(s):  
R. Leon ◽  
J.A. Colon ◽  
K.C. Evans ◽  
D.T. Vu ◽  
V. Blaschke ◽  
...  
Keyword(s):  
Void Nucleation ◽  
Void Formation ◽  
Structural Data ◽  
Segment Length ◽  
Stress Tests ◽  
Cu Interconnects ◽  
Electrical Stress ◽  
Void Evolution ◽  
Interconnect Reliability

Void evolution during electromigration was studied by recording void nucleation, growth, and displacements at various intervals during thermal (240 °C) and electrical stress tests (2 × 106 amps/cm2) of Cu interconnects. Structural data was collected for various serially arranged line segment lengths and correlated with resistance and increases in resistance due to electromigration-induced thinning and voiding. These results allowed determination of void growth rates in Cu interconnects. Void nucleation and growth show a clear dependence on segment length. Void formation did not occur at the via/interconnect interface, which improved interconnect reliability by allowing extensive voiding before catastrophic failure.

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